MPC855TZQ80D4 vs MPC860DPZQ80D4 对比
详细并排对比 MPC855TZQ80D4 出自 NXP Semiconductors 和 MPC860DPZQ80D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP
MPC860DPZQ80D4 Obsolete规格对比
| 参数 | MPC855TZQ80D4 | MPC860DPZQ80D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $61.40 | $13.85 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Type | Microprocessor Unit (MPU) | — |
| Series | PowerQUICC MPC8xx (MPC855T) | — |
| Core Architecture | Power Architecture MPC8xx, 32-bit | PowerPC 603-class single core |
| Core Clock Frequency | 80 MHz | — |
| Communication Processor Module (CPM) | Integrated RISC engine with FCC/ATM/HDLC | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| Serial Protocols | ATM, HDLC, SS#7 (via CPM) | — |
| PCMCIA Interface | Yes (1 or 2 slots) | — |
| Memory Bus Width | 32-bit (external) | — |
| 数据总线宽度 | 32 bit | — |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS |
| 工作温度 | 0 °C to +95 °C (commercial 'Z' grade) | [DATA_NEEDED: operating temperature range] |
| 封装 | 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) | — |
| 安装类型 | Surface Mount, BGA | Surface Mount |
| RoHS 状态 | Not compliant (SnPb-ball BGA, pre-RoHS generation) | Non-Compliant |
| Lead-Free | No (SnPb solder balls) | — |
| Lifecycle | Discontinued — see Discontinuance PCN | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit RISC MPU |
| Maximum Core Clock | — | 80 MHz |
| Core Voltage | — | 2.2 V |
| I/O Voltage | — | 3.3 V |
| Communications Processor Module (CPM) | — | Integrated 32-bit RISC CPM with SCC/SMC |
| Serial Communication Controllers (SCC) | — | Up to 4 channels (Ethernet, HDLC, UART) |
| Serial Management Controllers (SMC) | — | 2 channels (UART/SPI/I2C) |
| Ethernet MAC | — | 10/100 Mbps Fast Ethernet |
| DMA Channels | — | 4 channels |
| Memory Controller | — | Integrated, up to 4 DRAM banks |
| 封装 / 外壳 | — | 357-PBGA (25x25 mm) |
| Packaging | — | Tray |
| Lead Status | — | Contains Lead |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |