MPC855TZQ80D4 vs MPC860DPZQ80D4 Comparación

Comparación detallada lado a lado de MPC855TZQ80D4 por NXP Semiconductors y MPC860DPZQ80D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC855TZQ80D4 MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 ✗ Fin de vida
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

Comparación de especificaciones

Parámetro MPC855TZQ80D4 MPC860DPZQ80D4
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Fin de vida Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $61,40 $13,85
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type Microprocessor Unit (MPU) —
Series PowerQUICC MPC8xx (MPC855T) —
Core Architecture Power Architecture MPC8xx, 32-bit PowerPC 603-class single core
Core Clock Frequency 80 MHz —
Communication Processor Module (CPM) Integrated RISC engine with FCC/ATM/HDLC —
Ethernet Support 10/100 Mbps Fast Ethernet MAC —
Serial Protocols ATM, HDLC, SS#7 (via CPM) —
PCMCIA Interface Yes (1 or 2 slots) —
Memory Bus Width 32-bit (external) —
Ancho del bus de datos 32 bit —
Process Technology 0.32 um CMOS 0.32 um CMOS
Temperatura de funcionamiento 0 °C to +95 °C (commercial 'Z' grade) [DATA_NEEDED: operating temperature range]
Encapsulado 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) —
Tipo de montaje Surface Mount, BGA Surface Mount
Estado RoHS Not compliant (SnPb-ball BGA, pre-RoHS generation) Non-Compliant
Lead-Free No (SnPb solder balls) —
Lifecycle Discontinued — see Discontinuance PCN —
Processor Type — MPC8xx PowerQUICC, 32-bit RISC MPU
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Serial Management Controllers (SMC) — 2 channels (UART/SPI/I2C)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
Encapsulado / Carcasa — 357-PBGA (25x25 mm)
Packaging — Tray
Lead Status — Contains Lead
Nivel MSL — [DATA_NEEDED: MSL rating]

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