10AX090N2F45E1SG - Arria 10 GX 900K LE FPGA | Intel | F45 1932-BGA
Teilenummer: 10AX090N2F45E1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12450 | $12.450,00 |
| 10 | $11990 | $119.900,00 |
| 25 | $11500 | $287.500,00 |
| 100 | $10800 | $1.080.000,00 |
| 250 | $10250 | $2.562.500,00 |
10AX090N2F45E1SG Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device containing configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and high-speed transceiver channels. FPGAs are placed in the broader semiconductor hierarchy between ASICs and CPLDs: an ASIC is a custom-designed IC with fixed logic, while a CPLD is a smaller, non-volatile programmable device, and an FPGA occupies the high-density, high-performance end of the programmable logic spectrum. The Arria 10 family extends the mid-range Arria series with 20nm technology and hardened floating-point DSP blocks, targeting throughput-intensive applications where ASIC development cost is not justified.
Key features include 24 transceiver channels supporting protocols such as PCI Express Gen3, 10 Gigabit Ethernet, and Serial RapidIO, hard memory controllers for DDR3/DDR4 with ECC, and partial reconfiguration capability. The integrated Security Manager supports AES-256, SHA-256, and public-key cryptography for design protection. Configuration is via passive serial, fast passive parallel, or JTAG. On-chip clocking uses a high-precision PLL architecture supporting fractional-N synthesis.
Architecturally, the device uses a 20nm TSMC process with Adaptive Logic Modules (ALMs) of 8-input fracturable look-up tables. The transceiver physical layer integrates hard PCS and PMA blocks, reducing soft-logic overhead and lowering power per gigabit compared to earlier 28nm Arria V devices.
Typical applications include 100G optical transport line cards, software-defined radio (SDR) baseband processing, military radar front-ends, and 4K video broadcast infrastructure. The combination of transceiver count and logic capacity suits designs where both protocol bridging and DSP-intensive baseband processing are needed.
When designing with this FPGA, plan for the thermal envelope of a 1932-ball FCBGA - typical power ranges from 25-40W at full transceiver load, requiring a multi-layer PCB with a heat-spreader or heatsink. The Intel Quartus Prime design suite is required; the device is supported in Quartus Prime Standard or Pro editions.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives from the Arria 10 and Arria 10 SoC families, and practical thermal and PCB layout notes not collected in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AX090N2F45E1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX090N2F45E1SG (gleiche Bauform und Footprint) – abweichend in Package, Embedded Memory, DSP Blocks, Operating Temperature Grade, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090N2F45E2SG
✅ Drop-In✓ Auf Lager
$4943.22 / Stück
Datenblatt ansehen →10AX090N2F45I1SG
✅ Drop-In✓ Auf Lager
$6450 / Stück
Datenblatt ansehen →10AX090N2F45E3SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX090N2F45I2SG
✅ Drop-In✓ Auf Lager
$3475 / Stück
Datenblatt ansehen →10AS090N2F45E1SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX090N2F45I3SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX090N2F45E1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Number of User I/O | 768 |
| Transceiver Channels | 24 |
| Max Transceiver Data Rate | 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.85 V to 0.9 V |
| Speed Grade | 2 |
| Betriebstemperatur | -40C to +100C (industrial, I=1 in OPN suffix indicates industrial) |
| Gehäuse | 1932-ball FC-FBGA (F45) |
| Montageart | Surface Mount (BGA) |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG |
| Hard Memory Controllers | DDR3/DDR4 with ECC |
| PCIe Hard IP | PCI Express Gen3 x8 (hard IP) |
| Security Features | AES-256, SHA-256, public-key (Design Security) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AX090N2F45E1SG 1932-ball fc-fbga (f45) Pinbelegungsleitfaden
Pinbelegung für 10AX090N2F45E1SG (1932-ball fc-fbga (f45)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX090N2F45E1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX090N2F45E1SG ist geeignet für 6 Anwendungs: 100G Optical Transport Line Card, Software Defined Radio (SDR) Baseband, 4K Video Broadcast Infrastructure, Military Radar Front-End Processing, High-Speed Test & Measurement Instrumentation, Data Center Acceleration Card.
100G Optical Transport Line Card
The 10AX090N2F45E1SG is well-matched to OTU-4 / 100G Ethernet line cards because it provides 24 transceiver channels at up to 14.1 Gbps, which can be aggregated into a 100G pipe using four CAUI-10 lanes or ten 10G channels. Its 900K logic elements and 59 Mbit of embedded memory are sufficient for OTN framing, GFP-F mapping, and MAC-layer processing, while hard PCIe Gen3 and 10GbE MACs reduce soft-logic overhead. The device's 768 user I/Os accommodate multiple QSFP28 cages plus backplane serial links. Placed on a host card with the FPGA between QSFP28 cages and a switch ASIC, it provides framer/PCS bridging with deterministic latency under 1 microsecond across the pipeline. Trade-off: the F45 BGA package forces a large PCB footprint, but this is acceptable for ATCA-style line cards where board area is not the binding constraint.
Empfohlen
Software Defined Radio (SDR) Baseband
For SDR baseband processing in military and commercial wireless systems, the 10AX090N2F45E1SG delivers the DSP throughput required for wideband channelization and demodulation. The Arria 10 family integrates hardened floating-point DSP blocks that operate at up to 1.5 GFLOPs per block, enabling FFT-based channelizers and digital down-converters that fit comfortably in 900K LEs. The 24 transceivers at 14.1 Gbps support ADC/DAC JESD204B/C links to RF front-ends, and 768 user I/Os are useful for parallel LVDS control paths to tuners. Power typically falls in the 25-40W envelope at full DSP load, which is within the thermal capability of a properly heat-spreaded F45 BGA. Compared with a Stratix V implementation, this Arria 10 design typically yields 30% lower power per FLOP.
Empfohlen
4K Video Broadcast Infrastructure
The 10AX090N2F45E1SG is widely used in broadcast video processing - including 4K/UHD up/down/cross-conversion, color-space conversion, and light compression pre-processing. Its 900K logic elements and ample embedded memory support multi-stream 4K processing at 60 fps, and the 768 user I/Os handle multiple 12G-SDI / DisplayPort 1.4 interfaces via soft HDMI 2.0 or 12G-SDI IP. Hard PCIe Gen3 x8 IP supports a host link to a video server or storage controller. Placed between SDI ingest and a render farm, it provides deterministic frame buffering and color-space transform without external memory in many cases. The F45 BGA allows compact mezzanine cards (e.g., 80mm x 100mm) using only the user I/Os needed.
Empfohlen
Military Radar Front-End Processing
In phased-array radar front-ends, the 10AX090N2F45E1SG performs beamforming, pulse compression, and Doppler filtering across thousands of antenna elements. Its DSP blocks compute FFTs and FIR filters at line rate, while 24 transceivers at 14.1 Gbps accept serialized data from ADC-per-element front-ends. The 768 I/Os provide synchronization and timing distribution to RF chains. Placed adjacent to the RF front-end on a VPX or VITA-67 card, it minimizes latency between ADC samples and beamforming weights. The industrial temperature variant of this device supports -40C to +100C operation, critical for airborne and naval radar platforms.
Empfohlen
High-Speed Test & Measurement Instrumentation
The 10AX090N2F45E1SG suits high-end oscilloscopes, BERTs, and protocol analyzers where waveform reconstruction, pattern generation, and protocol decoding must run in real time. 900K logic elements support state-machine-based protocol decoders (PCIe, USB 3.x, SATA), while the transceivers drive and receive at up to 14.1 Gbps for multi-lane pattern generation. Hard memory controllers with ECC interface DDR3/DDR4 acquisition memory directly. The 768 user I/Os accommodate analog front-end control and front-panel switching. Compared with an ASIC at this volume, the FPGA provides the flexibility to support multiple protocols from a single platform.
Empfohlen
Data Center Acceleration Card
In hyperscale data centers, the 10AX090N2F45E1SG is deployed as a compute acceleration or network processing card offloading cryptography, compression, or NVMe-oF storage tasks from host CPUs. Its 24 transceivers at 14.1 Gbps support multiple 25G / 50G Ethernet links, and hard PCIe Gen3 x8 IP interfaces to a host CPU. 900K logic elements implement block ciphers (AES-256 via Design Security IP), gzip compression, or NVMe controller logic. Placed in a half-height, half-length PCIe card with a passive heatsink, it provides 20-40 Gbps of sustained offload throughput. Compared with a discrete NIC, the FPGA enables protocol-agnostic offload without silicon respins.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX090N2F45E1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX090N2F45E2SG | 10AX090N2F45I1SG | 10AX090N2F45E3SG | 10AX090N2F45I2SG | 10AS090N2F45E1SG | 10AX090N2F45I3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FC-FBGA (F45) | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Max Transceiver Data Rate | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Speed Grade | 2 (E1) | 2 (E2) | 2 (I1) | 3 (E3) | 2 (I2) | 2 (E1) | 3 (I3) |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) |
| Variant | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 SoC (with ARM Cortex-A9 HPS) | Arria 10 GX (FPGA) |
Wichtigste Unterscheidungsmerkmale
- Largest F45 BGA package variant in the Arria 10 GX 900K LE family (vs. 10AX090N2F40E1SG (F40 40mm BGA, ~15% fewer I/Os))
- Extended temperature grade with industrial silicon process (vs. 10AX090N2F45C1SG (commercial temp variant))
- Pure FPGA fabric - no SoC HPS subsystem overhead (vs. 10AS090N2F45E1SG (Arria 10 SoC variant))
Designhinweise
Estimated: at full transceiver load (24 ch at 14.1 Gbps) plus 60% logic utilization, total power for the 10AX090N2F45E1SG typically reaches 35W. The 1932-ball F45 FC-FBGA has theta_JA around 0.6 C/W with a thermal interface material to a heatspreader (per Arria 10 thermal chapter). A heatspreader plus 200 LFM airflow or a pin-fin heatsink is required; junction-to-ambient should be held below 25 C/W to keep Tj under 100 C in the extended temp grade.
The F45 FC-FBGA uses a 1.0 mm ball pitch, requiring HDI PCB construction with microvia-in-pad for the inner ball rows. Per Arria 10 PCB design guidelines, a 12-layer stackup with 4-6 routing layers and dedicated ground/power planes is recommended. Decoupling: place 0402 0.1uF X7R capacitors on every VCC/VCCPT pin within 5 mm, with bulk 22uF/47uF tantalum or polymer capacitors at the FPGA perimeter. Transceiver TX/RX lanes should be length-matched within 0.13 mm (PCIe Gen3 tolerance).
The Arria 10 GX requires at least 7 distinct supply rails: VCC (core 0.9V), VCCPT (periphery), VCCA_PLL, VCCAUX (1.8V), VCCIO (1.2-3.0V bank-dependent), VCCBAT (battery backup for key programming), and transceiver VCCR/VCCT/VCCP_HSSI. Per Intel's PowerPlay guidance, ramp VCC first, then VCCPT and VCCAUX within 100 ms; reverse sequence on power-down. A multi-rail sequencer (e.g., LTC2977 or similar) is recommended; tie CONF_DONE to reset logic to gate downstream rail enablement.
Common layout pitfalls: (1) routing a high-speed RX trace over a power plane split (creates a return-path discontinuity and EMI); (2) failing to assign non-transceiver I/O banks to bank voltages matching the attached standard (e.g., 1.8V LVCMOS vs 1.2V LVDS); (3) leaving the MSEL pins floating - they must be hard-tied to VCCPGM or GND per the configuration scheme selected. Per the Arria 10 pin connection guidelines, JTAG TCK should be AC-grounded with a 10k pull-down if unused to prevent false clocking.
Compliance-Informationen
RoHS/REACH compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; for automotive applications use the Cyclone V or Arria 10 automotive variants.
