MRF7S19120NR1 vs MRF7S19170HSR3 Vergleich
Detaillierter Direktvergleich von MRF7S19120NR1 von NXP Semiconductors und MRF7S19170HSR3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MRF7S19170HSR3 - 50W 1.99GHz LDMOS RF Power Transistor | NXP
MRF7S19170HSR3 ✓ AktivSpezifikationsvergleich
| Parameter | MRF7S19120NR1 | MRF7S19170HSR3 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $73,00 | $99,40 |
| Transistortyp | LDMOS, N-Channel Enhancement-Mode Lateral | LDMOS (N-Channel Enhancement-Mode Lateral MOSFET) |
| Technology | RF Power MOSFET (Gen7 HV8 LDMOS) | HV7 LDMOS |
| Frequency Range | 1930 MHz to 1990 MHz | — |
| Output Power (Avg, W-CDMA) | 36 W | — |
| Drain-Source Voltage (Vds max) | 65 V (rated) | — |
| Test Supply Voltage (Vdd) | 28 V | — |
| Test Quiescent Current (Idq) | 1.2 A | — |
| Power Gain (typ) | 18 dB at 1.99 GHz | 17.2 dB |
| Operating Class | Class AB, Class C | — |
| Gehäuse | TO-270 WB-4 (overmolded plastic, 4-lead) | — |
| Montagestil | Surface Mount / Flange Mount | — |
| Anzahl der Pins | 5 (per Freescale/NXP datasheet) | — |
| Lead Free Status | Lead Free per datasheet | — |
| Target Modulation | W-CDMA, CDMA, multi-carrier GSM | — |
| Application | CDMA / W-CDMA base station final-stage PA | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Status (Rochester) | — | Active - Rochester Electronics LLC authorized stock |
| Frequency Band | — | 1930-1990 MHz (US PCS / UMTS Band 1 / DCS-1900) |
| Test Frequency | — | 1.99 GHz |
| Drain-Source Voltage (Max) | — | 65 V |
| Operating Drain Voltage | — | 28 V (typical) |
| Test Drain Current | — | 1.4 A |
| Output Power (Avg) | — | 50 W (W-CDMA) |
| Gehäuse / Bauform | — | NI-880S (ceramic flange, bolt-down) |
| Montageart | — | Chassis / Heatsink Mount (flange) |
| Operating Mode | — | Class AB / Class C |
| Modulation Supported | — | CDMA, W-CDMA, multi-carrier GSM, EDGE |
| Lead Finish | — | Ni-Au (lead-free compatible) |
| RoHS-Status | — | Compliant (per NXP product page) |