XPC8240LVV200E vs MPC8245LVV333D 비교

다음의 상세 나란히 비교: XPC8240LVV200E 제조: NXP Semiconductors 및 MPC8245LVV333D 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd
NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete

사양 비교

파라미터 XPC8240LVV200E MPC8245LVV333D
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND Obsolete
재고 상태 In Stock In Stock
단가 (USD) $29.40 $52.75
Manufacturer NXP Semiconductors NXP USA Inc. (formerly Freescale / Motorola)
Series MPC82xx / PowerQUICC II —
Core Processor PowerPC 603e —
Core Architecture 32-bit RISC PowerPC PowerPC 603e (Power Architecture technology)
Number of Cores 1 —
Core Clock Speed 200 MHz —
Core Supply Voltage 2.5 V —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Local Bus Width 64-bit 60x bus —
Integrated Bridge PCI bridge (PCI 2.2 compatible) PCI bridge + memory controller
Memory Controller SDRAM, ROM/Flash, burst SRAM 64-bit SDRAM (PC133), ROM/Flash interface
Serial Interfaces 2x UART, I2C —
Debug Interface JTAG / COP —
패키지 352-TBGA (35 x 35 mm) —
실장 유형 Surface Mount Surface Mount (BGA)
Packaging Tray —
동작 온도 Extended (E suffix) 0 C to +105 C (junction)
Lead Free Status Lead Free —
RoHS 상태 RoHS Compliant [DATA_NEEDED: rohs status not confirmed in verified web data]
Product Category — Microprocessors (MPU)
Core Count — 1
데이터 버스 폭 — 32-bit
Core Frequency — 333 MHz
PCI Interface — PCI 2.2 compliant, 32-bit, up to 66 MHz
Supply Voltage - Core — 2.0 V (L suffix, low-voltage core)
Supply Voltage - I/O — 3.3 V
패키지 / 케이스 — 352-TBGA (35x35 mm)
Lead-Free / BGA Solder — [DATA_NEEDED: lead-free status not confirmed]

데이터시트 & 자료

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