MPC885CZP66 vs MPC880CZP66 对比
详细并排对比 MPC885CZP66 出自 NXP Semiconductors 和 MPC880CZP66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC885CZP66 | MPC880CZP66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $18.40 | $27.85 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | MPC8xx (PowerQUICC) |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| 数据总线宽度 | 32 bit | 32 bit |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| 电源电压 | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | 357-PBGA (25x25 mm) |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| 工作温度 | -40C to +100C | — |
| Terminal Form | Ball | Ball |
| Package Code | BGA | BGA (Plastic Ball Grid Array) |
| Package Shape | Square | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Non-compliant (Sn/Pb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Category | — | Microprocessors - MPU |
| Core | — | MPC8xx (PowerPC) |
| 最大时钟频率 | — | 66.67 MHz |
| Nominal Supply Voltage | — | 1.8 V |
| Number of Terminals | — | 357 |
| Terminal Finish | — | Tin/Lead (Sn/Pb) - non-RoHS |
| 工作温度范围 | — | [DATA_NEEDED: extended industrial or commercial range] |