MPC860DPZQ66D4 vs MPC862PVR66B 对比
详细并排对比 MPC860DPZQ66D4 出自 NXP Semiconductors 和 MPC862PVR66B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC860DPZQ66D4 | MPC862PVR66B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $25.28 | $28.90 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | PowerPC 32-bit RISC, 1 Core |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| 封装 / 外壳 | 357-Ball PBGA, 25 x 25 mm | — |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| RoHS 状态 | Non-RoHS (legacy BGA, contains lead) | Compliant (lead-free) |
| 工作温度 | 0C to +70C (commercial grade) | [DATA_NEEDED: industrial temp grade] |
| Part Status | Not For New Designs | — |
| Family | — | PowerQUICC MPC8xx |
| Core Frequency | — | 66 MHz |
| Process Technology | — | 0.32 micrometer CMOS |
| 封装 | — | 357-PBGA (25x25 mm) |
| 安装类型 | — | Surface Mount (BGA) |
| Communication Module | — | CPM (Communications Processor Module), integrated |
| Ethernet MAC | — | 2x 10/100 Mbps (Fast Ethernet) |
| HDLC Channels | — | Multi-channel HDLC, SCC/SMC |
| 电源电压 | — | [DATA_NEEDED: core/IO voltage] |
| Lead-Free Termination | — | Yes (Pb-free BGA balls, "B" suffix) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Tray Packaging | — | Tray (per distributor listing) |