10AX090N2F45E1SG - Arria 10 GX 900K LE FPGA | Intel | F45 1932-BGA
MPN: 10AX090N2F45E1SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12450 | $12,450.00 |
| 10 | $11990 | $119,900.00 |
| 25 | $11500 | $287,500.00 |
| 100 | $10800 | $1,080,000.00 |
| 250 | $10250 | $2,562,500.00 |
Drop-in alternatives for 10AX090N2F45E1SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090N2F45E2SG
β Drop-Inβ In Stock
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View Datasheet β10AX090N2F45I1SG
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$6450 / Unit
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β Drop-Inπ Reference alternative (not in catalog)
10AX090N2F45I2SG
β Drop-Inβ In Stock
$3475 / Unit
View Datasheet β10AS090N2F45E1SG
β Drop-Inπ Reference alternative (not in catalog)
10AX090N2F45I3SG
β Drop-Inπ Reference alternative (not in catalog)
10AX090N2F45E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Number of User I/O | 768 |
| Transceiver Channels | 24 |
| Max Transceiver Data Rate | 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.85 V to 0.9 V |
| Speed Grade | 2 |
| Operating Temperature | -40C to +100C (industrial, I=1 in OPN suffix indicates industrial) |
| Package | 1932-ball FC-FBGA (F45) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG |
| Hard Memory Controllers | DDR3/DDR4 with ECC |
| PCIe Hard IP | PCI Express Gen3 x8 (hard IP) |
| Security Features | AES-256, SHA-256, public-key (Design Security) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX090N2F45E1SG 1932-ball fc-fbga (f45) Pin Configuration Guide
Complete pinout information for 10AX090N2F45E1SG (1932-ball fc-fbga (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N2F45E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F45E1SG is suitable for 6 applications: 100G Optical Transport Line Card, Software Defined Radio (SDR) Baseband, 4K Video Broadcast Infrastructure, Military Radar Front-End Processing, High-Speed Test & Measurement Instrumentation, Data Center Acceleration Card.
100G Optical Transport Line Card
The 10AX090N2F45E1SG is well-matched to OTU-4 / 100G Ethernet line cards because it provides 24 transceiver channels at up to 14.1 Gbps, which can be aggregated into a 100G pipe using four CAUI-10 lanes or ten 10G channels. Its 900K logic elements and 59 Mbit of embedded memory are sufficient for OTN framing, GFP-F mapping, and MAC-layer processing, while hard PCIe Gen3 and 10GbE MACs reduce soft-logic overhead. The device's 768 user I/Os accommodate multiple QSFP28 cages plus backplane serial links. Placed on a host card with the FPGA between QSFP28 cages and a switch ASIC, it provides framer/PCS bridging with deterministic latency under 1 microsecond across the pipeline. Trade-off: the F45 BGA package forces a large PCB footprint, but this is acceptable for ATCA-style line cards where board area is not the binding constraint.
Recommended
Software Defined Radio (SDR) Baseband
For SDR baseband processing in military and commercial wireless systems, the 10AX090N2F45E1SG delivers the DSP throughput required for wideband channelization and demodulation. The Arria 10 family integrates hardened floating-point DSP blocks that operate at up to 1.5 GFLOPs per block, enabling FFT-based channelizers and digital down-converters that fit comfortably in 900K LEs. The 24 transceivers at 14.1 Gbps support ADC/DAC JESD204B/C links to RF front-ends, and 768 user I/Os are useful for parallel LVDS control paths to tuners. Power typically falls in the 25-40W envelope at full DSP load, which is within the thermal capability of a properly heat-spreaded F45 BGA. Compared with a Stratix V implementation, this Arria 10 design typically yields 30% lower power per FLOP.
Recommended
4K Video Broadcast Infrastructure
The 10AX090N2F45E1SG is widely used in broadcast video processing - including 4K/UHD up/down/cross-conversion, color-space conversion, and light compression pre-processing. Its 900K logic elements and ample embedded memory support multi-stream 4K processing at 60 fps, and the 768 user I/Os handle multiple 12G-SDI / DisplayPort 1.4 interfaces via soft HDMI 2.0 or 12G-SDI IP. Hard PCIe Gen3 x8 IP supports a host link to a video server or storage controller. Placed between SDI ingest and a render farm, it provides deterministic frame buffering and color-space transform without external memory in many cases. The F45 BGA allows compact mezzanine cards (e.g., 80mm x 100mm) using only the user I/Os needed.
Recommended
Military Radar Front-End Processing
In phased-array radar front-ends, the 10AX090N2F45E1SG performs beamforming, pulse compression, and Doppler filtering across thousands of antenna elements. Its DSP blocks compute FFTs and FIR filters at line rate, while 24 transceivers at 14.1 Gbps accept serialized data from ADC-per-element front-ends. The 768 I/Os provide synchronization and timing distribution to RF chains. Placed adjacent to the RF front-end on a VPX or VITA-67 card, it minimizes latency between ADC samples and beamforming weights. The industrial temperature variant of this device supports -40C to +100C operation, critical for airborne and naval radar platforms.
Recommended
High-Speed Test & Measurement Instrumentation
The 10AX090N2F45E1SG suits high-end oscilloscopes, BERTs, and protocol analyzers where waveform reconstruction, pattern generation, and protocol decoding must run in real time. 900K logic elements support state-machine-based protocol decoders (PCIe, USB 3.x, SATA), while the transceivers drive and receive at up to 14.1 Gbps for multi-lane pattern generation. Hard memory controllers with ECC interface DDR3/DDR4 acquisition memory directly. The 768 user I/Os accommodate analog front-end control and front-panel switching. Compared with an ASIC at this volume, the FPGA provides the flexibility to support multiple protocols from a single platform.
Recommended
Data Center Acceleration Card
In hyperscale data centers, the 10AX090N2F45E1SG is deployed as a compute acceleration or network processing card offloading cryptography, compression, or NVMe-oF storage tasks from host CPUs. Its 24 transceivers at 14.1 Gbps support multiple 25G / 50G Ethernet links, and hard PCIe Gen3 x8 IP interfaces to a host CPU. 900K logic elements implement block ciphers (AES-256 via Design Security IP), gzip compression, or NVMe controller logic. Placed in a half-height, half-length PCIe card with a passive heatsink, it provides 20-40 Gbps of sustained offload throughput. Compared with a discrete NIC, the FPGA enables protocol-agnostic offload without silicon respins.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F45E1SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N2F45E2SG | 10AX090N2F45I1SG | 10AX090N2F45E3SG | 10AX090N2F45I2SG | 10AS090N2F45E1SG | 10AX090N2F45I3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FC-FBGA (F45) | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Max Transceiver Data Rate | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Speed Grade | 2 (E1) | 2 (E2) | 2 (I1) | 3 (E3) | 2 (I2) | 2 (E1) | 3 (I3) |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) |
| Variant | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 GX (FPGA) | Arria 10 SoC (with ARM Cortex-A9 HPS) | Arria 10 GX (FPGA) |
Key Differentiators
- Largest F45 BGA package variant in the Arria 10 GX 900K LE family (vs 10AX090N2F40E1SG (F40 40mm BGA, ~15% fewer I/Os))
- Extended temperature grade with industrial silicon process (vs 10AX090N2F45C1SG (commercial temp variant))
- Pure FPGA fabric - no SoC HPS subsystem overhead (vs 10AS090N2F45E1SG (Arria 10 SoC variant))
Design Notes
Estimated: at full transceiver load (24 ch at 14.1 Gbps) plus 60% logic utilization, total power for the 10AX090N2F45E1SG typically reaches 35W. The 1932-ball F45 FC-FBGA has theta_JA around 0.6 C/W with a thermal interface material to a heatspreader (per Arria 10 thermal chapter). A heatspreader plus 200 LFM airflow or a pin-fin heatsink is required; junction-to-ambient should be held below 25 C/W to keep Tj under 100 C in the extended temp grade.
The F45 FC-FBGA uses a 1.0 mm ball pitch, requiring HDI PCB construction with microvia-in-pad for the inner ball rows. Per Arria 10 PCB design guidelines, a 12-layer stackup with 4-6 routing layers and dedicated ground/power planes is recommended. Decoupling: place 0402 0.1uF X7R capacitors on every VCC/VCCPT pin within 5 mm, with bulk 22uF/47uF tantalum or polymer capacitors at the FPGA perimeter. Transceiver TX/RX lanes should be length-matched within 0.13 mm (PCIe Gen3 tolerance).
The Arria 10 GX requires at least 7 distinct supply rails: VCC (core 0.9V), VCCPT (periphery), VCCA_PLL, VCCAUX (1.8V), VCCIO (1.2-3.0V bank-dependent), VCCBAT (battery backup for key programming), and transceiver VCCR/VCCT/VCCP_HSSI. Per Intel's PowerPlay guidance, ramp VCC first, then VCCPT and VCCAUX within 100 ms; reverse sequence on power-down. A multi-rail sequencer (e.g., LTC2977 or similar) is recommended; tie CONF_DONE to reset logic to gate downstream rail enablement.
Common layout pitfalls: (1) routing a high-speed RX trace over a power plane split (creates a return-path discontinuity and EMI); (2) failing to assign non-transceiver I/O banks to bank voltages matching the attached standard (e.g., 1.8V LVCMOS vs 1.2V LVDS); (3) leaving the MSEL pins floating - they must be hard-tied to VCCPGM or GND per the configuration scheme selected. Per the Arria 10 pin connection guidelines, JTAG TCK should be AC-grounded with a 10k pull-down if unused to prevent false clocking.
Compliance Information
RoHS/REACH compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; for automotive applications use the Cyclone V or Arria 10 automotive variants.
