XPC8240LVV200E vs MPC8245LVV333D 对比

详细并排对比 XPC8240LVV200E 出自 NXP Semiconductors 和 MPC8245LVV333D 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd
NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete

规格对比

参数 XPC8240LVV200E MPC8245LVV333D
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $29.40 $52.75
Manufacturer NXP Semiconductors NXP USA Inc. (formerly Freescale / Motorola)
Series MPC82xx / PowerQUICC II —
Core Processor PowerPC 603e —
Core Architecture 32-bit RISC PowerPC PowerPC 603e (Power Architecture technology)
Number of Cores 1 —
Core Clock Speed 200 MHz —
Core Supply Voltage 2.5 V —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Local Bus Width 64-bit 60x bus —
Integrated Bridge PCI bridge (PCI 2.2 compatible) PCI bridge + memory controller
Memory Controller SDRAM, ROM/Flash, burst SRAM 64-bit SDRAM (PC133), ROM/Flash interface
Serial Interfaces 2x UART, I2C —
Debug Interface JTAG / COP —
封装 352-TBGA (35 x 35 mm) —
安装类型 Surface Mount Surface Mount (BGA)
Packaging Tray —
工作温度 Extended (E suffix) 0 C to +105 C (junction)
Lead Free Status Lead Free —
RoHS 状态 RoHS Compliant [DATA_NEEDED: rohs status not confirmed in verified web data]
Product Category — Microprocessors (MPU)
Core Count — 1
数据总线宽度 — 32-bit
Core Frequency — 333 MHz
PCI Interface — PCI 2.2 compliant, 32-bit, up to 66 MHz
Supply Voltage - Core — 2.0 V (L suffix, low-voltage core)
Supply Voltage - I/O — 3.3 V
封装 / 外壳 — 352-TBGA (35x35 mm)
Lead-Free / BGA Solder — [DATA_NEEDED: lead-free status not confirmed]

数据手册与资源

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