10AX115H2F34E2SG - Arria 10 GX FPGA 1150K LE 504 I/O | Intel
MPN: 10AX115H2F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6344.57 | $6,344.57 |
| 10 | $6170 | $61,700.00 |
| 50 | $5980 | $299,000.00 |
| 100 | $5760 | $576,000.00 |
| 500 | $5500 | $2,750,000.00 |
Drop-in alternatives for 10AX115H2F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115H2F34E1SG
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →10AX115H2F34E2LG
✅ Drop-In✓ In Stock
$5950 / Unit
View Datasheet →10AX115H2F34E2HG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115H2F34I1SG
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →10AX115H1F34E1SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2895 / Unit
View Datasheet →10AX115H2F34E2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | 504 |
| Transceivers | 24 channels up to 14.1 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point |
| 18x19 Multipliers | 2,150 |
| PLLs | Fractional, up to 24 |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Package | 1152-ball FCBGA (F34) 35x35 mm |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | 20 nm Tri-Gate (Intel) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX115H2F34E2SG 1152-ball fcbga (f34) 35x35 mm Pin Configuration Guide
Complete pinout information for 10AX115H2F34E2SG (1152-ball fcbga (f34) 35x35 mm package) with 504 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115H2F34E2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 504 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115H2F34E2SG is suitable for 6 applications: 100G Optical Transport Networking, Wireless Baseband and Radio Processing, Military Radar and EW Signal Processing, PCIe Gen3 Accelerator Cards, Broadcast Video Processing, Industrial Motor Control and Drives.
100G Optical Transport Networking
The 10AX115H2F34E2SG's 24 transceivers at 14.1 Gbps aggregate to a 100G-class fabric when combined with MAC/PCS IP, making it ideal for OTU4/100GbE line cards. Its 1.15M logic elements comfortably fit OTN framer/mapper, GFP, and FEC engines (Reed-Solomon RS(255,239)) with margin. The hardened ARM Cortex-A9 HPS supports control-plane management via NetConf/YANG. Design tip: dedicate 4 transceivers per OTU4 port with 1588v2 timestamping for telecom-grade synchronization.
Recommended
Wireless Baseband and Radio Processing
Arria 10 GX FPGA architecture is purpose-built for LTE/5G baseband with hardened floating-point DSP blocks performing matrix inversion, FFT/iFFT, and turbo decoding in real time. The 2,150 18x19 multipliers and IEEE 754 single/double-precision DSP slices execute channel estimation and MIMO detection at line rate. Combined with CPRI/OBSAI framer IP, the device collapses BBU and RRH processing onto one chip. Designers should leverage partial reconfiguration to switch between LTE and 5G NR waveforms dynamically.
Recommended
Military Radar and EW Signal Processing
The 10AX115H2F34E2SG's combination of 24 transceivers (digitizing radar antenna arrays), 68.86 Mbit block memory (FFT window buffers), and 2,150 multipliers (pulse-Doppler processing) provides the compute density required for active electronically scanned array (AESA) radars. The E2 industrial temperature grade supports ground-mobile and naval deployments. FPGA fabric integrates SAR image formation, electronic counter-countermeasures (ECCM), and adaptive beamforming with deterministic latency that DSP processors cannot match.
Recommended
PCIe Gen3 Accelerator Cards
The 10AX115H2F34E2SG includes a hard PCIe Gen3 x4 (and Gen2 x8) controller, enabling drop-in endpoint functionality for x86 host attachments at 32 Gbps aggregate. Designers implement DMA engines, MSI-X interrupt handlers, and PIO registers directly in FPGA logic, accelerating analytics, NVMe controllers, or network interface functions. The hardened IP frees programmable fabric for application-specific acceleration such as compression, encryption, or AI inference.
Recommended
Broadcast Video Processing
Broadcast video infrastructure demands uncompressed 12G-SDI/Quad-Link 3G-SDI routing, frame-rate conversion, and HDR/wide-color-gamut mapping. The 10AX115H2F34E2SG processes 4K/UHD signals at 60 fps with up/down/cross-conversion while running audio embedding, Dolby metadata insertion, and genlock logic. Arria 10 GX video IP (HDMI 2.0, DisplayPort 1.4, SDI) provides the necessary PHY and protocol stack. Designers should allocate sufficient M20K memory for triple-buffered frame buffers at 4K resolution.
Recommended
Industrial Motor Control and Drives
Industrial servo drives and AC variable-frequency drives benefit from FPGA-based field-oriented control (FOC) loops executing at microsecond latency, far below processor-based implementations. The 10AX115H2F34E2SG runs multi-axis FOC with sine/cosine encoder decoding, space-vector PWM generation, and EtherCAT slave stack concurrently. The hardened ARM Cortex-A9 HPS hosts Linux for system management while the FPGA fabric executes the deterministic real-time control loops. Industrial-grade E2 temperature (-40 C storage, 0-100 C junction) supports factory floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115H2F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115H2F34E1SG | 10AX115H2F34E2LG | 10AX115H2F34E2HG | 10AX115H2F34I1SG | 10AX115H1F34E1SG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Transceiver Speed Grade | -2 (up to 14.1 Gbps) | -1 (up to 12.5 Gbps) | -2 (up to 14.1 Gbps) | -2 (up to 14.1 Gbps) | -1 (up to 12.5 Gbps) | -1 (lower tier) |
| User I/O | 504 | 504 | 504 | 504 | 504 | 504 |
| Temperature Grade | E2 industrial (0-100 C) | E2 industrial (0-100 C) | E2 industrial (0-100 C) | E2 extended | I1 industrial (-40-100 C) | E1 industrial |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Embedded Memory (bits) | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 |
Key Differentiators
- Same-family drop-in alternative offering lower cost for 12.5 Gbps designs (vs 10AX115H2F34E1SG)
- Lead-free RoHS-compliant variant for regulated markets (vs 10AX115H2F34E2LG)
- Wider industrial temperature grade option (vs 10AX115H2F34I1SG)
Design Notes
The 1152-ball FCBGA F34 package requires a high-density PCB land pattern with staggered micro-via arrays (typically 0.4-0.5 mm pitch). Use a 1.6 mm minimum PCB thickness with stacked-via-in-pad structures for BGA breakout. Per Intel's package specifications, the 35x35 mm body requires at least 4 signal layers between BGA and BGA-fanout area. Implement a continuous ground plane on layers 2 and N-1 to control return paths for the 14.1 Gbps transceivers.
The 10AX115H2F34E2SG can dissipate 18-25 W under full transceiver + DSP utilization at 100 C junction. Mandatory thermal management includes a thermal interface material (TIM) between the package top and a heatsink, plus thermal vias beneath the central BGA ground balls to the inner plane. Without heatsinking, the device will thermal-throttle and the E2 industrial temperature rating will be violated. Estimate: junction-to-ambient theta_JA on a JEDEC 4-layer test board is approximately 8-10 C/W with proper thermal via array.
Transceiver channels require matched-length routing with controlled impedance (100 ohm differential for backplane rates). Maintain within-pair skew below 1 ps/mm and pair-to-pair skew below 5 ps for 14.1 Gbps. AC-coupling capacitors must be 0402 size or larger with C0G/NP0 dielectric to minimize parasitic inductance. Reference Intel AN 615 ('Design and Layout Guidelines for Arria 10 GT/GX Transceivers') for channel compliance.
Do not confuse the F34 package (1152-ball, 504 I/O) with F40 (1517-ball, 600 I/O). Pin assignments differ entirely. The 'H2' suffix indicates high-density 1.15M-LE device with all transceiver channels; 'N' denotes GT-family parts. Configuration mode pins (MSEL) must be set correctly per Quartus Prime programmer for the chosen JTAG/AS/PS/FPP mode, otherwise the device will fail to configure.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable for FPGAs. Lead-free verified; halogen-free status not explicitly listed in retrieved distributor data - verify with Intel product compliance report.
