MC9S08DN32AMLC vs MC9S08DV60AMLF 비교

다음의 상세 나란히 비교: MC9S08DN32AMLC 제조: NXP Semiconductors 및 MC9S08DV60AMLF 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DV60AMLF MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF ✓ 활성

사양 비교

파라미터 MC9S08DN32AMLC MC9S08DV60AMLF
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $3.98 $4.60
Core HCS08 (S08) —
Instruction Set HC08 with BGND —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) —
EEPROM Embedded —
Number of I/O 25 53 GPIO + 1 input-only
ADC 12-bit, up to 16 channels, 2.5 us conversion 8-channel 10-bit (per datasheet family)
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
패키지 32-LQFP (7x7 mm) 48-LQFP (7x7 mm)
동작 온도 -40 C to +125 C -40C to +125C
공급 전압 [DATA_NEEDED: VDD range] —
실장 유형 Surface Mount Surface Mount
Packaging Tray —
RoHS 상태 Compliant ROHS3 Compliant
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) Single-wire BDM
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — S08
Core Processor — HCS08 (enhanced HC08 with BGND)
Core Size — 8-bit
Core Speed — 40 MHz (20 MHz bus)
Program Memory Size — 60 KB (60K x 8) Flash
RAM Size — 3 KB
Supply Voltage Range — 2.7 V to 5.5 V
Communication Interfaces — MSCAN (CAN 2.0A/B), SCI/SPI, LIN master
Timers — Multiple TPM (per datasheet family)

데이터시트 & 자료

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