MC9S08DN32AMLC vs MC9S08DV60AMLF Comparaison
Comparaison détaillée côte à côte de MC9S08DN32AMLC par NXP Semiconductors et MC9S08DV60AMLF par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DN32AMLC | MC9S08DV60AMLF |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,98 | $4,60 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 53 GPIO + 1 input-only |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | 8-channel 10-bit (per datasheet family) |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Boîtier | 32-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Température de fonctionnement | -40 C to +125 C | -40C to +125C |
| Tension d'alimentation | [DATA_NEEDED: VDD range] | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Statut RoHS | Compliant | ROHS3 Compliant |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire BDM |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Processor | — | HCS08 (enhanced HC08 with BGND) |
| Core Size | — | 8-bit |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 3 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| Timers | — | Multiple TPM (per datasheet family) |