10AS057K1F35E1HG - Arria 10 SX SoC FPGA 570K LE | Intel
Teilenummer: 10AS057K1F35E1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1580 | $158.000,00 |
| 500 | $1410 | $705.000,00 |
| 1.000 | $1280 | $1.280.000,00 |
10AS057K1F35E1HG Übersicht
An SoC FPGA is a semiconductor device that combines a general-purpose processor subsystem (typically ARM Cortex-A series) with programmable FPGA logic on the same chip, sharing on-die interconnect, memory, and I/O resources. Compared to a discrete processor-plus-FPGA pair, an SoC FPGA reduces board area, latency between the two domains, BOM cost, and power consumption, while improving data throughput because the FPGA fabric can directly access the processor's DDR memory controller through a wide on-chip bus. The Arria 10 family in particular is the last Intel/Altera 20 nm generation and is widely deployed in long-lifecycle industrial, medical, and defense programs where process node changes force costly requalification.
Key features of 10AS057K1F35E1HG include 570K logic elements, 1.5 GHz maximum Cortex-A9 core frequency, 28.05 Mbit embedded memory, support for DDR4/DDR3 memory interfaces with hard controllers, 24 transceivers up to 17.4 Gbps, 384 DSP blocks, and dual ARM Cortex-A9 MPCore with NEON media engine and single/double-precision FPU. The hard processor system (HPS) includes 256 KB on-chip RAM, ECC-protected L1/L2 caches, USB 2.0, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, offloading peripheral management from the FPGA fabric.
Architecturally, the Arria 10 SX implements the HPS-FPGA bridge through a high-bandwidth on-chip interconnect with up to 128-bit data path, allowing the FPGA fabric to act as a configurable accelerator to the ARM cores or to operate as a master for data-plane I/O. The 20 nm process enables a mid-range logic density of 570K LEs with low static power, while the 17.4 Gbps transceivers support common backplane protocols such as PCIe Gen3 x4, 10 GbE, CPRI, and JESD204B for radio and instrumentation front ends.
Typical applications include software-defined radio (SDR) baseband processing, radar and electronic-warfare front ends, industrial machine vision with on-board inference, medical imaging accelerators, high-speed data acquisition, and motor-control platforms requiring deterministic ARM-side sequencing combined with parallel DSP work. The extended temperature grade makes it acceptable for harsh-environment deployments when full industrial screening is not required.
When designing with this device, plan power-delivery for the multiple HPS and FPGA rails early; the part requires at least five separate supply rails with strict sequencing, and the transceiver PLLs need clean analog supply filtering. Use Intel Quartus Prime with the SoC EDS toolchain to partition firmware (HPS-side Linux/RTOS) versus hardware (FPGA bitstream) and to validate the HPS-FPGA bridge performance in your traffic profile.
This page synthesizes distributor availability, real-time price tiers, and same-family drop-in alternatives for 10AS057K1F35E1HG that go beyond the standard manufacturer product page.
Drop-in-Alternativen für 10AS057K1F35E1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS057K1F35E1HG (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Transceivers, Memory Interfaces, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS057K2F35E1HG
✅ Drop-In✓ Auf Lager
$1995 / Stück
Datenblatt ansehen →10AS057K1F35E1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AS057K3F35E1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AS048K1F35E1HG
✅ Drop-In✓ Auf Lager
$3850 / Stück
Datenblatt ansehen →10AS066K1F35E1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AS057H1F35E1HG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AS057K1F35E1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS057 |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Gehäuse | 1152-ball FC-BGA (35x35 mm) |
| Speed Grade | -1 (F35) |
| Temperature Grade | Extended (E) |
| Transceivers | Up to 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Memory Interfaces | DDR4 / DDR3 with hard controllers |
| HPS Peripherals | USB 2.0, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC |
| Process Node | 20 nm |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AS057K1F35E1HG 1152-ball fc-bga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS057K1F35E1HG (1152-ball fc-bga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS057K1F35E1HG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS057K1F35E1HG ist geeignet für 6 Anwendungs: Software-Defined Radio (SDR) Baseband, Radar and Electronic Warfare Front Ends, Industrial Machine Vision and Inference, Medical Imaging Accelerators, High-Speed Data Acquisition and Instrumentation, Motor Control and Industrial Drives.
Software-Defined Radio (SDR) Baseband
The 10AS057K1F35E1HG is well suited to software-defined radio baseband processing where ARM Cortex-A9 handles the Linux/RTOS control plane, run-time waveform configuration, and Ethernet management, while the FPGA fabric executes parallel FFT/fir/decimator pipelines in dedicated DSP blocks. With up to 17.4 Gbps transceivers, the device can directly interface CPRI, JESD204B, and 10 GbE to ADC/DAC front ends without external PHY glue, reducing BOM count. The HPS-FPGA bridge allows low-latency shared memory between HPS and FPGA for sample streaming, a key advantage for cognitive-radio scenarios requiring sub-millisecond reconfiguration.
Empfohlen
Radar and Electronic Warfare Front Ends
For radar and electronic-warfare systems, the 10AS057K1F35E1HG combines 570K logic elements and 384 DSP blocks (per Arria 10 family data) to implement pulse compression, MTI filtering, and direction-finding algorithms in real time. The dual ARM Cortex-A9 MPCore runs the system health monitor, calibration tables, and target tracking classifier, offloading those tasks from the FPGA fabric for higher data throughput. Hard DDR4 controllers with ECC make the device suitable for long coherent-integration buffers required by modern SAR and AESA radar modes. The 20 nm process and extended temperature grade support deployment in airborne, shipboard, and ground-mobile platforms.
Empfohlen
Industrial Machine Vision and Inference
The 10AS057K1F35E1HG is well matched to high-end industrial machine vision where the FPGA fabric accelerates convolutional neural network inference or ISP pipelines, while the ARM Cortex-A9 subsystem runs the application layer, the PLC/Modbus interface, and the HMI. The HPS-FPGA shared memory bridge lets a Linux-side process post images to the FPGA and receive classification results with sub-frame latency, simplifying software architecture. The 1.5 GHz Cortex-A9 plus NEON engine can also run a fallback CPU-only inference path for low-power idle states. The 1152-ball FC-BGA provides enough I/O for 4-8 camera link or CoaXPress channels when paired with external PHYs.
Empfohlen
Medical Imaging Accelerators
Medical imaging systems such as ultrasound, CT, and MRI reconstruction accelerators use the 10AS057K1F35E1HG to process raw ADC data into displayable images. The 570K logic elements support a complete beamformer plus image-processing chain for cart-based ultrasound, while the dual ARM Cortex-A9 runs the user interface, DICOM stack, and patient database. Hard floating-point DSP blocks accelerate back-projection and compressed-sensing reconstruction on CT scanners, and the 17.4 Gbps transceivers stream raw data from the analog front end without bottlenecks. The 20 nm Arria 10 long-lifecycle commitment is a key advantage for FDA-cleared medical devices.
Empfohlen
High-Speed Data Acquisition and Instrumentation
The 10AS057K1F35E1HG is ideal for multi-channel data-acquisition and instrumentation platforms where the FPGA fabric aggregates ADC samples at rates of 5-10 GSPS per channel, performs real-time FFT, triggering, and decimation, and forwards qualified data to the ARM subsystem for storage, display, and protocol conversion. Up to 24 transceivers at 17.4 Gbps provide ample connectivity to high-end JESD204B ADCs and to host systems via 10 GbE or PCIe Gen3. The hard DDR4 controller with ECC supports deep capture memory for transient-recording applications. The extended temperature grade is suitable for outdoor and industrial test environments.
Empfohlen
Motor Control and Industrial Drives
The 10AS057K1F35E1HG fits high-end industrial motor control and servo-drive platforms where the ARM Cortex-A9 runs the safety PLC, EtherCAT/EtherNetIP master, and motion controller, while the FPGA fabric executes deterministic PWM generation, encoder interface, and field-oriented-control loops at sub-microsecond cycle times. The dual-core HPS plus the HPS-FPGA bridge allow Linux-side non-real-time tasks to coexist with hard-real-time FPGA logic on a single chip, eliminating the need for a separate MCU. The 1.5 GHz ARM provides ample processing for the kinematics, vibration analysis, and predictive maintenance algorithms common in modern servo drives.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS057K1F35E1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS057K2F35E1HG | 10AS057K1F35E1SG | 10AS057K3F35E1HG | 10AS048K1F35E1HG | 10AS066K1F35E1HG | 10AS057H1F35E1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-BGA (35x35 mm) | 1152-ball FC-BGA (35x35 mm) - same | 1152-ball FC-BGA (35x35 mm) - same | 1152-ball FC-BGA (35x35 mm) - same | 1152-ball FC-BGA (35x35 mm) - same | 1152-ball FC-BGA (35x35 mm) - same | 1152-ball FC-BGA (35x35 mm) - same |
| Family | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 (-16%) | 660,000 (+16%) | 570,000 |
| Speed Grade | -1 | -2 | -1 | -3 | -1 | -1 | -1 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) | Extended (E) | Extended (E) |
| Hard Processor System | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Transceiver Rate (max) | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Drop-in Compatible | Yes (reference) | Yes - speed grade change only | Yes - temperature grade change only | Yes - speed grade change only | Yes if design fits 480K LE (-16%) | Yes if design scales to 660K LE (+16%) | Yes - same bin label, H vs K letter |
Wichtigste Unterscheidungsmerkmale
- Highest mid-density Arria 10 SX SoC with 17.4 Gbps transceivers in F35 BGA (vs. 10AS048K1F35E1HG (480K LE))
- Identical 1152-ball F35 BGA pin/ball map vs 10AS066 (660K LE) and 10AS048 (480K LE) (vs. Xilinx Zynq-7000 XC7Z045)
- 20 nm process with 1.5 GHz ARM Cortex-A9 and DDR4 hard controller (vs. 10AS057K2F35E1HG (-2 speed grade))
Designhinweise
The 10AS057K1F35E1HG requires multiple independent supply rails (VCC, VCCP, VCCPT, VCCERAM, VCCBAT, VCCA_PLL, transceiver supplies, and HPS supplies) with strict power-up and power-down sequencing. Follow the Arria 10 pin connection guidelines to implement the POR and sequencing circuit, and route analog PLL supplies through a ferrite bead plus a low-noise LDO. Estimated: total in-rush current on a fully populated design can exceed 4 A on the 0.95 V core rail - size the Power Management IC (such as LTM4677 or ISL68201) for transient response, not just steady-state current.
Although the 1152-ball FC-BGA has a moderate junction-to-ambient thermal resistance, the 20 nm Arria 10 SX SoC dissipates 15-25 W in typical SoC workloads, and high transceiver utilization can push this above 30 W. Use a high-Tg multilayer PCB with at least 12 thermal vias in the BGA center array connecting to a solid inner-plane copper pour. For chassis-mounted industrial applications, an aluminum heat spreader or low-profile heatsink is recommended. Estimated: at 25 C ambient with no airflow, theta-JA of 4-6 C/W for a 35x35 FC-BGA gives a 100-150 C junction rise at 20 W dissipation - airflow is usually required.
The 1152-ball FC-BGA uses a 1.0 mm ball pitch with a 35x35 mm body, requiring at least an 8-layer PCB with 0.4-0.5 mm laser-drilled microvias and 1 oz copper. Escape routing for the 24 transceivers demands continuous reference-plane stack-up for the upper layers; never route a high-speed serial lane across a plane split. Use the Intel Arria 10 PCB design guidelines (formerly AN 528) to validate the stack-up, and follow the length-matching tables for the DDR4 interface, which can require 25-50 mil total length matching across byte groups.
Common pitfalls on 10AS057K1F35E1HG designs include: (1) omitting the configuration device (EPCQ-L or compatible) - the SoC HPS does not auto-load the FPGA bitstream; (2) forgetting the HPS cold-reset and warm-reset circuit - the HPS boot ROM requires proper reset timing; (3) not populating the JTAG header for both HPS and FPGA chains - the HPS debug access port (DAP) is a separate TAP; (4) ignoring the VREFP_ADC and VREFN_ADC pins, which must be tied to analog ground for unused HPS ADC inputs. Each of these has caused field failures in early Arria 10 SX designs.
Place the 10AS057K1F35E1HG centrally on the board to minimize DDR4 trace length and to keep transceiver lanes short and balanced. Decoupling capacitors (100 nF and 4.7 uF) must be placed within 100 mil of the relevant supply balls, with vias in the BGA escape array. Route HPS Ethernet and USB differential pairs with 90 ohm differential impedance and 2-3 W spacing rules; route transceivers per the Intel LVDS and Transceiver layout guidelines. Estimated: a 6-layer PCB with 1-oz copper and 0.2 mm dielectric can support DDR4-2400 to the HPS at 1.5 GHz.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product page. The 10AS057K1F35E1HG is not AEC-Q100 qualified; this is an industrial-grade SoC FPGA not intended for automotive safety applications.
