MPC860DPZQ66D4 vs MPC862PVR66B Vergleich
Detaillierter Direktvergleich von MPC860DPZQ66D4 von NXP Semiconductors und MPC862PVR66B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPC860DPZQ66D4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC860DPZQ66D4 | MPC862PVR66B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,28 | $28,90 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | PowerPC 32-bit RISC, 1 Core |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| Gehäuse / Bauform | 357-Ball PBGA, 25 x 25 mm | — |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| RoHS-Status | Non-RoHS (legacy BGA, contains lead) | Compliant (lead-free) |
| Betriebstemperatur | 0C to +70C (commercial grade) | [DATA_NEEDED: industrial temp grade] |
| Part Status | Not For New Designs | — |
| Family | — | PowerQUICC MPC8xx |
| Core Frequency | — | 66 MHz |
| Process Technology | — | 0.32 micrometer CMOS |
| Gehäuse | — | 357-PBGA (25x25 mm) |
| Montageart | — | Surface Mount (BGA) |
| Communication Module | — | CPM (Communications Processor Module), integrated |
| Ethernet MAC | — | 2x 10/100 Mbps (Fast Ethernet) |
| HDLC Channels | — | Multi-channel HDLC, SCC/SMC |
| Versorgungsspannung | — | [DATA_NEEDED: core/IO voltage] |
| Lead-Free Termination | — | Yes (Pb-free BGA balls, "B" suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Tray Packaging | — | Tray (per distributor listing) |