MPC855TZQ80D4 vs MPC860DPZQ80D4 Comparação

Comparação detalhada lado a lado de MPC855TZQ80D4 por NXP Semiconductors e MPC860DPZQ80D4 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC855TZQ80D4 MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 ✗ Fim de vida
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

Comparação de especificações

Parâmetro MPC855TZQ80D4 MPC860DPZQ80D4
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $61,40 $13,85
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type Microprocessor Unit (MPU) —
Series PowerQUICC MPC8xx (MPC855T) —
Core Architecture Power Architecture MPC8xx, 32-bit PowerPC 603-class single core
Core Clock Frequency 80 MHz —
Communication Processor Module (CPM) Integrated RISC engine with FCC/ATM/HDLC —
Ethernet Support 10/100 Mbps Fast Ethernet MAC —
Serial Protocols ATM, HDLC, SS#7 (via CPM) —
PCMCIA Interface Yes (1 or 2 slots) —
Memory Bus Width 32-bit (external) —
Largura do barramento de dados 32 bit —
Process Technology 0.32 um CMOS 0.32 um CMOS
Temperatura de operação 0 °C to +95 °C (commercial 'Z' grade) [DATA_NEEDED: operating temperature range]
Encapsulamento 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) —
Tipo de montagem Surface Mount, BGA Surface Mount
Status RoHS Not compliant (SnPb-ball BGA, pre-RoHS generation) Non-Compliant
Lead-Free No (SnPb solder balls) —
Lifecycle Discontinued — see Discontinuance PCN —
Processor Type — MPC8xx PowerQUICC, 32-bit RISC MPU
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Serial Management Controllers (SMC) — 2 channels (UART/SPI/I2C)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
Encapsulamento / Caixa — 357-PBGA (25x25 mm)
Packaging — Tray
Lead Status — Contains Lead
Nível MSL — [DATA_NEEDED: MSL rating]

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