MPC860DPZQ66D4 vs MPC862PVR66B Comparaison
Comparaison détaillée côte à côte de MPC860DPZQ66D4 par NXP Semiconductors et MPC862PVR66B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPC860DPZQ66D4 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC860DPZQ66D4 | MPC862PVR66B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $25,28 | $28,90 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | PowerPC 32-bit RISC, 1 Core |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| Boîtier / Format | 357-Ball PBGA, 25 x 25 mm | — |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| Statut RoHS | Non-RoHS (legacy BGA, contains lead) | Compliant (lead-free) |
| Température de fonctionnement | 0C to +70C (commercial grade) | [DATA_NEEDED: industrial temp grade] |
| Part Status | Not For New Designs | — |
| Family | — | PowerQUICC MPC8xx |
| Core Frequency | — | 66 MHz |
| Process Technology | — | 0.32 micrometer CMOS |
| Boîtier | — | 357-PBGA (25x25 mm) |
| Type de montage | — | Surface Mount (BGA) |
| Communication Module | — | CPM (Communications Processor Module), integrated |
| Ethernet MAC | — | 2x 10/100 Mbps (Fast Ethernet) |
| HDLC Channels | — | Multi-channel HDLC, SCC/SMC |
| Tension d'alimentation | — | [DATA_NEEDED: core/IO voltage] |
| Lead-Free Termination | — | Yes (Pb-free BGA balls, "B" suffix) |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Tray Packaging | — | Tray (per distributor listing) |