MPC860DPZQ66D4 vs MPC862PVR66B Comparação

Comparação detalhada lado a lado de MPC860DPZQ66D4 por NXP Semiconductors e MPC862PVR66B por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC860DPZQ66D4 MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 ⚠ Última compra
NXP Semiconductors
MPC862PVR66B MPC862PVR66B - PowerQUICC MPC862 MPU 66MHz 357-PBGA | NXP

MPC862PVR66B - PowerQUICC MPC862 MPU 66MHz 357-PBGA | NXP

MPC862PVR66B Nrnd

Comparação de especificações

Parâmetro MPC860DPZQ66D4 MPC862PVR66B
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Última compra NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $25,28 $28,90
Processor Type MPC8xx PowerQUICC 32-Bit RISC MPU —
Core 1 Core, 32-Bit PowerPC PowerPC 32-bit RISC, 1 Core
Operating Frequency 66 MHz —
Core / I/O Voltage 3.3 V —
L1 Instruction Cache 4 Kbyte —
L1 Data Cache 4 Kbyte —
On-chip RAM (per data sheet) [DATA_NEEDED: internal SRAM size] —
Co-Processor / DSP Communications Processor Module (CPM) —
Ethernet 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) —
DRAM Controller Yes, up to 256 Mbyte addressable —
Address Bus Width 32-Bit —
Encapsulamento / Caixa 357-Ball PBGA, 25 x 25 mm —
Packaging Tray —
Lead-Free Status Contains Lead —
Status RoHS Non-RoHS (legacy BGA, contains lead) Compliant (lead-free)
Temperatura de operação 0C to +70C (commercial grade) [DATA_NEEDED: industrial temp grade]
Part Status Not For New Designs —
Family — PowerQUICC MPC8xx
Core Frequency — 66 MHz
Process Technology — 0.32 micrometer CMOS
Encapsulamento — 357-PBGA (25x25 mm)
Tipo de montagem — Surface Mount (BGA)
Communication Module — CPM (Communications Processor Module), integrated
Ethernet MAC — 2x 10/100 Mbps (Fast Ethernet)
HDLC Channels — Multi-channel HDLC, SCC/SMC
Tensão de alimentação — [DATA_NEEDED: core/IO voltage]
Lead-Free Termination — Yes (Pb-free BGA balls, "B" suffix)
Nível MSL — [DATA_NEEDED: MSL rating]
Tray Packaging — Tray (per distributor listing)

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