10AX090R2F40E1SG - Arria 10 GX 900K LE FPGA, 1517-FCBGA | Intel
Teilenummer: 10AX090R2F40E1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8102.99 | $8.102,99 |
| 10 | $7600 | $76.000,00 |
| 100 | $6800 | $680.000,00 |
| 500 | $6200 | $3.100.000,00 |
| 1.000 | $5750 | $5.750.000,00 |
10AX090R2F40E1SG Übersicht
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that allows hardware designers to implement arbitrary digital logic functions after fabrication. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs and PALs - and are widely used in communications infrastructure, signal processing, ASIC prototyping, and embedded compute. The Arria 10 family is positioned by Intel as a transceiver-rich, mid-range architecture bridging between Cyclone (low-cost) and Stratix (high-performance) families, balancing transceiver count, DSP bandwidth, and per-watt efficiency.
Key features of the 10AX090R2F40E1SG include support for up to 28.3 Gbps transceivers, hardened floating-point DSP blocks, a 20 nm process technology node, partial reconfiguration capability, and a hardened memory controller. The integrated PCI Express Gen3 hard IP and 100 G Ethernet MAC blocks dramatically reduce soft-logic area and timing closure effort for high-throughput connectivity designs. Core fabric operates on a 0.9 V supply, with multiple auxiliary rails for transceivers and I/O banks supporting LVDS, LVCMOS, SSTL, and high-speed memory interfaces such as DDR4.
The architecture uses a heterogeneous fabric that combines adaptive logic modules (ALMs), M20K SRAM blocks, and variable-precision DSP blocks. Transceiver tiles (GX) support backplane, chip-to-chip, and optical module links with adaptive equalization and CTLE/DFE blocks. The device also supports up to 12.5 Gbps external memory interfaces and includes hard PCIe Gen3 x8 controllers, significantly reducing soft-logic consumption for common protocols.
Typical applications include 100 Gbps line cards, OTN/SONET/SDH muxponders, military radar signal processing, broadcast video processing, ASIC prototyping, and high-performance medical imaging pipelines. The combination of transceiver density, hard memory controllers, and floating-point DSP makes this part particularly attractive for designs that need both high throughput and DSP-heavy compute without paying Stratix 10 power premiums.
Designers should plan thermal management carefully: a 1517-FCBGA exposes the die through a lid, allowing a heatsink to be attached with thermal interface material. Power Estimator (Early Power Estimator and PowerPlay) should be used to model thermal load before board bring-up, and the PCB must supply clean, low-noise rails for the 0.9 V core, 1.8 V analog, and transceiver supplies.
This page synthesizes distributor pricing across DigiKey, Mouser, and authorized resellers along with drop-in alternatives and practical design notes - data not aggregated by a single manufacturer datasheet.
Drop-in-Alternativen für 10AX090R2F40E1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX090R2F40E1SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Mounting Type, Speed Grade, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090R1F40E1SG
✅ Drop-In✓ Auf Lager
$6700 / Stück
Datenblatt ansehen →10AX090R1F40I1SG
✅ Drop-In✓ Auf Lager
$3783 / Stück
Datenblatt ansehen →10AX090N4F45I3LG
✅ Drop-In✓ Auf Lager
$5202.97 / Stück
Datenblatt ansehen →10AX090N3F45I2LG
✅ Drop-In✓ Auf Lager
$2995 / Stück
Datenblatt ansehen →10AX090N3F40I2LG
✅ Drop-In✓ Auf Lager
$9800 / Stück
Datenblatt ansehen →10AX066N2F40E1SG
✅ Drop-In✓ Auf Lager
$3350 / Stück
Datenblatt ansehen →10AX090R2F40E1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/O Count | 342 |
| Max Transceiver Data Rate | 28.3 Gbps |
| Hard Memory Controllers | Yes |
| Hard PCIe Gen3 IP | Yes (x8) |
| Hard 100G Ethernet MAC | Yes |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Enhanced (E1) |
| Gehäuse | 1517-ball FCBGA (F40), 40 x 40 mm |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AX090R2F40E1SG 1517-ball fcbga (f40), 40 x 40 mm Pinbelegungsleitfaden
Pinbelegung für 10AX090R2F40E1SG (1517-ball fcbga (f40), 40 x 40 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX090R2F40E1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX090R2F40E1SG ist geeignet für 6 Anwendungs: 100G Ethernet Line Card, OTN / DWDM Transponder and Muxponder, Military Radar and SIGINT Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and HDR Conversion, Medical Imaging and Ultrasound Beamforming.
100G Ethernet Line Card
The 10AX090R2F40E1SG's hard 100G Ethernet MAC IP and 28.3 Gbps transceiver channels make it ideal for 100G line-card designs. With four transceivers at 25.78 Gbps plus the hardened MAC, designers implement a full 100G MAC-to-physical layer datapath with minimal soft-logic area. The 59 Mbit embedded memory buffers packet bursts without external buffering, and the 1517-FCBGA's thermal lid enables high-wattage operation with a passive or active heatsink.
Empfohlen
OTN / DWDM Transponder and Muxponder
The 10AX090R2F40E1SG supports OTU4 (111.8 Gbps) and OTUCn (n=1..4) framing with hard IP blocks that significantly simplify the framer datapath. Hard PCS lanes and adaptive transceiver equalization drive long-reach optical modules and 10 km DWDM links directly. The device's enhanced temperature grade (E1) suits central-office deployment where ambient remains stable.
Empfohlen
Military Radar and SIGINT Signal Processing
Radar baseband and SIGINT systems require heavy floating-point DSP, large FFT windows, and parallel channel processing. The Arria 10 variable-precision DSP blocks and 900K LE fabric in the 10AX090R2F40E1SG implement complex FFTs and beam-forming arrays at full sample rate. The 20 nm process and hard PCIe Gen3 IP enable direct attachment to host CPUs or DSP cards with deterministic latency.
Empfohlen
ASIC Prototyping and Emulation
The 10AX090R2F40E1SG's 900K logic elements and abundant M20K memory make it a strong fit for ASIC prototyping at sub-100M gate complexity. Designers partition RTL across multiple Arria 10 devices via the embedded transceivers, achieving multi-FPGA prototyping with several hundred MHz system clock. Quartus Prime Pro supports time-domain multiplexing and pin multiplexing for fast bring-up.
Empfohlen
Broadcast Video Processing and HDR Conversion
4K/8K broadcast pipelines require high frame-rate video color-space conversion, HDR/WCG tone mapping, and multi-channel scaling. The 10AX090R2F40E1SG's embedded memory and DSP blocks handle simultaneous 4:2:2/4:4:4/4:2:0 conversion across multiple 4K streams at 60p. The hard memory controller interfaces with DDR4 banks used for line and frame buffers.
Empfohlen
Medical Imaging and Ultrasound Beamforming
Ultrasound systems drive 64-256 channels of beamforming at 40-80 MSPS, with front-end ADC data piped into the FPGA for delay-and-sum processing. The 10AX090R2F40E1SG's high-speed transceivers link to ADC front ends, and the floating-point DSP blocks compute beamformed image frames. The hard PCIe Gen3 IP delivers image data to host processors in real time, supporting 4D ultrasound and elastography.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX090R2F40E1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX090R1F40E1SG | 10AX090R1F40I1SG | 10AX090N3F40I2LG | 10AX090N4F45I3LG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F45) - LARGER 45x45mm | 1517-FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 (same) | 900,000 (same) | 900,000 (same) | 900,000 (same) | 660,000 (-27%) |
| Transceiver Tier (R/N suffix) | R2 (mid-range) | R1 (lower channel count) | R1 (lower channel count) | N3 (higher channel count) | N4 (highest channel count) | N2 (higher channel count) |
| Max Transceiver Data Rate | 28.3 Gbps | 28.3 Gbps (same) | 28.3 Gbps (same) | 28.3 Gbps (same) | 28.3 Gbps (same) | 28.3 Gbps (same) |
| Temperature Grade | Enhanced (E1) -20C to 100C | Enhanced (E1) - same | Industrial (I1) -40C to 100C | Industrial (I2) | Industrial (I3) | Enhanced (E1) |
| Embedded Memory Bits | 59,234,304 | 59,234,304 (same) | 59,234,304 (same) | 59,234,304 (same) | 59,234,304 (same) | Lower density (~40M bits) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- R2 transceiver tier balances cost and channel count for mid-range 100G designs (vs. 10AX090N3F40I2LG)
- 900K LE density at lower cost than higher-tier density equivalents (vs. 10AX090N4F45I3LG)
- Enhanced (E1) temperature grade targets telecom/datacom controlled environments (vs. 10AX090R2F40I1SG)
Designhinweise
The 1517-FCBGA package exposes the die through a metal lid that accepts thermal interface material (TIM) and a heatsink. Estimated: at 40 W total dissipation and a heatsink theta_SA of 0.5 C/W with TIM, junction-to-ambient rise is approximately 31 C above ambient for the E1 grade. A heatpipe solution or low-velocity forced-air cooling is recommended for ambient temperatures approaching 60 C. Always validate with the Intel PowerPlay tool post-place-and-route.
Multiple supply rails are required: 0.9 V core, 1.8 V analog PLL supplies, and dedicated transceiver rails (typically 1.0 V and 1.5 V depending on channel rate). Decoupling must include 0402-size 100 nF and 10 uF bulk ceramics within 2 mm of each power pin, plus board-level bulk capacitors at voltage regulator outputs. Power sequencing is enforced by the Intel reference design - assert 0.9 V before 1.8 V to prevent latch-up.
The 40 x 40 mm FCBGA requires a high-layer-count PCB (typically 16+ layers) with stacked microvia-in-pad construction for breakout. Recommended stackup uses 1-oz outer copper on standard FR-4 with Megtron-6 or equivalent low-Df material near the package. Matched-length tuning for transceiver lanes (within +/- 2 ps skew differential) is essential at 28 Gbps.
Group transceivers in dedicated bank regions to minimize via stubs and return-path discontinuity. The transceiver reference clock pin requires a low-jitter source (sub-300 fs RMS) with a series ferrite bead for power-rail noise isolation. Route LVDS pairs in 100 ohm differential impedance and keep away from switching power supply edges.
Do not enable more LVDS pairs per bank than the VCCIO rail can source - each pair draws ~7 mA and excessive load degrades signal integrity. Always configure unused I/O banks to a defined state via Quartus Pin Planner to avoid floating-pin leakage. Configuration mode (JTAG, AS, PS) and MSEL pins must be set correctly at PCB boot or the device will fail to configure.
Compliance-Informationen
RoHS and lead-free per ampheo.com product listing. Not AEC-Q100 qualified - this is a commercial/industrial-grade part.
