MRF5S19060MR1 vs MRF5S19060MBR1 Vergleich

Detaillierter Direktvergleich von MRF5S19060MR1 von NXP Semiconductors und MRF5S19060MBR1 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MRF5S19060MR1 MRF5S19060MR1 - 12W RF Power MOSFET 1930-1990 MHz TO-270 | NXP

MRF5S19060MR1 - 12W RF Power MOSFET 1930-1990 MHz TO-270 | NXP

MRF5S19060MR1 ✓ Aktiv
NXP Semiconductors
MRF5S19060MBR1 MRF5S19060MBR1 - 12W RF Power LDMOS 1990MHz | NXP/Freescale

MRF5S19060MBR1 - 12W RF Power LDMOS 1990MHz | NXP/Freescale

MRF5S19060MBR1 Obsolete

Spezifikationsvergleich

Parameter MRF5S19060MR1 MRF5S19060MBR1
Marke NXP Semiconductors NXP Semiconductors
Kategorie MOSFETs RF Amplifiers
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $25,60 $16,40
Manufacturer NXP (formerly Freescale Semiconductor) —
Part Number MRF5S19060MR1 —
Transistortyp N-Channel LDMOS RF Power MOSFET LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Frequency Range 1930 MHz to 1990 MHz —
Drain-Source Voltage (Vdss) 65 V (max) —
Drain Current (Id) 750 mA —
Output Power (Pout, avg) 12 W (N-CDMA) —
Output Power (Pout, PEP) 60 W (typical) —
Power Gain (Gps) 14 dB (typical) —
Drain Efficiency (etaD) 45% (typical) —
Operating Voltage 28 V —
Gehäuse TO-270 WB-4 (Ceramic) TO-270 WB-4 (overmolded plastic, also listed as TO-272 WB-4)
Montageart Surface Mount / Flange Mount —
Test Signal 2 x N-CDMA —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status [DATA_NEEDED: RoHS status] —
Operating Class Class AB —
Technology — RF Power Field Effect Transistor
Frequency Band — 1.93 GHz to 1.99 GHz
Typical Operating Frequency — 1990 MHz
Drain-Source Voltage (Rated) — 65 V
Nominal Drain Operating Voltage — 28 V
Output Power (Average) — 12 W
Power Gain — 14 dB
Test Current (Drain) — 750 mA
Drain Current Rating (Leakage Spec) — 10 uA
VSWR Tolerance — 5:1 @ 28 Vdc, 1990 MHz, 12 W avg
Input Matching — Internally matched
ESD Protection — Integrated
Package Outline — Case 1486-03, Style 1
Montagestil — Flange / surface mount with thermal pad
Maximum Junction Temperature — 200 degree C
Packaging — Tape and Reel, 500 units per 44 mm 13-inch reel (R1 suffix)
Target Application — PCN/PCS 1900 MHz, 2 x N-CDMA base station PA final/driver stage

Datenblätter & Ressourcen

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