MPC885CZP66 vs MPC880CZP66 Comparison
Detailed side-by-side comparison of MPC885CZP66 by NXP Semiconductors and MPC880CZP66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP
MPC880CZP66 ⚠ Last Time BuySpecification Comparison
| Parameter | MPC885CZP66 | MPC880CZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $18.40 | $27.85 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | MPC8xx (PowerQUICC) |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| Data Bus Width | 32 bit | 32 bit |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| Supply Voltage | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | 357-PBGA (25x25 mm) |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| Operating Temperature | -40C to +100C | — |
| Terminal Form | Ball | Ball |
| Package Code | BGA | BGA (Plastic Ball Grid Array) |
| Package Shape | Square | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Non-compliant (Sn/Pb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Category | — | Microprocessors - MPU |
| Core | — | MPC8xx (PowerPC) |
| Maximum Clock Frequency | — | 66.67 MHz |
| Nominal Supply Voltage | — | 1.8 V |
| Number of Terminals | — | 357 |
| Terminal Finish | — | Tin/Lead (Sn/Pb) - non-RoHS |
| Operating Temperature Range | — | [DATA_NEEDED: extended industrial or commercial range] |