10AS032H4F34I3SG - Arria 10 SX SoC FPGA 320K LE | Intel
Teilenummer: 10AS032H4F34I3SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3995 | $39.950,00 |
| 25 | $3750 | $93.750,00 |
| 100 | $3450 | $345.000,00 |
| 500 | $3150 | $1.575.000,00 |
10AS032H4F34I3SG Übersicht
A System-on-Chip (SoC) FPGA is a heterogeneous computing device that pairs general-purpose CPU cores with reconfigurable programmable logic. Within the embedded-compute taxonomy, this part sits inside the hierarchy: SoC FPGA -> FPGA & SoC -> Programmable Logic -> Integrated Circuit. By merging the deterministic, parallel latency of FPGA fabric with the sequential flexibility of an applications processor running an OS such as Linux or RTOS, SoC FPGAs eliminate the need for a discrete companion CPU/MCU and the high-pin-count parallel bus between processor and FPGA, reducing BOM, board area, and latency.
Key features of the 10AS032H4F34I3SG include 320K logic elements, 1.5 GHz maximum Cortex-A9 dual-core operation, embedded transceivers supporting multi-gigabit serial links, on-chip hard memory controllers for DDR3/DDR4, and PCI Express hard IP blocks. The device is fabricated on a 20nm TSMC process and supports 0.9V core operation. Industrial temperature grade and the FCBGA-1152 package make it suitable for harsh-environment embedded platforms.
The architecture embeds ARM Cortex-A9 cores with CoreSight debug, NEON media engine, single/double-precision FPU, and a rich peripheral set (USB, Ethernet, CAN, UART, SPI, I2C). FPGA-side resources include 16.7 Mbits embedded memory, variable-precision DSP blocks, and up to 1.5 GHz fabric performance, all programmable through Quartus Prime. Designers pair the HPS with fabric-based accelerators for deterministic DSP, vision, or packet-processing pipelines.
Typical applications include wireless baseband processing, software-defined radio (SDR), industrial machine vision, motor control and robotics, medical imaging, and avionics. It is also used in broadcast video processing, high-speed test & measurement backhaul, and defense signal-intelligence platforms where parallel DSP in fabric combines naturally with Linux-based control plane software running on the Cortex-A9.
Design consideration: the FCBGA-1152 package requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for the HPS memory interface, and strict DDR3/4 length-matching. Thermal management must account for the full HPS+FPGA workload, since peak power rises when both subsystems run concurrently. Use the Quartus Prime Early Power Estimator before board layout.
This page synthesizes Intel Arria 10 SX datasheet parameters, current distributor stock and lead-time signals, and same-family ordering-code variants not found on a single manufacturer page, providing information gain for hardware engineers and procurement teams.
Drop-in-Alternativen für 10AS032H4F34I3SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS032H4F34I3SG (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Mounting Type, Operating Temperature Grade, Package Code.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032H3F34I2SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AS032H4F34E3SG
✅ Drop-In✓ Auf Lager
$3490 / Stück
Datenblatt ansehen →10AS032H2F34I2SG
✅ Drop-In✓ Auf Lager
$3760 / Stück
Datenblatt ansehen →10AS032H3F34I2LG
✅ Drop-In✓ Auf Lager
$1620.19 / Stück
Datenblatt ansehen →10AS032H2F34I2LG
✅ Drop-In✓ Auf Lager
$1390 / Stück
Datenblatt ansehen →10AS032H1F34I1HG
✅ Drop-In✓ Auf Lager
$2077.26 / Stück
Datenblatt ansehen →10AS032H3F35I2SG
✅ Drop-In✓ Auf Lager
$2120 / Stück
Datenblatt ansehen →10AS032H4F34I3SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Pin-Anzahl | 1152 |
| Gehäuse | FCBGA-1152 (F34, 35 x 35 mm) |
| Package Code | F34 |
| Speed Grade | H4 |
| Temperature Grade | Industrial (I) |
| Montageart | Surface Mount (BGA ball grid) |
| RoHS-Status | Compliant |
10AS032H4F34I3SG f34 Pinbelegungsleitfaden
Pinbelegung für 10AS032H4F34I3SG (f34-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS032H4F34I3SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS032H4F34I3SG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Software-Defined Radio (SDR), Industrial Machine Vision, Motor Control and Robotics, Medical Imaging Systems, Broadcast Video Processing.
Wireless Baseband Processing
The 10AS032H4F34I3SG's 320K logic elements combined with variable-precision DSP blocks at up to 1.5 GHz fabric performance make it well suited to LTE and 5G NR physical-layer baseband pipelines where crest-factor reduction, FFT/iFFT, channel coding, and MIMO detection run in parallel. The H4 speed grade provides tighter Fmax margin on transceiver datapaths, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs the MAC scheduler, RRC, and L3 protocol stack under Linux. Pair the device with multi-gigabit transceivers to JESD204B/C RFICs and high-bandwidth DDR3/DDR4 buffers for sample buffering. Designers benefit from SoC integration that eliminates a companion CPU, reducing BOM, board area, and the latency of an FPGA-to-host parallel bus.
Empfohlen
Software-Defined Radio (SDR)
Software-defined radio platforms require simultaneous DSP throughput in fabric and high-level control software on a Linux-capable host CPU. The 10AS032H4F34I3SG integrates a dual Cortex-A9 hard processor system at 1.5 GHz with 320K LE of FPGA fabric in a single 35x35 mm FCBGA-1152 package, enabling a single-board SDR with on-chip modulation/demodulation, channelization, and protocol handling. The H4 speed grade maximizes Fmax for wideband I/Q processing, while the HPS runs GNU Radio companion code, FFTW, or proprietary DSP frameworks. Hardened memory controllers interface to DDR3/4 buffers for streaming ADC/DAC sample capture. Industrial temperature grade and robust BGA packaging suit rugged deployable SDR enclosures.
Empfohlen
Industrial Machine Vision
Multi-camera machine vision systems benefit from the 10AS032H4F34I3SG's parallel fabric processing for image pipeline stages (ISP, Bayer demosaic, lens correction, HDR merge) running concurrently with Linux-based inspection software on the Cortex-A9 HPS. The 320K LE budget fits multi-camera ISP pipelines at GigE Vision or CoaXPress data rates, while the HPS runs OpenCV, TensorFlow Lite, or custom inference. PCI Express hard IP blocks enable direct attachment to host PCs for offload workloads, and the FCBGA-1152 industrial-temperature package suits factory-floor deployment. H4 speed grade ensures deterministic frame-to-frame latency for high-throughput visual inspection lines.
Empfohlen
Motor Control and Robotics
Precision motor control and multi-axis robotics combine deterministic FPGA-based field-oriented control (FOC), PWM generation, and encoder decoding with the HPS running Linux for motion planning, kinematics, and ROS 2 nodes. The 10AS032H4F34I3SG's hard Cortex-A9 subsystem handles trajectory planning and network protocols (EtherCAT, PROFINET) while the FPGA fabric runs low-latency current/torque loops at sub-microsecond update rates. H4 speed grade tightens feedback-loop timing margins. Industrial temperature rating and the rugged FCBGA-1152 package suit factory automation enclosures with extended thermal stress.
Empfohlen
Medical Imaging Systems
Ultrasound beamforming, CT reconstruction, and MRI signal processing all benefit from the 10AS032H4F34I3SG's parallel FPGA fabric for high-throughput DSP pipelines plus a Cortex-A9 HPS for image display, patient-data handling, and DICOM network connectivity. The 320K LE budget fits 64-channel or 128-channel ultrasound beamformers with on-chip FFT and Hilbert transform stages, while the HPS runs the user interface and hospital-network stack. The industrial temperature range and medical-grade EMI performance of the FCBGA-1152 package suit IEC 60601-1 compliant equipment. H4 speed grade maximizes sampling-rate headroom for next-generation imaging modalities.
Empfohlen
Broadcast Video Processing
Broadcast studios deploying 4K/UHD video processing need both parallel pixel-pipeline DSP in FPGA fabric and an applications processor for codec orchestration and IP transport. The 10AS032H4F34I3SG handles SDI/HDMI ingest, color-space conversion, scaling, and HDR mapping in fabric while the Cortex-A9 HPS at 1.5 GHz runs FFmpeg, SRT/RIST transport, or NDI stack. H4 speed grade supports multi-stream HEVC/AVC encoding helpers, and the FCBGA-1152 industrial-temperature package suits 24/7 broadcast rack environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS032H4F34I3SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032H3F34I2SG | 10AS032H4F34E3SG | 10AS032H2F34I2SG | 10AS032H1F34I1HG | 10AS032H3F35I2SG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1152 (F34, 35x35 mm) | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F35) - same ball count, different PCB land pattern |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320000 | 320000 - same | 320000 - same | 320000 - same | 320000 - same | 320000 - same |
| Speed Grade | H4 | H3 (lower Fmax) | H4 - same | H2 (lower Fmax) | H1 (lowest Fmax) | H3 (lower Fmax) |
| Temperature Grade | Industrial (I) | Industrial (I) | Extended commercial (E) | Industrial (I) | Industrial (I) | Industrial (I) |
| HPS Maximum Frequency | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade in the 10AS032 F34 industrial-temperature family (vs. 10AS032H3F34I2SG)
- Industrial temperature rating (-40C to +100C) with H4 Fmax (vs. 10AS032H4F34E3SG)
- Compact 35x35 mm FCBGA-1152 with on-die HPS integration (vs. 10AS032H3F35I2SG)
Designhinweise
Estimated: the FCBGA-1152 package at 35x35 mm demands a high-density PCB stack-up with laser-drilled microvias and via-in-pad construction. Plan at least an 8-layer stack with continuous GND planes adjacent to the BGA breakout layer. Use the Intel Quartus Prime pin-out file to generate breakout vias that meet the 1.0 mm pitch escape routing. Maintain 100-ohm differential impedance for high-speed transceiver lanes and 50-ohm single-ended for general-purpose I/O. The HPS DDR3/DDR4 interface requires strict length-matching to within +/- 25 mil across byte lanes.
Estimated: full-power HPS plus high-utilization FPGA fabric workloads can drive junction temperature above 100C in still air. Compute the power budget using the Quartus Prime Early Power Estimator before board layout; allocate at least 6 square inches of inner copper plane and a thermally-bonded heatsink with 1 C/W or better for industrial-temperature deployment. Industrial-grade FCBGA-1152 packages have a JEDEC JESD51 theta_JA typically near 12 C/W with optimized thermal via arrays; reduced thermal performance compromises the H4 speed-grade timing margin.
Multi-gigabit transceivers on the Arria 10 SX device require AC-coupled interconnects with 100-ohm differential impedance and a continuous reference plane. Use the Intel Transceiver Toolkit to characterize pre-emphasis and equalization settings; do not exceed the datasheet-defined Vcm and Vdiff limits. Reference clock routing must use a balanced, length-matched topology with proper termination; jitter cleaner PLL such as the Silicon Labs Si5341 is recommended for sub-ppms reference jitter to maximize transceiver BER performance.
Estimated: a common pitfall is bypassing the HPS boot configuration: the Cortex-A9 boot ROM must be supplied a valid boot image through the configured boot source (QSPI flash, SD card, or NAND) and the boot pins must match the board's physical configuration. Designers often overlook the requirement to level-shift the HPS I/O bank voltages independently from the FPGA fabric banks. Verify the HPS clock source and reset sequencing against the Intel Arria 10 SoC boot user guide to avoid hard-bricked boards.
Compliance-Informationen
RoHS compliance confirmed by Verified Web Data ('ROHS COMPLIANT' in distributor listing) and trailing '3' in the ordering code denoting lead-free Pb-free finish. Industrial temperature range (-40C to +100C) per the 'I' ordering-code suffix. AEC-Q100 is not applicable for FPGAs/SoCs; use AEC-Q100-qualified companion components for automotive subsystems.
