P82B715TD vs P82B715DR Vergleich

Detaillierter Direktvergleich von P82B715TD von NXP Semiconductors und P82B715DR von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
P82B715TD P82B715TD - 2-Bit 400 kHz I2C Bus Extender | NXP

P82B715TD - 2-Bit 400 kHz I2C Bus Extender | NXP

P82B715TD Unknown
Texas Instruments
P82B715DR P82B715DR - 2-Bit I2C Bus Extender | Texas Instruments

P82B715DR - 2-Bit I2C Bus Extender | Texas Instruments

P82B715DR ✓ Aktiv

Spezifikationsvergleich

Parameter P82B715TD P82B715DR
Marke NXP Semiconductors Texas Instruments
Kategorie Interface ICs Interface ICs
Lebenszyklusstatus Unknown Aktiv
Product Type 2-bit bidirectional I2C-bus and SMBus extender 2-bit bidirectional I2C/SMBus buffer and cable extender
Manufacturer NXP Semiconductors —
Supply Voltage Range 3 V to 12 V —
Maximum Bus Frequency 400 kHz 400 kHz
Buffered Channels 2 channels: SCL and SDA —
Bus Direction Bidirectional —
Supported Bus I2C-bus and derivative SMBus systems —
Process Technology Bipolar integrated circuit —
Package Type SO8 plastic small-outline package —
Lead Count 8 leads —
Lead Pitch 1.27 mm —
Package Body Length 4.9 mm —
Package Body Width 3.9 mm —
Package Body Height 1.75 mm —
Montageart Surface mount Surface mount
Internal Bus Resistance 30 ohm —
Enable Control Enable pins present —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Maximum Bus Capacitance [DATA_NEEDED: maximum bus capacitance] —
Ruhestrom [DATA_NEEDED: quiescent current] —
Operating Supply Voltage Range — 3 V to 12 V
Bidirectional Channels — 2 channels
Bus Wiring Capacitance — 3 nF
Main-Bus Capacitance — 400 pF conventional I2C specification limit
Versorgungsstrom — 22 mA
Delay Time — 250 ns
Eingangskapazität — 3000 pF
Gehäuse — 8-SOIC, 0.154 inch body width, 3.90 mm width
Betriebstemperatur — -40 C to +85 C
Architecture — Bipolar IC with unidirectional analog current amplification
Driver Compatibility — Compatible with TTL-level drivers
ESD Robustness — +/-2500 V HBM
Latch-Up Immunity — Greater than 100 mA
MSL — MSL Level-1-260C-UNLIM

Datenblätter & Ressourcen

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