MC9S08DN32AMLC vs MC9S08DV60AMLF Vergleich
Detaillierter Direktvergleich von MC9S08DN32AMLC von NXP Semiconductors und MC9S08DV60AMLF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN32AMLC | MC9S08DV60AMLF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,98 | $4,60 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 53 GPIO + 1 input-only |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | 8-channel 10-bit (per datasheet family) |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Gehäuse | 32-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Betriebstemperatur | -40 C to +125 C | -40C to +125C |
| Versorgungsspannung | [DATA_NEEDED: VDD range] | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS-Status | Compliant | ROHS3 Compliant |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire BDM |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Processor | — | HCS08 (enhanced HC08 with BGND) |
| Core Size | — | 8-bit |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 3 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| Timers | — | Multiple TPM (per datasheet family) |