10AS032H1F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FCBGA | Intel
Teilenummer: 10AS032H1F34I1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2596.57 | $2.596,57 |
| 10 | $2466.74 | $24.667,40 |
| 100 | $2336.91 | $233.691,00 |
| 500 | $2207.08 | $1.103.540,00 |
| 1.000 | $2077.26 | $2.077.260,00 |
10AS032H1F34I1HG Übersicht
A SoC FPGA combines a microprocessor subsystem and programmable logic on a single die, allowing hardware acceleration of latency-critical functions while retaining software programmability for control, networking, and operating-system tasks. The Arria 10 SX extends this architecture with hardened floating-point DSP blocks, multi-gigabit transceivers up to 17.4 Gbps, and a rich peripheral set, making it a mid- to high-end platform for signal-processing, motor-control, and protocol-bridging applications. Hypernyms: SoC -> embedded SoC -> programmable SoC -> FPGA SoC -> semiconductor.
Key features of the 10AS032H1F34I1HG include 384 user I/O pins, 256 KB on-chip memory, and an HPS subsystem with ARM Cortex-A9 cores, NEON media-processing engine, and a multiport SDRAM controller supporting DDR4, DDR3, LPDDR3, and LPDDR2. The FPGA fabric includes adaptive logic modules (ALMs), 156 hardware DSP blocks for 18 × 19 multipliers, and embedded memory blocks (M20K). The device is offered in speed grade -1 and is RoHS compliant.
Architecturally, the part belongs to the Arria 10 SX family (10AS) targeting mid-range, power-efficient designs. The HPS is connected to the FPGA fabric through four high-bandwidth bridges (AXI bridges) that deliver up to 125 Gbps aggregate throughput between the processors and logic, enabling tight CPU-to-FPGA coprocessing without external chip-to-chip links. The industrial-grade temperature range and the FCBGA-1152 package make the variant a workhorse for line-card designs, machine-vision platforms, and 4K video broadcast equipment.
Typical applications include motor drives and industrial automation, medical imaging (ultrasound beamforming, endoscopy), military/aerospace signal processing, 4K/8K video broadcast infrastructure, software-defined radio, and high-performance embedded computing modules. Its combination of dual-core ARM Cortex-A9 plus abundant DSP resources makes it a common choice for designs that previously required a discrete CPU plus a separate FPGA.
When designing with the 10AS032H1F34I1HG, treat the HPS boot configuration, DDR4 layout, and transceiver channel placement as critical - signal-integrity issues in the BGA escape region and thermal management of the 1152-ball FCBGA are the two highest-risk integration challenges. Power estimation should begin with the Intel PowerPlay early estimator before PCB layout is finalized.
This page consolidates distributor pricing and stock, drop-in alternative options, and engineering notes drawn from the manufacturer datasheet and Intel/Altera application notes - information not always visible on distributor-only product listings.
Drop-in-Alternativen für 10AS032H1F34I1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS032H1F34I1HG (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Mounting Type, DSP Blocks, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032E4F29E3SG
✅ Drop-In✓ Auf Lager
$1920 / Stück
Datenblatt ansehen →10AS032H1F34I2HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AS032H1F34I1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AS032H1F34E1HG
✅ Drop-In✓ Auf Lager
$1755 / Stück
Datenblatt ansehen →10AS032H1F34I1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Series | 10AS |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| DSP Blocks | 156 (18 × 19 multipliers) |
| On-chip Memory | 256 KB |
| User I/O Pins | 384 |
| Gehäuse | 1152-BGA, FCBGA (35 mm × 35 mm) |
| Process Technology | 20 nm |
| Transceivers | Up to 17.4 Gbps (multi-gigabit) |
| Memory Interfaces | DDR4 / DDR3 / LPDDR3 / LPDDR2 |
| Speed Grade | -1 |
| Betriebstemperatur | -40 °C to +100 °C (industrial) |
| RoHS | Compliant |
| Montageart | Surface Mount (BGA) |
| Lebenszyklusstatus | Active |
10AS032H1F34I1HG 1152-bga, fcbga (35 mm × 35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS032H1F34I1HG (1152-bga, fcbga (35 mm × 35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS032H1F34I1HG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS032H1F34I1HG ist geeignet für 6 Anwendungs: Motor Control and Industrial Drives, Medical Imaging and Ultrasound, 4K/8K Video Broadcast Infrastructure, Software-Defined Radio (SDR), High-Performance Embedded Computing Modules, Test and Measurement Instrumentation.
Motor Control and Industrial Drives
The 10AS032H1F34I1HG fits multi-axis motor-drive and industrial-automation platforms because the Arria 10 SX combines a dual-core ARM Cortex-A9 HPS running deterministic control loops with 320K LE of programmable logic and 156 hardware DSP blocks. Field-oriented control for a 4-axis servo drive at 32 kHz switching frequency easily fits in the FPGA fabric with hardware floating-point math, while the HPS runs Linux/QNX for networking and HMI. The 17.4 Gbps transceivers support EtherCAT, PROFINET IRT, or SERCOS III on the same board without an external ASSP. Industrial temperature range and 1.5 GHz headroom let the SoC replace a discrete CPU+FPGA combo in higher-end line-card designs.
Empfohlen
Medical Imaging and Ultrasound
The 10AS032H1F34I1HG is widely used in ultrasound beamformers, endoscopy image processors, and CT reconstruction front-ends thanks to its 320K logic elements and 156 hardware DSP blocks, which can sustain channel-data rates well above 5 Gbps per imaging channel. The hard ARM Cortex-A9 subsystem handles patient-interface stack and DICOM transmission, while the FPGA fabric performs beamforming, FIR filtering, and harmonic imaging in real time. DDR4 memory bandwidth supports 4D volumetric rendering at 30 fps without external memory. The industrial temperature grade suits portable bedside units and operating-room carts.
Empfohlen
4K/8K Video Broadcast Infrastructure
Broadcast video routers, contribution encoders, and studio glue logic rely on the 10AS032H1F34I1HG because the Arria 10 SX family includes multi-gigabit transceivers up to 17.4 Gbps (12G-SDI capable) and enough logic to handle 4:4:4 12G-SDI at 60 fps on a single chip. The HPS runs a control-plane stack (NMOS IS-04/05, PTP) while the FPGA fabric implements color-space conversion, HDR mapping, and audio embedding. The FCBGA-1152 package supports 384 user I/Os for matrix-router backplanes. Engineers designing for SMPTE ST 2110 IP-based workflows commonly choose this part as the I/O bridge between SDI and 25G Ethernet.
Empfohlen
Software-Defined Radio (SDR)
The 10AS032H1F34I1HG is a strong fit for wideband SDR platforms and tactical radio front-ends, where its 17.4 Gbps transceivers support multiple independent RF channels and its DSP density handles DDC/DUC, channelization, and waveform-specific transforms on the same die. The dual-core ARM Cortex-A9 runs waveform code (LTE, TETRA, proprietary) under a real-time OS, while the FPGA fabric offloads PHY-layer primitives at line rate. The industrial temperature range and high logic count support multi-band, multi-mode radios previously requiring a separate FPGA and DSP. Reference designs from Intel/Altera show 4×4 MIMO LTE at 20 MHz bandwidth fully closed in one Arria 10 SX device.
Empfohlen
High-Performance Embedded Computing Modules
VPX, VITA 57.4 (FMC+), and OpenVPX-based single-board computers (SBCs) for defense and aerospace use the 10AS032H1F34I1HG because the SoC FPGA consolidates CPU, FPGA, and high-speed serial on one die. The Arria 10 SX device runs a real-time OS on the ARM Cortex-A9 for housekeeping, runs Linux for network services, and accelerates sensor-fusion algorithms in the FPGA fabric. 100 GbE and PCIe Gen3 interfaces are achievable using the integrated transceivers, eliminating the external PHY+ASIC pair found in legacy designs. The -40 °C to +100 °C industrial temperature grade and RoHS compliance meet the typical defense/aerospace environmental envelope.
Empfohlen
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the 10AS032H1F34I1HG for the acquisition and processing pipeline because of its combination of high transceivers (40+ Gbps aggregate), abundant logic, and dual-core ARM Cortex-A9. The FPGA fabric performs real-time triggering, pattern matching, and protocol decoding at line rate, while the HPS runs the GUI stack, scripting engine, and remote-control interfaces (LXI, SCPI). The 1152-ball FCBGA-1152 package supports the dense connector interface required for multi-channel acquisition cards. Industrial temperature operation suits bench, ATE, and field-test deployment scenarios.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS032H1F34I1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032E4F29E3SG | 10AS032H1F34I2HG | 10AS032H1F34I1SG | 10AS032H1F34E1HG |
|---|---|---|---|---|---|
| Package | FCBGA-1152 (F34, 35x35 mm) | FCBGA-780 (F29, 29x29 mm) | FCBGA-1152 (F34, 35x35 mm) - same | FCBGA-1152 (F34, 35x35 mm) - same | FCBGA-1152 (F34, 35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Speed Grade | -1 | -3 | -2 | -1 | -1 |
| Operating Temperature | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| DSP Blocks | 156 | 156 | 156 | 156 | 156 |
| User I/O | 384 | 240 | 384 | 384 | 384 |
| Transceiver Rate | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps |
Wichtigste Unterscheidungsmerkmale
- Highest logic capacity within the Arria 10 SX portfolio (vs. 10AS032E4F29E3SG)
- Industrial temperature grade with full hard processor subsystem (vs. 10AS032H1F34E1HG)
- Speed-grade -1 offers the highest performance bin (vs. 10AS032H1F34I2HG)
Designhinweise
Estimated: A 35 mm × 35 mm FCBGA with typical Arria 10 SX utilization (~60% logic, 60% DSP, HPS active at 1.5 GHz) dissipates approximately 15 to 25 W at 25 °C ambient, which translates to a junction temperature rise of 25-40 °C above ambient with a properly designed 4-layer thermal pad. A heatsink with 3 to 5 C/W thermal resistance is recommended when operating near the industrial upper limit of 100 °C; without forced airflow the junction will exceed 100 °C under sustained high utilization. Use Intel PowerPlay early-power estimator and a junction-to-ambient thermal model of the PCB stack-up before layout freeze.
For the 1152-ball FCBGA with 1.0 mm pitch, use a 0.8 mm pad diameter with NSMD (non-solder mask defined) pads and a microvia-in-pad stack-up. Maintain a 4-layer minimum PCB stack-up with continuous reference planes under the BGA fanout region to control impedance of HPS DDR4 traces (typically 85 ohm differential for SSTL). Reference Intel's Arria 10 SX Hardware Reference Manual for HPS PCB layout, and verify with the Quartus Prime Pin Planner that all HPS DDR4 fly-by lengths fall within the published deskew tolerance.
Common pitfalls with the Arria 10 SX include: (1) forgetting the HPS reset sequencing requirements - the FPGA fabric must be configured before HPS is released from reset in most boot flows; (2) leaving GPIO banks without proper VCCIO power sequencing, which can cause I/O contention; (3) using incorrect PLL reference clock topology for transceivers - reference clocks must meet the strict jitter spec defined in the datasheet; (4) underestimating configuration time and boot-bypass time for secure boot designs. Validate all of these with the Arria 10 SX Development Kit before final schematic review.
Place HPS DDR4 memory immediately adjacent to the FCBGA-1152 with matched trace lengths to avoid skew issues. Use ground stitching vias every 200 mil along the high-speed transceiver edges to maintain return path continuity. Separate analog supply pins (PLL_VCC, HPS_VCC, XCVR_VCC) with local ferrite beads and decoupling caps - do not share analog supply planes with noisy digital rails. The Intel Arria 10 SX layout checklist provides a complete DFM rule set for this package.
Compliance-Informationen
RoHS compliance per Intel/Altera product specification. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Halogen-free status not confirmed from provided web data - set to unknown.
