MPC855TZQ80D4 vs MPC860DPZQ80D4 Vergleich

Detaillierter Direktvergleich von MPC855TZQ80D4 von NXP Semiconductors und MPC860DPZQ80D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC855TZQ80D4 MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 ✗ Abgekündigt
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

Spezifikationsvergleich

Parameter MPC855TZQ80D4 MPC860DPZQ80D4
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $61,40 $13,85
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type Microprocessor Unit (MPU) —
Series PowerQUICC MPC8xx (MPC855T) —
Core Architecture Power Architecture MPC8xx, 32-bit PowerPC 603-class single core
Core Clock Frequency 80 MHz —
Communication Processor Module (CPM) Integrated RISC engine with FCC/ATM/HDLC —
Ethernet Support 10/100 Mbps Fast Ethernet MAC —
Serial Protocols ATM, HDLC, SS#7 (via CPM) —
PCMCIA Interface Yes (1 or 2 slots) —
Memory Bus Width 32-bit (external) —
Datenbusbreite 32 bit —
Process Technology 0.32 um CMOS 0.32 um CMOS
Betriebstemperatur 0 °C to +95 °C (commercial 'Z' grade) [DATA_NEEDED: operating temperature range]
Gehäuse 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) —
Montageart Surface Mount, BGA Surface Mount
RoHS-Status Not compliant (SnPb-ball BGA, pre-RoHS generation) Non-Compliant
Lead-Free No (SnPb solder balls) —
Lifecycle Discontinued — see Discontinuance PCN —
Processor Type — MPC8xx PowerQUICC, 32-bit RISC MPU
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Serial Management Controllers (SMC) — 2 channels (UART/SPI/I2C)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
Gehäuse / Bauform — 357-PBGA (25x25 mm)
Packaging — Tray
Lead Status — Contains Lead
MSL-Level — [DATA_NEEDED: MSL rating]

Datenblätter & Ressourcen

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