10AX115H2F34I1SG - Arria 10 GX FPGA, 1.15M LE, 1152-FBGA | Intel / Altera
Teilenummer: 10AX115H2F34I1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4550 | $45.500,00 |
| 100 | $4200 | $420.000,00 |
| 250 | $3950 | $987.500,00 |
| 500 | $3700 | $1.850.000,00 |
10AX115H2F34I1SG Übersicht
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via a programmable interconnect fabric, supplemented by hardened IP such as DSP blocks, BRAM, transceivers, PLLs, and external-memory controllers. FPGAs occupy the layer above general-purpose microcontrollers and DSPs in the computational hierarchy - between fixed-function ASICs and software-programmable CPUs - because they can be hardware-reconfigured after manufacture while still providing ASIC-class throughput on parallel workloads. The Arria 10 family in particular introduced a heterogeneous 20 nm SoC-like architecture combining a quad-core 64-bit ARM Cortex-A53 hard processor subsystem (HPS) with 20 nm FPGA fabric, hardened floating-point DSP, and partial reconfiguration support.
Key features of the 10AX115H2F34I1SG include 504 user I/O pins, transceiver rates up to 17.4 Gbps for 25G/40G/100G applications, integrated PCIe hard IP blocks, 10-Gbps Ethernet MACs, hardened floating-point DSP blocks supporting IEEE-754 single- and double-precision, and SmartVID core voltage support from 0.85 V to 0.95 V for dynamic power reduction. The device supports DDR4, DDR3, QDR II+, and RLDRAM III external-memory interfaces up to 933 MHz, and includes the Configuration via Protocol (CvP) feature that allows the FPGA fabric to be programmed over PCIe.
The 'H2' suffix indicates a logic-density/transceiver configuration tier; the 'F34' package code designates the 1152-ball FCBGA with 35 mm x 35 mm body; 'I' indicates the industrial temperature grade (-40 C to +100 C ambient operating range); '1' is the device speed grade; and 'SG' denotes lead-free / RoHS-compliant packaging. Designers typically pair this device with 10 Gbps optics, DDR4 SODIMMs or RDIMMs, and external clocking such as the Intel / SiTime 8V19N492 differential MEMS oscillator for the reference clock.
Typical applications include 100G optical transport line cards, 25G Ethernet NICs, high-frequency-trading (HFT) accelerator cards, ASIC prototyping platforms, military radar baseband processing, and 4K / 8K video broadcast encoders. For 100G optical transport, the transceiver channel count and 17.4 Gbps line rate enable a single chip to drive a CFP2/CFP4 module directly without an external mux/demux ASIC. For ASIC prototyping, the 1.15M logic elements give a 1:1 mapping budget for ASICs up to ~25-30 M gates with careful partitioning. The SmartVID feature typically yields 30-50% lower core power than static-voltage 28 nm predecessors at the same performance.
When designing with this part, allocate a continuous inner-row copper plane for the 0.95 V SmartVID core rail with low-impedance decoupling; the transceiver channels require a clean 1.0-1.2 V analog rail (VCCH, VCCR) with separate filtering to avoid coupling noise from the digital core. Reference Intel application note AN 698 (configuration), AN 711 (transceiver board design), and AN 736 (power distribution) for board-level implementation guidance.
This page synthesizes distributor pricing across DigiKey, Mouser, and authorized partners, drop-in alternative options within the Arria 10 family, and practical design considerations that are not aggregated on any single distributor page.
Drop-in-Alternativen für 10AX115H2F34I1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115H2F34I1SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Transceivers, PCIe Hard IP, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115H1F34I1SG
✅ Drop-In✓ Auf Lager
$6500 / Stück
Datenblatt ansehen →10AX115H2F34E2SG
✅ Drop-In✓ Auf Lager
$5500 / Stück
Datenblatt ansehen →10AX115H2F34E1SG
✅ Drop-In✓ Auf Lager
$3300 / Stück
Datenblatt ansehen →10AX115H2F34E2LG
✅ Drop-In✓ Auf Lager
$5950 / Stück
Datenblatt ansehen →10AX115H2F34I1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| Process Technology | TSMC 20 nm |
| User I/O Count | 504 |
| Gehäuse | 1152-ball FCBGA (F34) |
| Package Body Size | 35 mm x 35 mm |
| Montageart | Surface Mount |
| Operating Temperature Grade | Industrial (-40 C to +100 C) |
| Core Voltage (SmartVID) | 0.85 V to 0.95 V |
| Max Transceiver Data Rate | 17.4 Gbps |
| Speed Grade | 1 |
| External Memory Interface | DDR4, DDR3, QDR II+, RLDRAM III up to 933 MHz |
| RoHS-Status | Compliant (SG suffix) |
| Lead-Free | Yes |
10AX115H2F34I1SG 35 mm x 35 mm Pinbelegungsleitfaden
Pinbelegung für 10AX115H2F34I1SG (35 mm x 35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115H2F34I1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115H2F34I1SG ist geeignet für 6 Anwendungs: 100G Optical Transport Line Card, ASIC Prototyping Platform, 25G/50G Ethernet NIC, High-Frequency-Trading Accelerator, Military Radar Baseband Processor, 4K/8K Video Broadcast Encoder.
100G Optical Transport Line Card
The 10AX115H2F34I1SG is well-suited to 100G optical transport line cards because its Arria 10 GX fabric exposes transceivers up to 17.4 Gbps per channel and integrates 4x10G, 2x25G, or 4x25G PHY groupings that map natively to OTU4 and CAUI-4. With 1.15 M logic elements and 68.8 Mbit of embedded block memory, the part can host a MAC, framermapper (GFP/OTN), and a soft FEC layer on a single device, removing the need for a companion mux/demux ASIC. SmartVID trims core power when the link is in ODU overhead processing. The F34 FCBGA keeps the PCB footprint compact enough for a CFP2/CFP4 line-card front panel.
Empfohlen
ASIC Prototyping Platform
ASIC prototyping platforms use the 10AX115H2F34I1SG because its 1.15 M logic-element budget accommodates ASICS of roughly 25-30 M gates when partitioned across multiple FPGA instances, and the 68.8 Mbit of embedded memory plus external DDR4 interface provides abundant state capacity. The 17.4 Gbps transceivers support high-speed TDM-style time-multiplexed ASIC-to-FPGA I/O for chip-to-chip bridging. Partial reconfiguration lets designers swap hardware blocks in seconds without rebooting the prototype. Engineers should use Intel's Quartus Prime Pro for synthesis and consult application note AN 698 for configuration planning.
Empfohlen
25G/50G Ethernet NIC
Low-latency 25G and 50G Ethernet network interface cards are a primary target for the 10AX115H2F34I1SG. The integrated 10-Gbps Ethernet MAC hard IP combined with 17.4 Gbps transceivers supports 25G Ethernet (IEEE 802.3by) and 50G Ethernet (802.3cd) PHY directly, with PCIe Gen3 x8 hard IP for host connectivity. The 504 user I/Os provide ample budget for front-panel ports, DDR4 packet buffer memory, and additional side-band interfaces. Designers must pay close attention to PCB layer stack-up and transceiver analog supply filtering per Intel application note AN 711 (transceiver board design).
Empfohlen
High-Frequency-Trading Accelerator
High-frequency trading (HFT) accelerators use the 10AX115H2F34I1SG to drive deterministic sub-microsecond packet-to-trade latency in market-data feed handlers and order-routing engines. The 17.4 Gbps transceivers support SFP+ and QSFP+ market-data taps; the 1.15 M LE fabric provides the throughput to keep the matching engine's state in on-chip memory, eliminating off-chip latency jitter. Industrial temperature grade allows deployment in cooling-efficient density-optimized server racks. SmartVID keeps core power down so that more FPGA compute fits in the same thermal envelope, which matters when packing multiple accelerators per PCIe slot.
Empfohlen
Military Radar Baseband Processor
Defense radar baseband-processing cards use the 10AX115H2F34I1SG because the industrial temperature grade (-40 C to +100 C) suits land-based and shipboard installations, while the 17.4 Gbps transceivers aggregate ADC outputs from RF front-ends at full aperture bandwidth. The 1.15 M LE fabric hosts the FFT, beamforming, pulse compression, and MTI stages in parallel, exploiting the Arria 10 GX hardened floating-point DSP blocks for IEEE-754 single/double-precision math. The F34 FCBGA package enables dense board stacking required in compact phased-array chassis. Designers should harden the FPGA configuration (e.g., remote update) for field deployment.
Empfohlen
4K/8K Video Broadcast Encoder
4K and 8K video broadcast encoders and contribution links leverage the 10AX115H2F34I1SG because the 1.15 M logic elements can host multiple JPEG XS or H.265 intra-frame encoders in parallel, while the 68.8 Mbit of embedded memory holds multiple line buffers without external SRAM. The 17.4 Gbps transceivers accept uncompressed SDI (SMPTE 2022-6) or SMPTE 2110 IP essence from multiple cameras, while the 504 user I/Os provide ample channels for HDMI/DisplayPort monitor outputs and control panel GPIOs. Industrial temperature grade supports the relatively warm broadcast-rack environment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115H2F34I1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115H1F34I1SG | 10AX115H2F34E2SG | 10AX115H2F34E1SG | 10AX115H2F34E2LG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended / Automotive | Extended / Automotive | Extended / Automotive |
| Speed Grade | -2 | -1 | -2 | -1 | -2 |
| Transceiver Configuration Tier | H2 (higher channel count) | H1 (lower channel count) | H2 (higher channel count) | H2 (higher channel count) | H2 (higher channel count) |
| Max Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
Wichtigste Unterscheidungsmerkmale
- Same F34 footprint, lower-channel variant (vs. 10AX115H1F34I1SG)
- Same F34 footprint, extended temperature grade (vs. 10AX115H2F34E2SG)
- Same F34 footprint, speed grade -1 option (vs. 10AX115H2F34E1SG)
Designhinweise
Estimated power budgeting: at SmartVID 0.9 V nominal core, plan for ~25-40 W of core power at full utilization with transceivers active; at static 0.95 V SmartVID max, plan for 50-60 W. Decouple the 0.85-0.95 V VCC core rail with 22 uF + 2.2 uF + 0.1 uF ceramic capacitors per the Intel Arria 10 power distribution application note AN 736, and route the SmartVID sense lines (VCC_SENSE / GND_SENSE) directly to the regulator feedback pins for accurate telemetry.
Transceiver analog rails (VCCH, VCCR, VCCL) require isolated filtering from the digital core; place a ferrite bead or filter cap network within 5 mm of each transceiver bank pin and isolate the analog plane with a moat, per Intel application note AN 711. Differential pair lengths must be matched to within 150 um (TX) and 250 um (RX) at 17.4 Gbps to avoid deterministic jitter degradation, and the AC-coupling capacitor footprint should support 0402 size with a stub length under 200 um.
The 35 mm x 35 mm F34 FCBGA has a typical theta_JA of 4-6 C/W with a 25-30 C/W heatsink plus 200 LFM airflow. At 50 W total power, junction temperature rise is ~5 C above ambient with proper heatsink and airflow - within the industrial 100 C ambient limit. Without a heatsink, the same 50 W would push the junction to ~250 C above ambient, exceeding the limit; never operate at full utilization without thermal management.
Do not assume all 1152 balls are user I/O - only 504 are user I/O, the rest are supply, ground, configuration, and JTAG. Attempting to use transceiver balls as general-purpose I/O will fail. Also confirm the MSL (Moisture Sensitivity Level) from the device label or datasheet before reflow; the FCBGA is typically MSL3 or MSL4, requiring bake-out and controlled-floor life.
Compliance-Informationen
RoHS and REACH compliance indicated by the SG suffix in the ordering code. AEC-Q100 automotive qualification is not_applicable for this FPGA (not an automotive-qualified part per the ordering code 'I' = industrial temperature grade).
