MPC565CVR56 vs MPC563MZP56 Perbandingan
Perbandingan bersamaan detil MPC565CVR56 dari NXP Semiconductors dan MPC563MZP56 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC565CVR56 | MPC563MZP56 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Unknown | NRND |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | — |
| Suhu Kerja | -40 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Paket | 388-PBGA | 388-PBGA (27 x 27 mm) |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Tipe Mounting | Surface mount, ball-grid array | Surface Mount (BGA) |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | PowerPC MPC5xx (32-bit) |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Operating Voltage | — | 5 V (typical) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Temperature Grade | — | Standard (P) |
| Peripherals | — | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |