MPC885CZP66 vs MPC880CZP66 Vergleich
Detaillierter Direktvergleich von MPC885CZP66 von NXP Semiconductors und MPC880CZP66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP
MPC880CZP66 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC885CZP66 | MPC880CZP66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,40 | $27,85 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | MPC8xx (PowerQUICC) |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 32 bit | 32 bit |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| Versorgungsspannung | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | 357-PBGA (25x25 mm) |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| Betriebstemperatur | -40C to +100C | — |
| Terminal Form | Ball | Ball |
| Package Code | BGA | BGA (Plastic Ball Grid Array) |
| Package Shape | Square | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-compliant (Sn/Pb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Category | — | Microprocessors - MPU |
| Core | — | MPC8xx (PowerPC) |
| Maximale Taktfrequenz | — | 66.67 MHz |
| Nominal Supply Voltage | — | 1.8 V |
| Number of Terminals | — | 357 |
| Terminal Finish | — | Tin/Lead (Sn/Pb) - non-RoHS |
| Betriebstemperaturbereich | — | [DATA_NEEDED: extended industrial or commercial range] |