MPC565CVR56 vs MPC563MZP56 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC565CVR56 tarafından NXP Semiconductors ve MPC563MZP56 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | MPC565CVR56 | MPC563MZP56 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Unknown | NRND |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | — |
| İşletim Sıcaklığı | -40 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Paket | 388-PBGA | 388-PBGA (27 x 27 mm) |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Montaj Türü | Surface mount, ball-grid array | Surface Mount (BGA) |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | PowerPC MPC5xx (32-bit) |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Operating Voltage | — | 5 V (typical) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Temperature Grade | — | Standard (P) |
| Peripherals | — | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| MSL Seviyesi | — | [DATA_NEEDED: MSL rating] |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |