10AS032H4F34I3SG - Arria 10 SX SoC FPGA 320K LE | Intel
MPN: 10AS032H4F34I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 25 | $3750 | $93,750.00 |
| 100 | $3450 | $345,000.00 |
| 500 | $3150 | $1,575,000.00 |
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View Datasheet →10AS032H4F34I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Pin Count | 1152 |
| Package | FCBGA-1152 (F34, 35 x 35 mm) |
| Package Code | F34 |
| Speed Grade | H4 |
| Temperature Grade | Industrial (I) |
| Mounting Type | Surface Mount (BGA ball grid) |
| RoHS Status | Compliant |
10AS032H4F34I3SG f34 Pin Configuration Guide
Complete pinout information for 10AS032H4F34I3SG (f34 package) with 1152 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F34I3SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1152 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F34I3SG is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), Industrial Machine Vision, Motor Control and Robotics, Medical Imaging Systems, Broadcast Video Processing.
Wireless Baseband Processing
The 10AS032H4F34I3SG's 320K logic elements combined with variable-precision DSP blocks at up to 1.5 GHz fabric performance make it well suited to LTE and 5G NR physical-layer baseband pipelines where crest-factor reduction, FFT/iFFT, channel coding, and MIMO detection run in parallel. The H4 speed grade provides tighter Fmax margin on transceiver datapaths, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs the MAC scheduler, RRC, and L3 protocol stack under Linux. Pair the device with multi-gigabit transceivers to JESD204B/C RFICs and high-bandwidth DDR3/DDR4 buffers for sample buffering. Designers benefit from SoC integration that eliminates a companion CPU, reducing BOM, board area, and the latency of an FPGA-to-host parallel bus.
Recommended
Software-Defined Radio (SDR)
Software-defined radio platforms require simultaneous DSP throughput in fabric and high-level control software on a Linux-capable host CPU. The 10AS032H4F34I3SG integrates a dual Cortex-A9 hard processor system at 1.5 GHz with 320K LE of FPGA fabric in a single 35x35 mm FCBGA-1152 package, enabling a single-board SDR with on-chip modulation/demodulation, channelization, and protocol handling. The H4 speed grade maximizes Fmax for wideband I/Q processing, while the HPS runs GNU Radio companion code, FFTW, or proprietary DSP frameworks. Hardened memory controllers interface to DDR3/4 buffers for streaming ADC/DAC sample capture. Industrial temperature grade and robust BGA packaging suit rugged deployable SDR enclosures.
Recommended
Industrial Machine Vision
Multi-camera machine vision systems benefit from the 10AS032H4F34I3SG's parallel fabric processing for image pipeline stages (ISP, Bayer demosaic, lens correction, HDR merge) running concurrently with Linux-based inspection software on the Cortex-A9 HPS. The 320K LE budget fits multi-camera ISP pipelines at GigE Vision or CoaXPress data rates, while the HPS runs OpenCV, TensorFlow Lite, or custom inference. PCI Express hard IP blocks enable direct attachment to host PCs for offload workloads, and the FCBGA-1152 industrial-temperature package suits factory-floor deployment. H4 speed grade ensures deterministic frame-to-frame latency for high-throughput visual inspection lines.
Recommended
Motor Control and Robotics
Precision motor control and multi-axis robotics combine deterministic FPGA-based field-oriented control (FOC), PWM generation, and encoder decoding with the HPS running Linux for motion planning, kinematics, and ROS 2 nodes. The 10AS032H4F34I3SG's hard Cortex-A9 subsystem handles trajectory planning and network protocols (EtherCAT, PROFINET) while the FPGA fabric runs low-latency current/torque loops at sub-microsecond update rates. H4 speed grade tightens feedback-loop timing margins. Industrial temperature rating and the rugged FCBGA-1152 package suit factory automation enclosures with extended thermal stress.
Recommended
Medical Imaging Systems
Ultrasound beamforming, CT reconstruction, and MRI signal processing all benefit from the 10AS032H4F34I3SG's parallel FPGA fabric for high-throughput DSP pipelines plus a Cortex-A9 HPS for image display, patient-data handling, and DICOM network connectivity. The 320K LE budget fits 64-channel or 128-channel ultrasound beamformers with on-chip FFT and Hilbert transform stages, while the HPS runs the user interface and hospital-network stack. The industrial temperature range and medical-grade EMI performance of the FCBGA-1152 package suit IEC 60601-1 compliant equipment. H4 speed grade maximizes sampling-rate headroom for next-generation imaging modalities.
Recommended
Broadcast Video Processing
Broadcast studios deploying 4K/UHD video processing need both parallel pixel-pipeline DSP in FPGA fabric and an applications processor for codec orchestration and IP transport. The 10AS032H4F34I3SG handles SDI/HDMI ingest, color-space conversion, scaling, and HDR mapping in fabric while the Cortex-A9 HPS at 1.5 GHz runs FFmpeg, SRT/RIST transport, or NDI stack. H4 speed grade supports multi-stream HEVC/AVC encoding helpers, and the FCBGA-1152 industrial-temperature package suits 24/7 broadcast rack environments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F34I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F34I2SG | 10AS032H4F34E3SG | 10AS032H2F34I2SG | 10AS032H1F34I1HG | 10AS032H3F35I2SG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1152 (F34, 35x35 mm) | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F34) - same | FCBGA-1152 (F35) - same ball count, different PCB land pattern |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320000 | 320000 - same | 320000 - same | 320000 - same | 320000 - same | 320000 - same |
| Speed Grade | H4 | H3 (lower Fmax) | H4 - same | H2 (lower Fmax) | H1 (lowest Fmax) | H3 (lower Fmax) |
| Temperature Grade | Industrial (I) | Industrial (I) | Extended commercial (E) | Industrial (I) | Industrial (I) | Industrial (I) |
| HPS Maximum Frequency | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same | 1.5 GHz dual Cortex-A9 - same |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Approximate Unit Price (qty 1, USD) | 4250.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the 10AS032 F34 industrial-temperature family (vs 10AS032H3F34I2SG)
- Industrial temperature rating (-40C to +100C) with H4 Fmax (vs 10AS032H4F34E3SG)
- Compact 35x35 mm FCBGA-1152 with on-die HPS integration (vs 10AS032H3F35I2SG)
Design Notes
Estimated: the FCBGA-1152 package at 35x35 mm demands a high-density PCB stack-up with laser-drilled microvias and via-in-pad construction. Plan at least an 8-layer stack with continuous GND planes adjacent to the BGA breakout layer. Use the Intel Quartus Prime pin-out file to generate breakout vias that meet the 1.0 mm pitch escape routing. Maintain 100-ohm differential impedance for high-speed transceiver lanes and 50-ohm single-ended for general-purpose I/O. The HPS DDR3/DDR4 interface requires strict length-matching to within +/- 25 mil across byte lanes.
Estimated: full-power HPS plus high-utilization FPGA fabric workloads can drive junction temperature above 100C in still air. Compute the power budget using the Quartus Prime Early Power Estimator before board layout; allocate at least 6 square inches of inner copper plane and a thermally-bonded heatsink with 1 C/W or better for industrial-temperature deployment. Industrial-grade FCBGA-1152 packages have a JEDEC JESD51 theta_JA typically near 12 C/W with optimized thermal via arrays; reduced thermal performance compromises the H4 speed-grade timing margin.
Multi-gigabit transceivers on the Arria 10 SX device require AC-coupled interconnects with 100-ohm differential impedance and a continuous reference plane. Use the Intel Transceiver Toolkit to characterize pre-emphasis and equalization settings; do not exceed the datasheet-defined Vcm and Vdiff limits. Reference clock routing must use a balanced, length-matched topology with proper termination; jitter cleaner PLL such as the Silicon Labs Si5341 is recommended for sub-ppms reference jitter to maximize transceiver BER performance.
Estimated: a common pitfall is bypassing the HPS boot configuration: the Cortex-A9 boot ROM must be supplied a valid boot image through the configured boot source (QSPI flash, SD card, or NAND) and the boot pins must match the board's physical configuration. Designers often overlook the requirement to level-shift the HPS I/O bank voltages independently from the FPGA fabric banks. Verify the HPS clock source and reset sequencing against the Intel Arria 10 SoC boot user guide to avoid hard-bricked boards.
Compliance Information
RoHS compliance confirmed by Verified Web Data ('ROHS COMPLIANT' in distributor listing) and trailing '3' in the ordering code denoting lead-free Pb-free finish. Industrial temperature range (-40C to +100C) per the 'I' ordering-code suffix. AEC-Q100 is not applicable for FPGAs/SoCs; use AEC-Q100-qualified companion components for automotive subsystems.
