10AX090N2F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
MPN: 10AX090N2F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6182.78 | $6,182.78 |
| 10 | $5870.64 | $58,706.40 |
| 100 | $5561.5 | $556,150.00 |
| 500 | $5252.36 | $2,626,180.00 |
| 1,000 | $4943.22 | $4,943,220.00 |
Drop-in alternatives for 10AX090N2F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N2F45E2LG
✅ Drop-In✓ In Stock
$6095.25 / Unit
View Datasheet →10AX090N2F45E1SG
✅ Drop-In✓ In Stock
$10250 / Unit
View Datasheet →10AX090N2F45E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 23,104 Kbits |
| User I/O Count | 768 |
| DSP Blocks | 24 (variable precision, hardened FP) |
| Transceivers | Up to 12.05 Gbps |
| Package | 1932-ball FCBGA (F45) |
| Process Technology | TSMC 20nm |
| PCI Express Hard IP | Yes (Gen3 capable) |
| External Memory Support | DDR4 up to 1,200 MHz, DDR3, QDR IV, RLDRAM III |
| Hard Processor System | Dual ARM Cortex-A9 MPCore (on SoC variants) |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Avalon-ST |
| Operating Temperature Grade | E2 (extended) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AX090N2F45E2SG 1932-ball fcbga (f45) Pin Configuration Guide
Complete pinout information for 10AX090N2F45E2SG (1932-ball fcbga (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N2F45E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F45E2SG is suitable for 6 applications: 4K Video Processing & Broadcast Equipment, 100G/400G Optical Transport Networking, Radar & Electronic Warfare Signal Processing, Medical Imaging Systems (CT/MRI Back-End), 4G/5G Baseband Prototyping & PHY Layer, High-Performance Computing Acceleration.
4K Video Processing & Broadcast Equipment
The 10AX090N2F45E2SG fits 4K video processing and broadcast equipment because its 900,000 logic elements provide headroom for multi-stream 12G-SDI processing, color-space conversion, and HDR pipeline logic. The integrated transceivers natively support 12G-SDI (11.88 Gbps) and 6G-SDI data rates without external PHYs, reducing BOM cost on broadcast routers and video switchers. The 768 user I/O count accommodates parallel camera interface aggregation, while the 23,104 Kbit embedded memory buffers line buffers for frame-rate conversion. Estimated: at 300 MHz fabric speed, the device sustains simultaneous processing of two 4K60 streams.
Recommended
100G/400G Optical Transport Networking
The 10AX090N2F45E2SG is well-matched to 100G optical transport networking because its transceiver channels operate up to 12.05 Gbps, allowing aggregation to 100G via 10x10G or 4x25G CAUI-2/-4 architectures. The 900K-LE fabric absorbs OTN framer, FEC (RS(255,239) and RS(255,239) with KP4), and 100GbE MAC functions without external co-processors. The hardened PCI Express Gen3 hard IP and 10GbE MAC simplify PHY-layer integration, while DDR4 support at 1,200 MHz provides line-rate buffering. Estimated: full 100G OTU4 processing consumes ~70% of the 900K LE fabric.
Recommended
Radar & Electronic Warfare Signal Processing
The 10AX090N2F45E2SG suits radar and electronic warfare signal processing because its 24 hardened floating-point DSP blocks deliver up to 1.5 TFLOPs of single-precision throughput, sufficient for pulse compression, MTI filtering, and DOA estimation. The 900K-LE fabric hosts the beamforming and direction-finding control logic, while the 23,104 Kbit embedded memory stages FFT samples at radar PRF rates. Transceivers support direct ADC interface at up to 12.05 Gbps for digital receivers, eliminating external deserializer ASICs. Estimated: at 300 MHz, a 4096-point FFT completes in approximately 13.6 microseconds.
Recommended
Medical Imaging Systems (CT/MRI Back-End)
The 10AX090N2F45E2SG fits medical imaging back-end processing because its 900K logic elements execute filtered back-projection and iterative reconstruction algorithms for CT image pipelines, while the 24 hardened floating-point DSP blocks accelerate sinogram-to-image transforms. The DDR4 interface up to 1,200 MHz streams raw detector data at sustained line rates, and the embedded memory tiles (M20K blocks) buffer reconstructed slice data. Transceivers aggregate multi-channel ADC inputs directly, while the PCI Express Gen3 link interfaces to the host workstation. Reliability is critical; the E2 temperature grade supports hospital equipment thermal envelopes.
Recommended
4G/5G Baseband Prototyping & PHY Layer
The 10AX090N2F45E2SG is suitable for 4G/5G baseband prototyping because its 12.05 Gbps transceivers interface directly with CPRI and OBSAI fronthaul links, while the 900K LE fabric hosts soft PHY LTE Turbo and 5G LDPC encoders/decoders with measured throughput headroom. The hardened DSP blocks execute the complex matrix operations of MIMO detection, and the DDR4 interface sustains multi-carrier sample buffers. Researchers use the partial reconfiguration feature to swap reference algorithms rapidly. Estimated: full 4x4 MIMO 20 MHz LTE PHY consumes ~40% of the 900K LE fabric.
Recommended
High-Performance Computing Acceleration
The 10AX090N2F45E2SG serves high-performance computing acceleration because the PCI Express Gen3 x8 hard IP delivers up to 8 GB/s host bandwidth, and the 900K-LE fabric hosts custom OpenCL/C kernels for offloading compute-intensive functions such as financial Monte Carlo simulation, genomics alignment, or database query acceleration. The 24 hardened floating-point DSP blocks and the 23,104 Kbit embedded memory provide high on-chip compute density, while transceivers aggregate multiple accelerator cards into HPC fabrics via serial protocols. The DDR4 interface supports large working-set datasets without host round-trip.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N2F45E2LG | 10AX090N2F45E1SG | 10AX090N2F40I2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40) - different ballout |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Kbits) | 23,104 | 23,104 | 23,104 | 23,104 |
| User I/O Count | 768 | 768 | 768 | [DATA_NEEDED: smaller F40 package reduces I/O] |
| Temperature Grade | E2 (extended) | E2 (extended) | E1 (extended, slightly narrower range) | I2 (industrial) |
| Transceiver Max Rate | 12.05 Gbps | 12.05 Gbps | 12.05 Gbps | 12.05 Gbps |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- High 900K LE density with 768 user I/O (vs 10AX066N2F40E1SG)
- Largest F45 1932-ball FCBGA with full transceiver complement (vs 10AX090N2F40I2SG)
- Drop-in compatible with E1 and E2 temperature variants (vs 10AX090N2F45E1SG)
Design Notes
Estimated: Use Intel's PowerPlay Early Power Estimator (EPE) before schematic capture. A 900K-LE Arria 10 design at 300 MHz logic utilization typically draws 12-18W on the 0.95V core rail, plus 2-4W on 1.8V I/O and 4-6W on transceiver rails. Sequence the core rail first; the I/O and transceiver rails must follow. Decouple each rail with 10uF bulk plus 0.1uF/0.01uF high-frequency ceramics placed within 5mm of the package balls.
The 1932-ball FCBGA package dissipates 20-25W typical in mid-utilization designs. Estimate: with theta_JA of approximately 9 C/W (still-air, JEDEC 4-layer test board), junction-to-ambient delta T is ~200C at 22W. A heatsink with thermal interface material and 200-400 LFM airflow is mandatory. Mount the BGA on a PCB with continuous internal ground planes and stitched thermal vias under the package to spread heat to inner layers.
Use a minimum 8-layer PCB with controlled-impedance routing for transceivers (100 ohm differential for transceivers, 50 ohm single-ended for clocks, 85/100 ohm differential for DDR4). Maintain BGA breakout within the first 8mm using microvia-in-pad or HDI stackup with 0.4mm pitch escape. Route transceivers with length matching within 0.127 mm (5 mil) for the TX and RX pairs of the same channel. Provide reference plane continuity under all high-speed traces.
Do not assume 'E2' parts work at the same temperature range as 'I2' or 'E1' - check Intel's specific thermal tables. Do not skip the SmartVID configuration; without it the device may request an unsupported voltage. Do not use passive serial configuration with the wrong EPCQ device density. For configuration, ensure MSEL[2:0] pins are pulled correctly via 4.7kΩ to match the desired configuration scheme (AS x1, AS x4, JTAG, FPP, PS).
Compliance Information
RoHS compliant per Intel Altera product page. Not AEC-Q100 qualified - FPGAs in this density class are typically not AEC-Q100; for automotive-grade FPGA options consider lower-density Cyclone families or Spartan-7 class devices. Lead-free solder balls standard on E2/LG variants.
