10AS048H2F34I2SG - Arria 10 SX 480K LE SoC FPGA | Intel
Teilenummer: 10AS048H2F34I2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4625 | $4.625,00 |
| 10 | $4380 | $43.800,00 |
| 100 | $3950 | $395.000,00 |
| 500 | $3720 | $1.860.000,00 |
| 1.000 | $3505 | $3.505.000,00 |
10AS048H2F34I2SG Übersicht
What is a SoC FPGA? A SoC FPGA combines a microprocessor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with programmable FPGA logic on a single die. This architecture eliminates the need for a companion processor chip, reducing board area, BOM cost, and interconnect latency for embedded designs. Within the broader hierarchy, the Arria 10 SX family sits between Intel's mid-range Cyclone/MAX series and high-end Stratix families, targeting mid-to-high throughput signal processing, wireless baseband, and broadcast applications.
The 10AS048H2F34I2SG delivers 480K logic elements, embedded memory of approximately 28 Mb (M20K blocks plus distributed LUT-RAM), and variable-precision DSP blocks supporting fixed- and floating-point operations. The 1.5 GHz ARM Cortex-A9 dual-core HPS runs embedded operating systems such as Linux or VxWorks, while the FPGA fabric handles accelerators, custom I/O, and high-bandwidth signal processing. Multi-gigabit transceivers and external memory interfaces (DDR3/DDR4 with ECC support) make it suitable for data-intensive designs.
Typical applications include wireless baseband processing, software-defined radio, broadcast video processing, radar signal processing, industrial machine vision, and high-performance embedded computing. The combination of a deterministic real-time FPGA fabric with an application processor makes the part well-suited to designs that must execute both control-plane software and high-throughput DSP concurrently.
When designing with this device, ensure that PCB layout follows Intel's recommended stackup and length-matching rules for DDR4 interfaces and that thermal management accommodates the 35 x 35 mm package at full operating power. The industrial temperature grade (-40C to +100C for I2 suffix) supports deployment in non-automotive but thermally demanding environments.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Arria 10 SX ordering code space, and practical design notes that go beyond the manufacturer datasheet alone.
Drop-in-Alternativen für 10AS048H2F34I2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048H2F34I2SG (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Mounting Type, Logic Elements, Operating Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048H2F34I2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2712.45 / Stück
Datenblatt ansehen →10AS048H1F34I1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2650 / Stück
Datenblatt ansehen →10AS048H2F34E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3120 / Stück
Datenblatt ansehen →10AS048H2F34E2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2280 / Stück
Datenblatt ansehen →10AS048H2F34E1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3650 / Stück
Datenblatt ansehen →10AS048H2F34I2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 1.5 GHz |
| Gehäuse | 1152-ball FC-FBGA (F34) |
| Package Size | 35 mm x 35 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Node | 20 nm |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
| Lead-Free | Yes (per RoHS compliance) |
| External Memory Support | DDR3/DDR4 with ECC (HPS and FPGA fabric) |
| Ordering Code Identifier | 10AS048 H2 F34 I2 SG |
10AS048H2F34I2SG 35 mm x 35 mm Pinbelegungsleitfaden
Pinbelegung für 10AS048H2F34I2SG (35 mm x 35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048H2F34I2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048H2F34I2SG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Software-Defined Radio (SDR), Broadcast Video Processing, Radar Signal Processing, Industrial Machine Vision, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS048H2F34I2SG's 480K logic elements and DSP block farm enable multi-antenna LTE and 5G NR physical-layer baseband processing in a single chip, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs the MAC scheduler and upper-stack protocols. The F34 FC-FBGA provides enough ball break-out for multi-gigabit transceivers connected to RFICs and ADCs, and DDR4 with ECC handles high-throughput sample buffers. Compared with separate FPGA-plus-processor designs, the SX integration cuts board area and lowers interconnect latency between the real-time fabric and the control plane, which is critical for HARQ feedback loops in 4G/5G systems.
Empfohlen
Software-Defined Radio (SDR)
SDR platforms benefit from the 10AS048H2F34I2SG's combination of wide-bandwidth ADC interfaces, large fabric for FFT/filters/modems, and the HPS for GNU-Radio-class control software. The 1.5 GHz Cortex-A9 dual core runs waveform applications while the FPGA fabric accelerates the physical-layer DSP chain, and DDR4 memory buffers I/Q samples between the fabric and HPS. Industrial temperature grade -40C to +100C supports outdoor tactical or commercial SDR deployments, while the FC-FBGA package enables the high-density mixed-signal PCB required for multi-channel converters.
Empfohlen
Broadcast Video Processing
The 10AS048H2F34I2SG is well-suited to 4K/UHD broadcast encoders, decoders, and format converters because its 480K LEs support multi-stream HEVC and JPEG-XS pipelines with low deterministic latency. The HPS runs control software and metadata extraction while the fabric handles pixel-rate processing, and the package's high I/O count drives multiple HDMI/SDI/12G-SDI links simultaneously. Industrial temperature grade supports studio-to-outside-broadcast truck deployments, and the integrated HPS removes the need for an external application processor that would otherwise consume board area and budget.
Empfohlen
Radar Signal Processing
Phased-array radar and SAR systems rely on the 10AS048H2F34I2SG's DSP throughput to perform pulse compression, MTI, and beamforming on raw ADC samples in real time. The HPS schedules tracks and target classification while the FPGA fabric runs the deterministic beamforming pipeline, all in one device. The FC-FBGA package's high ball count carries multiple JESD204B/C ADC links and high-speed serial backplanes to data recorders, and the industrial temperature range enables deployment on airborne, naval, and ground-mobile platforms.
Empfohlen
Industrial Machine Vision
Multi-camera machine vision systems benefit from the 10AS048H2F34I2SG's parallel sensor interfaces and embedded vision DSP blocks, which run convolutional and classical vision pipelines on 1080p/4K streams. The Cortex-A9 HPS at 1.5 GHz runs a Linux or RTOS-based vision application that triggers PLC actions or upload to the cloud, and DDR4 with ECC maintains frame buffer integrity in 24/7 factory environments. Industrial temperature grade and the rugged FC-FBGA package allow deployment on the factory floor near motors, drives, and welding equipment with confidence.
Empfohlen
High-Performance Embedded Computing
Defense and aerospace embedded computing platforms integrate the 10AS048H2F34I2SG as a single-board compute engine where the HPS runs VxWorks/Linux for system services and the FPGA fabric accelerates custom protocols or signal processing. The 480K LEs accommodate multiple 10GbE/40GbE MACs, custom serial buses, and protocol conversion logic, while the FC-FBGA package supports conduction-cooled ruggedized chassis. Industrial temperature grade and Intel's mature Arria 10 tool flow make this part a common choice for line-replaceable modules in defense and aerospace systems.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048H2F34I2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048H2F34I2LG | 10AS048H1F34I1HG | 10AS048H2F34E2SG | 10AS048H2F34E2LG | 10AS048H2F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (F34) | 1152-ball FC-FBGA (F34) | 1152-ball FC-FBGA (F34) | 1152-ball FC-FBGA (F34) | 1152-ball FC-FBGA (F34) | 1152-ball FC-FBGA (F34) |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 480000 | 480000 | 480000 | 480000 | 480000 | 480000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) - I1 sub-grade | Extended | Extended | Extended |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Same F34 FC-FBGA package and 480K LE silicon as the alternatives - drop-in candidate (vs. 10AS048H2F34I2LG)
- Industrial temperature grade I2 (-40C to +100C) - wider range than extended-grade E1/E2 (vs. 10AS048H2F34E1HG)
- F34 1152-ball FC-FBGA - same as 10AS032 and 10AS048 series with F34 package (vs. 10AS048E2F29I2SG)
Designhinweise
The F34 1152-ball FC-FBGA at 35 x 35 mm requires a high-layer-count PCB stackup (typically 12+ layers) with microvia or via-in-pad construction for breakout. Use Intel's published land-pattern and stackup recommendations in the Arria 10 device pin connection guidelines; the substrate controlled impedance must match the transceiver and DDR4 channels specified in the device datasheet. Power plane capacitance must be sized to handle the inrush during HPS cold-boot from the dedicated HPS power rail.
Estimated: with full HPS utilization and high FPGA fabric toggle rate, junction-to-ambient thermal resistance (theta_JA) for the F34 FC-FBGA package is approximately 2-4 C/W with a properly designed heat sink on the top side. Always confirm against the package thermal model and apply a heatsink with adequate airflow for closed-chassis deployments, especially in industrial temperature grade use cases where the junction max is 100C.
Do not assume all 10AS048H2F34xxxx ordering code suffixes are interchangeable; 'I2' vs 'I1', 'E2' vs 'E1', 'SG' vs 'LG' vs 'HG' may denote temperature sub-grades, speed grades, or shipping media that affect device behavior. Always cross-check the OPN against the Intel ordering information document before substituting. Likewise, F34 package parts cannot be dropped onto F29 footprints - the smaller 10AS048E2F29 series uses a different package with fewer balls.
Compliance-Informationen
RoHS compliance confirmed by Ampheo listing noting 'ROHS COMPLIANT'. AEC-Q100 not applicable - this is an FPGA SoC, not an automotive-qualified IC. REACH, halogen-free, and conflict-minerals compliance status not stated in the verified data.
