XPC8240LVV200E vs MPC8245LVV333D Vergleich

Detaillierter Direktvergleich von XPC8240LVV200E von NXP Semiconductors und MPC8245LVV333D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd
NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete

Spezifikationsvergleich

Parameter XPC8240LVV200E MPC8245LVV333D
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $29,40 $52,75
Manufacturer NXP Semiconductors NXP USA Inc. (formerly Freescale / Motorola)
Series MPC82xx / PowerQUICC II —
Core Processor PowerPC 603e —
Core Architecture 32-bit RISC PowerPC PowerPC 603e (Power Architecture technology)
Number of Cores 1 —
Core Clock Speed 200 MHz —
Core Supply Voltage 2.5 V —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Local Bus Width 64-bit 60x bus —
Integrated Bridge PCI bridge (PCI 2.2 compatible) PCI bridge + memory controller
Memory Controller SDRAM, ROM/Flash, burst SRAM 64-bit SDRAM (PC133), ROM/Flash interface
Serial Interfaces 2x UART, I2C —
Debug Interface JTAG / COP —
Gehäuse 352-TBGA (35 x 35 mm) —
Montageart Surface Mount Surface Mount (BGA)
Packaging Tray —
Betriebstemperatur Extended (E suffix) 0 C to +105 C (junction)
Lead Free Status Lead Free —
RoHS-Status RoHS Compliant [DATA_NEEDED: rohs status not confirmed in verified web data]
Product Category — Microprocessors (MPU)
Core Count — 1
Datenbusbreite — 32-bit
Core Frequency — 333 MHz
PCI Interface — PCI 2.2 compliant, 32-bit, up to 66 MHz
Supply Voltage - Core — 2.0 V (L suffix, low-voltage core)
Supply Voltage - I/O — 3.3 V
Gehäuse / Bauform — 352-TBGA (35x35 mm)
Lead-Free / BGA Solder — [DATA_NEEDED: lead-free status not confirmed]

Datenblätter & Ressourcen

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