10AX090N2F45I1SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Intel
MPN: 10AX090N2F45I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8245 | $8,245.00 |
| 10 | $7900 | $79,000.00 |
| 100 | $7350 | $735,000.00 |
| 500 | $6890 | $3,445,000.00 |
| 1,000 | $6450 | $6,450,000.00 |
Drop-in alternatives for 10AX090N2F45I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AX090N2F45I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| DSP Blocks | 3,456 |
| Maximum User I/Os | 768 |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Transceiver Protocols | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 |
| Hard Memory Controllers | DDR3/DDR4 with ECC |
| Process Technology | TSMC 20nm |
| Core Voltage | 0.9 V (nominal) |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 1932-ball FCBGA (F45) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Scheme | JTAG, Active Serial, Passive Serial |
10AX090N2F45I1SG 1932-ball fcbga (f45) Pin Configuration Guide
Complete pinout information for 10AX090N2F45I1SG (1932-ball fcbga (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N2F45I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F45I1SG is suitable for 6 applications: 4K/UHD Video Processing and Broadcast, Wireless Baseband and Radio Head Design, Radar and Electronic Warfare Signal Processing, Industrial Machine Vision and Inspection, High-Performance Computing Accelerators, Medical Imaging and Diagnostics.
4K/UHD Video Processing and Broadcast
The 10AX090N2F45I1SG's 900,000 logic elements, 3,456 DSP blocks, and 59 Mbits embedded memory make it ideal for 4K/UHD video processing pipelines including HEVC/H.265 encoding, broadcast format conversion, and multi-stream transcoding. Its 17.4 Gbps transceivers handle uncompressed 4K@60fps streams over 12G-SDI or SMPTE 2022-5/6 IP, while DDR4 interfaces provide frame buffering for real-time processing. Compared to smaller Arria 10 variants, the 900K LE device supports multiple parallel codecs without resource exhaustion, reducing system cost by eliminating external processor chips.
Recommended
Wireless Baseband and Radio Head Design
In 4G LTE Advanced and 5G NR baseband units (BBU) and remote radio heads (RRH), the 10AX090N2F45I1SG's hardened CPRI and JESD204B transceivers at 17.4 Gbps support up to 24 antenna streams with native fronthaul connectivity. The 3,456 DSP blocks accelerate FFT/iFFT, channel estimation, and crest-factor reduction (CFR) operations. Industrial temperature grading (-40C to +100C) suits outdoor RRH deployment. The 900K LE density enables complete PHY-layer implementation plus MAC framer, eliminating separate DSP processors in compact radio designs.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX090N2F45I1SG delivers defense-grade signal processing capability with 3,456 DSP blocks performing pulse-Doppler radar FFTs, digital beamforming, and electronic countermeasures in real time. Its 17.4 Gbps transceivers ingest multi-channel ADC data from RF front-ends via JESD204B, while the 59 Mbit embedded memory provides windowing buffers and CFAR detection tables. Industrial temperature grading ensures operation in harsh military environments. Compared to DSP processors, the FPGA achieves 10-50x faster FFT throughput per watt, critical for size, weight, and power (SWaP)-constrained platforms.
Recommended
Industrial Machine Vision and Inspection
For high-speed machine vision systems inspecting semiconductors, pharmaceuticals, and automotive parts, the 10AX090N2F45I1SG delivers parallel pixel processing across its 900K LEs. The 17.4 Gbps transceivers accept CoaXPress or 10 GigE Vision streams from multiple line-scan cameras, while 3,456 DSP blocks run Sobel filtering, blob analysis, and AI inference at line rates exceeding 100 kHz. DDR4 controllers buffer multi-megapixel frames. Industrial temperature grading supports factory floor environments, and the 768 user I/Os handle parallel sensor arrays and motor-control feedback.
Recommended
High-Performance Computing Accelerators
The 10AX090N2F45I1SG serves as a PCIe Gen3 x8 hardware accelerator in HPC clusters, where its 900K LEs and 3,456 DSP blocks offload compute-intensive kernels such as genomic alignment, financial Monte Carlo simulation, and cryptography from host CPUs. The 17.4 Gbps transceivers enable 100 GbE network connectivity for distributed computing, while DDR4 controllers provide high-bandwidth memory access. Compared to GPU accelerators, the FPGA achieves 5-10x better performance-per-watt for streaming workloads with deterministic latency.
Recommended
Medical Imaging and Diagnostics
In CT scanners, MRI reconstruction, and ultrasound beamforming, the 10AX090N2F45I1SG's 17.4 Gbps transceivers accept raw RF data from multi-channel ADC arrays, while 3,456 DSP blocks perform filtered back-projection (FBP) and iterative reconstruction in real time. The 59 Mbit embedded memory holds projection data and sinograms, reducing external memory accesses by 40%. Industrial temperature grading supports cart-mounted diagnostic equipment. The FPGA's deterministic latency enables precise synchronization of imaging subsystems, critical for diagnostic accuracy.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F45I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N2F45E2SG | 10AX090N2F45E1SG | 10AX090N2F45E2LG | 10AX090N2F40I2SG | 10AX090N2F40I1SG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40) - similar | 1932-ball FCBGA (F40) - similar | 1932-ball FCBGA (F40) - similar |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Transceiver Speed | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 43,597,056 bits |
| DSP Blocks | 3,456 | 3,456 | 3,456 | 3,456 | 3,456 | 3,456 | 2,438 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +100C (Extended Commercial) | 0C to +100C (Extended Commercial) | 0C to +100C (Extended Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +100C (Extended Commercial) |
| Speed Grade | 1 (fastest) | 2 | 1 | 2 | 2 | 1 | 1 |
| Unit Price (qty 1, USD) | $8,245.00 | $7,890.00 | $8,100.00 | $7,950.00 | $7,400.00 | $7,650.00 | $5,890.00 |
Key Differentiators
- Highest transceiver speed in 900K LE Arria 10 family (vs 10AX090N2F40I1SG)
- Industrial temperature grading for harsh environments (vs 10AX090N2F45E1SG)
- Same high-density fabric across F45 speed-grade variants (vs 10AX066N2F40E1SG)
Design Notes
The 1932-ball FCBGA package at 1 mm ball pitch demands a minimum 12-layer PCB stackup with high-speed layers referenced to solid ground planes. Escape routing must use microvias (laser-drilled, 0.1 mm pad) on the top two layers, with through-vias from layer 3 downward. Estimate: total BGA breakout requires approximately 4-6 routing layers just for signal escape, plus dedicated ground and power layers.
The 0.9V core rail can demand transient currents exceeding 60A at full FPGA utilization. Use a multi-phase synchronous buck regulator with at least 4 phases and low-ESR ceramic output capacitors (e.g., 22x 22uF X5R 0805). Place input capacitors within 5 mm of the VCCT pins. Add bulk tantalum or polymer capacitors (470uF) near the regulator. Decoupling: one 0.1uF + one 1nF per power pin pair. Estimated: 8-layer PCB with 2oz copper on power layers is required to handle peak current without excessive voltage droop.
At maximum utilization with 100% toggle rate, junction power can exceed 25W. The FCBGA package has theta_JA of approximately 8 C/W with 100 LFM airflow, requiring a heatsink with thermal resistance below 1 C/W. Estimate: with junction temp limit of 100C (industrial grade) and ambient 70C, allowable rise is 30C, demanding thermal solution theta_JA below 1.2 C/W. Use thermal interface material (TIM) with conductivity above 3 W/mK and ensure heatsink mounting pressure of 30-50 psi.
17.4 Gbps transceivers require strict impedance control: 100 ohm differential microstrip or stripline with tolerance +/-10%. Via stubs must be back-drilled to minimize reflections at >10 Gbps. Reference Intel AN 613 reference design for channel budget and pre-emphasis/equalization settings. Place AC coupling capacitors (100nF X7R 0201) within 200 mil of TX/RX pins for optimal signal integrity.
Common pitfalls: (1) configuring JTAG pins as user I/O, bricking the device - always reserve JTAG pins or use external configuration controller; (2) insufficient cooling causing thermal throttling below 100C junction; (3) improper MSL handling - the FCBGA package is MSL3 with 168-hour floor life; (5) failing to enable soft-error detection in safety-critical applications. Always generate the design with Intel Quartus Prime and verify pin assignments against the F45 pinout file.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product page. Industrial temperature grade (-40C to +100C). AEC-Q100 not applicable for FPGA logic devices.
