MC9S08DN32AMLC vs MC9S08DV60AMLF 对比
详细并排对比 MC9S08DN32AMLC 出自 NXP Semiconductors 和 MC9S08DV60AMLF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08DN32AMLC | MC9S08DV60AMLF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.98 | $4.60 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 53 GPIO + 1 input-only |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | 8-channel 10-bit (per datasheet family) |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| 封装 | 32-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| 工作温度 | -40 C to +125 C | -40C to +125C |
| 电源电压 | [DATA_NEEDED: VDD range] | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS 状态 | Compliant | ROHS3 Compliant |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire BDM |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Processor | — | HCS08 (enhanced HC08 with BGND) |
| Core Size | — | 8-bit |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 3 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| Timers | — | Multiple TPM (per datasheet family) |