10CX150YU484I6G - Cyclone 10 GX FPGA, 150K LE, 484-BGA | Intel
Teilenummer: 10CX150YU484I6G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $184.5 | $184,50 |
| 10 | $175.2 | $1.752,00 |
| 100 | $165.8 | $16.580,00 |
| 250 | $158.4 | $39.600,00 |
| 500 | $151.9 | $75.950,00 |
10CX150YU484I6G Übersicht
A Cyclone 10 GX FPGA is a programmable logic device from the broader category of field-programmable gate arrays (FPGAs) within the integrated circuits hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor). Cyclone 10 GX sits within Intel's low-power, transceiver-equipped FPGA family that complements the higher-end Stratix 10 line. Its role in the system hierarchy is to provide reconfigurable digital logic fabric, embedded memory, DSP, and high-speed serial I/O for video, industrial, and communications designs.
Key features include 12.5 Gbps transceivers supporting PCIe Gen2 x4 and external memory interfaces up to DDR3/4, hard IEEE 754 single-precision floating-point multipliers, and the hardened Floating-Point Adaptive Logic Module (FAM) block. The 20 nm process delivers static power roughly 40% lower than the prior Cyclone V generation while preserving full transceiver bandwidth. The 484-ball BGA provides high I/O density for parallel memory buses and LVDS channels.
Typical applications span industrial machine vision, broadcast video processing, multi-axis motor control, smart surveillance, and small-cell wireless backhaul. The combination of 12.5 Gbps transceivers, embedded transceivers for PCIe, and hard floating-point arithmetic makes the device well-suited for cost-sensitive signal-processing and protocol-bridging tasks.
When designing with the 10CX150YU484I6G, careful PCB layout of the BGA power rails is critical - decouple every VCC/VCCA rail close to the balls and provide a continuous ground plane beneath the package. Use Intel's Quartus Prime Lite or Pro toolchain for synthesis, place-and-route, and timing closure.
Drop-in-Alternativen für 10CX150YU484I6G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CX150YU484I6G (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Embedded Memory, Mounting Type, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CX150YU484I5G
✅ Drop-In✓ Auf Lager
$176.2 / Stück
Datenblatt ansehen →10CX150YU484E6G
✅ Drop-In✓ Auf Lager
$124.55 / Stück
Datenblatt ansehen →10CX150YU484E5G
✅ Drop-In✓ Auf Lager
$128.65 / Stück
Datenblatt ansehen →10CX105YU484I6G
✅ Drop-In✓ Auf Lager
$372 / Stück
Datenblatt ansehen →10CX085YU484I6G
✅ Drop-In✓ Auf Lager
$155.6 / Stück
Datenblatt ansehen →10CX150YU484I6G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone 10 GX |
| Logic Elements | 150,000 |
| Embedded Memory Bits | 10,907,648 |
| DSP Blocks | 188 |
| Process Technology | 20 nm |
| Maximum Transceiver Data Rate | 12.5 Gbps |
| Gehäuse | 484-Ball UBGA (FCBGA) |
| Hard Memory Controller | Yes (DDR3 / DDR4) |
| PCIe Hard IP | Yes (up to PCIe Gen2 x4) |
| Hard Floating-Point DSP | Yes (IEEE 754 single-precision) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
10CX150YU484I6G 484-ball ubga (fcbga) Pinbelegungsleitfaden
Pinbelegung für 10CX150YU484I6G (484-ball ubga (fcbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CX150YU484I6G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CX150YU484I6G ist geeignet für 6 Anwendungs: Industrial Machine Vision, Broadcast Video Processing, Multi-Axis Motor Control, Smart Surveillance and Video Analytics, Small-Cell Wireless Backhaul, Test and Measurement Instrumentation.
Industrial Machine Vision
The 10CX150YU484I6G fits industrial machine-vision pipelines where parallel image sensors and GigE Vision / CoaXPress links must be aggregated and pre-processed at line rate. The 188 DSP blocks and hard IEEE 754 single-precision floating-point multipliers accelerate 2D filtering, color-space conversion, and CNN feature-map inference at up to ~12.5 Gbps per transceiver lane. Embedded 10.9 Mbit of block memory buffers full HD frames with minimal external SRAM, and the industrial (-40C to +100C) temperature grade supports factory-floor deployments. Place the FPGA between the camera receivers and the host CPU/SoM; use PCIe Gen2 x4 hard IP for the upstream DMA channel.
Empfohlen
Broadcast Video Processing
The 10CX150YU484I6G supports 4K/UHD broadcast video routing, multi-format format conversion, and light compression (JPEG XS / Tico) where 12.5 Gbps transceivers handle SDI (SMPTE ST 425 / ST 2082) and SMPTE 2110 IP-based video. The 484-ball BGA exposes enough LVDS pairs for parallel RGB/YCbCr interfaces and a DDR4 hard controller that absorbs frame-buffer latency. Hard floating-point DSP handles chroma upsampling and scaling kernels without consuming soft logic. Pair the FPGA with external HDMI 2.0 / 12G-SDI PHY devices; use the 10CX150YU484I5G when a lower speed grade suffices for 3G-SDI-only designs.
Empfohlen
Multi-Axis Motor Control
The 10CX150YU484I6G drives multi-axis industrial servo and stepper systems where its 188 DSP blocks execute field-oriented control (FOC), space-vector PWM, and encoder interpolation loops in parallel. Hard IEEE 754 floating-point arithmetic ensures deterministic control-loop latency within a single FPGA fabric cycle, while 12.5 Gbps transceivers enable EtherCAT, PROFINET, or SERCOS III industrial-Ethernet MACs without external ASSPs. Industrial temperature grade (-40C to +100C) supports cabinet-mounted motion controllers. Use the FPGA alongside external gate drivers and current-sense ADCs; trade-off: the 105K variant 10CX105YU484I6G fits simpler 3-axis controllers with reduced logic budget.
Empfohlen
Smart Surveillance and Video Analytics
The 10CX150YU484I6G enables smart IP-camera and NVR designs where 12.5 Gbps transceivers aggregate multiple GigE Vision / ONVIF streams while hard floating-point DSP executes background-subtraction, motion-detection, and lightweight CNN analytics in real time. The 10.9 Mbit of embedded block memory stores intermediate feature maps without external SRAM, keeping the BOM small. PCIe Gen2 x4 hard IP offloads analytics results to a host CPU/SoC over a single board-to-board link. Deploy in industrial-grade outdoor camera housings using the 10CX150YU484E6G extended-temperature variant for -40C cold-start reliability.
Empfohlen
Small-Cell Wireless Backhaul
The 10CX150YU484I6G serves small-cell and pico-cell baseband plus CPRI / eCPRI backhaul designs where 12.5 Gbps transceivers digitize radio data and forward it over fiber to the baseband unit. Hard PCIe Gen2 x4 and the hardened DSP block fabric accelerate front-end FFT/IFFT, channel estimation, and pre-coding operations. The 484-ball BGA exposes enough LVDS to interface to radio ADC/DAC pairs, and the DDR3/DDR4 hard memory controller handles timing-critical buffers. For lower-density single-sector radios, the 10CX105YU484I6G offers the same footprint with reduced resource headroom.
Empfohlen
Test and Measurement Instrumentation
The 10CX150YU484I6G is well suited to mid-range oscilloscope, protocol analyzer, and arbitrary-waveform-generator (AWG) front-ends where 12.5 Gbps transceivers acquire serial data streams and the 188 hard DSP blocks perform real-time FFT, FIR filtering, and signal conditioning. Embedded 10.9 Mbit of block memory captures deep pre-trigger traces without external SRAM, and the DDR4 hard controller streams post-processed data to the host CPU. Industrial temperature grade supports bench and lab environments. Use the 10CX150YF780I6G (780-ball) variant when the design needs additional LVDS for parallel ADC/DAC interfaces.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CX150YU484I6G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CX150YU484I5G | 10CX150YU484E6G | 10CX150YU484E5G | 10CX105YU484I6G | 10CX085YU484I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-Ball UBGA (FCBGA) | 484-Ball UBGA (FCBGA) - same | 484-Ball UBGA (FCBGA) - same | 484-Ball UBGA (FCBGA) - same | 484-Ball UBGA (FCBGA) - same | 484-Ball UBGA (FCBGA) - same |
| Logic Elements | 150,000 | 150,000 | 150,000 | 150,000 | 105,000 (-30%) | 85,000 (-43%) |
| Maximum Transceiver Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (I5 speed grade) | Extended (E6) | Extended (E5) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Higher logic density (150K LE) versus Cyclone 10 GX 105K / 85K siblings (vs. 10CX105YU484I6G / 10CX085YU484I6G)
- Full hard floating-point DSP at no logic cost (vs. Cyclone V SOC FPGAs (e.g., 5CSEBA6))
- 20 nm process lowers static power versus prior 28 nm Cyclone V family (vs. Cyclone V (5CGXFC7) in similar BGA)
Designhinweise
Decouple every VCC and VCCA power rail of the 10CX150YU484I6G as close as possible to the BGA balls. Use a combination of 100 nF X7R ceramic capacitors on every rail plus 10 uF bulk capacitors per supply domain. The 12.5 Gbps transceiver rails (VCCR_GXB, VCCT_GXB) require the cleanest filtering - place 10 nF and 100 nF capacitors on each side of the ferrite bead that isolates them from the core logic supply. Estimated: at 100% transceiver utilization across all channels, total device power can exceed 15 W; thermal management must be sized accordingly.
The 484-ball UBGA package has a JEDEC-standard thermal resistance that requires a forced-air heatsink or large PCB copper pour for sustained 12.5 Gbps operation. Attach a thermal interface material (TIM) between the package lid and the heatsink; ensure mechanical pressure is within the BGA coplanarity spec. Estimated: at 85C ambient and 15 W dissipation, a 4-layer PCB with 1 oz copper yields junction temperature near 105C - verify with thermal simulation using the device's DELTA-T model before sign-off.
Use a minimum 6-layer PCB stack-up for the 484-ball BGA with continuous ground and power planes beneath the package. Microstrip/stripline trace impedance must be 100 ohm differential for transceiver channels and 50 ohm single-ended for general-purpose LVCMOS/LVDS. Match the transceiver pair lengths within 150 mil to maintain signal integrity at 12.5 Gbps. Reference Intel Cyclone 10 GX device PCB design guidelines for via-stitching and decoupling placement recommendations.
Do not assume the I5, E5, and E6 OPN variants share identical timing characteristics - always re-fit and re-run timing analysis in Quartus when migrating between temperature/speed grades. Verify configuration scheme (AS, PS, JTAG, or FPP) and dual-boot image support before board bring-up. Estimated: a typical 80% utilization compile for Cyclone 10 GX 150K may take 30-90 minutes in Quartus Pro; plan CI pipelines accordingly.
Compliance-Informationen
RoHS and lead-free per Intel Cyclone 10 GX product family environmental compliance. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-grade part. Halogen-free per Intel FPGA material declarations.
