10AS048H3F34I2LG - Arria 10 SX SoC FPGA 480K LE | Intel
Teilenummer: 10AS048H3F34I2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3680 | $36.800,00 |
| 100 | $3420 | $342.000,00 |
| 500 | $3180 | $1.590.000,00 |
| 1.000 | $2960 | $2.960.000,00 |
10AS048H3F34I2LG Übersicht
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a hard processor subsystem (typically one or more ARM cores with cache, memory controller, and peripherals) with a fabric of programmable logic, embedded memory, and high-speed transceivers on a single die. The Arria 10 SX family sits in Intel's mid- to high-performance tier, between Cyclone V/10 and Stratix 10, and is commonly used where designers need both deterministic hardware acceleration in FPGA fabric and software flexibility in an applications processor running Linux or a real-time OS.
Key features of the 10AS048H3F34I2LG include approximately 480,000 logic elements, around 28.6 Mbits of embedded memory, 1,518 fixed-point 18x19 multipliers (or equivalent DSP blocks), 24 transceivers supporting backplane and chip-to-chip rates up to 14.4 Gbps, hard memory controllers, and a hard PCIe Gen2/Gen3 IP block. The integrated HPS exposes Ethernet MACs, USB, UART, SPI, I2C, SD/eMMC, NAND controllers, and DDR3/DDR4 SDRAM interfaces through the HPS fabric interface to the FPGA logic.
Architecturally, the Arria 10 SX uses Adaptive Logic Modules (ALMs), M20K on-chip SRAM blocks, variable-precision DSP blocks that can be reconfigured as 9x9, 18x19, or 27x27 multipliers, and a CoreSight debug fabric that allows JTAG-based multicore trace from the HPS side. The transceivers are organized into banks with support for protocols including PCIe Gen3 x1/x2/x4, 10 Gigabit Ethernet (10GBASE-KR/CR), CPRI, and Interlaken, which simplifies board design for backhaul and wireless-infrastructure systems.
Typical applications include wireless baseband and radio units (RRU/RRH), wireline backhaul aggregation, military and aerospace signal processing, high-performance industrial imaging and machine vision, broadcast video processing, and ASIC prototyping. The dual-core ARM Cortex-A9 with NEON media engine is well-suited to control-plane software stacks while the FPGA fabric accelerates DSP-intensive datapaths.
Designers should plan board layout for the 35 x 35 mm F34 package very carefully: high-speed transceiver channels must be length-matched within the tolerance listed in the Intel Arria 10 Device Family Pin Connection Guidelines, and multiple decoupling capacitor values are required across the core, transceiver, and HPS supply rails. Thermal management is critical at industrial temperature because the SoC die power can exceed 30 W under sustained DSP load.
This page consolidates distributor pricing, drop-in same-package alternatives from the Arria 10 family, and design notes that complement, rather than duplicate, the manufacturer datasheet.
Drop-in-Alternativen für 10AS048H3F34I2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048H3F34I2LG (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Elements, Mounting Type, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048H3F34I2SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AS048H3F34E2LG
✅ Drop-In✓ Auf Lager
$1280 / Stück
Datenblatt ansehen →10AS048H2F34I2LG
✅ Drop-In✓ Auf Lager
$2712.45 / Stück
Datenblatt ansehen →10AS048H2F34I2SG
✅ Drop-In✓ Auf Lager
$3505 / Stück
Datenblatt ansehen →10AS048H2F34E2SG
✅ Drop-In✓ Auf Lager
$3120 / Stück
Datenblatt ansehen →10AS048H1F34I1HG
✅ Drop-In✓ Auf Lager
$2650 / Stück
Datenblatt ansehen →10AS048H3F34I2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 1.5 GHz |
| Gehäuse | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Embedded Memory | Approximately 28.6 Mbits |
| DSP Blocks | Variable-precision, equivalent to 1,518 18x19 multipliers |
| Transceivers | 24 transceiver channels, up to 14.4 Gbps |
| Hard Memory Controller | DDR3/DDR4 SDRAM supported |
| Hard PCIe IP | PCIe Gen2/Gen3 |
| Betriebstemperatur | Industrial (-40C to +100C Tj) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Versorgungsspannung | 0.9 V core |
10AS048H3F34I2LG 1152-ball fc-fbga (f34), 35 x 35 mm Pinbelegungsleitfaden
Pinbelegung für 10AS048H3F34I2LG (1152-ball fc-fbga (f34), 35 x 35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048H3F34I2LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048H3F34I2LG ist geeignet für 6 Anwendungs: Wireless Baseband and Radio Units (RRU/RRH), ASIC Prototyping, Industrial Machine Vision and Image Processing, Broadcast Video Processing and Conversion, Defense and Aerospace Signal Processing, High-Performance Industrial Control and Test.
Wireless Baseband and Radio Units (RRU/RRH)
The 10AS048H3F34I2LG fits wireless RRU/RRH designs because its 24 transceivers support CPRI up to 14.4 Gbps with deterministic latency, while the HPS dual-core ARM Cortex-A9 runs the PHY control-plane and Linux on the same die. At 480K LE plus ~28.6 Mbits of embedded M20K SRAM, the fabric holds the channelizer, FFT, and digital predistortion blocks at line-rate without external memory pressure. Designers typically place the part between the antenna digitisers and the optical CPRI framer, with the HPS handling timing, synchronization via IEEE 1588, and the OAM software stack.
Empfohlen
ASIC Prototyping
ASIC prototyping is a strong fit because 480K LE plus ~1,518 18x19 multipliers and 24 high-speed transceivers map directly to most sub-25M ASIC gate designs. The HPS supplies an embedded control plane so that prototype drivers can be developed alongside the ASIC DUT logic, reducing bring-up time. Quartus Prime's TimeQuest timing analyzer and the partial reconfiguration flow let engineers iterate quickly when porting logic between FPGA and ASIC. The F34 1152-ball FC-FBGA footprint remains compatible across the 10AS032/048/066 density family, allowing in-place scaling as the design grows.
Empfohlen
Industrial Machine Vision and Image Processing
The 10AS048H3F34I2LG serves industrial machine-vision pipelines because its M20K SRAM and variable-precision DSP deliver low-latency filtering and feature extraction at full camera-line rate. The PCIe Gen3 hard IP, USB, and gigabit Ethernet on the HPS let the part interface to industrial cameras and host PCs simultaneously. Designers commonly run YOLOv3-tiny or classical CNN feature maps directly on the fabric, with the HPS orchestrating the camera trigger, illumination, and conveyor synchronization. The industrial temperature grade and robust 20 nm process are critical for 24/7 factory operation.
Empfohlen
Broadcast Video Processing and Conversion
Broadcast video processing and conversion (SMPTE ST 424 / ST 2081 / ST 2082) leverages the Arria 10 SX because of its high transceiver count and on-chip serializer/deserializer. The 10AS048H3F34I2LG can drive four 12G-SDI links at 12 Gbps, alongside embedded audio embedding and up/down/cross conversion, with the HPS handling the control plane, Ethernet tally, and SNMP. The fabric's M20K memory blocks store frame buffers without external SRAM overhead. Designers pair this part with HDMI 2.0 interfaces via external reclockers and frequently use it in master-control and contribution encoder chassis.
Empfohlen
Defense and Aerospace Signal Processing
The industrial temperature grade and the rugged FC-FBGA package suit defense and aerospace signal processing, including electronic-warfare EW, software-defined radio SDR, and radar pulse processing. 480K LE plus 24 transceivers offer the DSP density for adaptive beamforming and STAP algorithms, with the HPS running VxWorks or LynxOS for deterministic control. The Arria 10 SX family supports the wider Arria 10 GX military screening through Intel's Hi-Rel flow, and the same F34 footprint lets boards be qualified across commercial and rugged variants. Power dissipation in a sealed enclosure typically demands a cold plate or conduction-cooled heat sink.
Empfohlen
High-Performance Industrial Control and Test
High-performance industrial control and ATE (automatic test equipment) leverage the 10AS048H3F34I2LG because of its deterministic latency, PCIe Gen3 endpoint, and large DSP count for real-time signal conditioning. Engineers use the FPGA fabric to drive parallel DAC/ADC arrays while the HPS runs the Linux-based test sequencer, web UI, and EtherCAT master. The FC-FBGA package withstands the mechanical vibration of factory floors, and the industrial temperature grade ensures operation in unconditioned enclosures. Custom trigger and synchronization logic is implemented in hardware on the fabric for sub-microsecond jitter.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048H3F34I2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048H3F34I2SG | 10AS048H3F34E2LG | 10AS048H2F34I2LG | 10AS048H2F34I2SG | 10AS048H2F34E2SG | 10AS048H1F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (F34), 35x35 mm | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | 3 (highest Fmax) | 3 | 3 | 2 (10-15% lower Fmax) | 2 | 2 | 1 (slowest, ~20-30% lower Fmax) |
| Operating Temperature | Industrial (-40C to +100C Tj) | Industrial | Extended | Industrial | Industrial | Extended | Industrial |
| Transceiver Rate | Up to 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 12.5 Gbps typical at grade 2 | 12.5 Gbps typical | 12.5 Gbps typical | 10 Gbps typical |
| Tape-and-Reel Pin-1 | LG orientation | SG orientation | LG orientation | LG orientation | SG orientation | SG orientation | HG orientation |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Same F34 1152-ball footprint across all listed alternatives enables PCB reuse with zero re-spin (vs. 10AS048H3F34I2SG)
- Speed grade 3 enables 14.4 Gbps transceivers and highest Fmax (vs. 10AS048H2F34I2LG)
- Industrial temperature -40C to +100C Tj rating (vs. 10AS048H3F34E2LG)
- Higher DSP and memory density than the 10AS032 family (vs. 10AS032H3F34I3LG)
Designhinweise
Estimated: at typical industrial RRU operating point with 80% LUT utilization and 16 active transceivers at 10 Gbps, the 10AS048H3F34I2LG dissipates approximately 30 W. Junction temperature must stay below 100 C industrial Tj, so the heatsink plus thermal-interface material should target a theta_JA below 2.5 C/W. A graphite TIM with a copper heatsink plus 200 LFM airflow is the standard reference design; for sealed enclosures a conduction-cooled cold plate is required. Use the Intel Early Power Estimator (EPE) spreadsheet for the actual post-place-and-route power before committing to mechanical.
The F34 1152-ball FC-FBGA at 1.0 mm ball pitch requires a high-density PCB stackup: minimum 14 layers with mixed 1-2-1 microvia structures to fan out from the inner-row balls. Per the Arria 10 Device Family Pin Connection Guidelines, all I/O banks must have local 0.1 uF + 1 uF + 10 uF decoupling within 100 mil of the package balls, and each transceiver channel requires a 22 nF AC-coupling cap within 250 mil. Length-match the transceiver pairs to within 5 mil for 14 Gbps operation; use Intel's transceiver toolkit to verify. Reference schematics for the F34 package are available under NDA from Intel's Customer Design Center.
Three pitfalls appear repeatedly on first-time Arria 10 SX designs. First, HPS power sequencing: the HPS rails (1.0 V, 1.5 V, 3.3 V) must ramp before the FPGA core to avoid latch-up - read the Power Management section of the Arria 10 SoC datasheet and use a PMIC with explicit sequence control. Second, configuration: the HPS boots from QSPI flash and the FPGA fabric boots from a separate flash, but they can share a single QSPI if the pinout allows - verify the dual-image setup in the Quartus Prime Bootloader tool. Third, do not assume Intel-recommended transmitter settings for non-Intel PHY devices - the Arria 10 VOD, pre-emphasis, and equalization must be re-tuned per link.
Place the 10AS048H3F34I2LG in the centre of the PCB so all I/O banks can be routed with a single microvia stackup. Top and bottom layers should be reserved for short local signals and decoupling only. Transceiver channels should exit on the same edge of the package to keep the AC-coupling caps and external PHY in a single cluster; crossing channels across the package causes routing congestion and degrades signal integrity at 14 Gbps. Reference Intel's F34 package pinout diagram from the Arria 10 Device Family Pin Connection Guidelines, then freeze the pinout before schematic capture to avoid costly board re-spins.
Compliance-Informationen
RoHS and REACH compliant per Intel product environmental disclosure. Lead-free SAC405 ball finish. AEC-Q100 not applicable because this is an industrial-temp FPGA, not an automotive-qualified device.
