10CX150YU484E6G - Cyclone 10 GX 150K LE FPGA, 484-BGA | Intel
MPN: 10CX150YU484E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $166.95 | $166.95 |
| 10 | $158.61 | $1,586.10 |
| 100 | $150.26 | $15,026.00 |
| 500 | $138.86 | $69,430.00 |
| 1,000 | $124.55 | $124,550.00 |
10CX150YU484E6G Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP slices, and increasingly hardened protocol IP such as transceivers and PCIe interfaces. FPGAs sit at the top of the programmable-logic hierarchy: SRAM-based programmable fabric -> programmable logic device (PLD) -> FPGA -> programmable SoC (when paired with hard CPU cores), enabling hardware-level parallelism for compute, signal processing, and high-speed serial I/O. Compared with an ASIC, an FPGA offers in-system reprogrammability and faster time-to-market at higher unit cost.
Key features include high-bandwidth transceivers, a hard memory controller subsystem, variable-precision DSP blocks, and a hardened PCIe Gen2 hard IP block. The 484-ball UBGA package provides a compact, surface-mount footprint with controlled-impedance routing access to the transceiver banks. The device supports configuration via external flash, JTAG, or in-system update, allowing remote bitstream loading in deployed systems. The 20nm process node balances static and dynamic power, making this device suitable for thermally constrained industrial environments.
From an architecture perspective, the Cyclone 10 GX uses an SRAM-based configuration memory backed by an internal configuration controller. The transceiver tiles are positioned on dedicated banks, while the FPGA fabric is laid out as a fabric of LABs (logic array blocks), M20K embedded memory blocks, and variable-precision DSP blocks. The 484-ball package gives access to a defined subset of user I/O banks and full access to the transceiver/PLL pins.
Typical applications include industrial machine vision, video surveillance and broadcast video processing, industrial Ethernet switching and protocol bridging, motor control and industrial drive interfaces, low-cost 10G/6G optical transport, and PCI Express endpoint cards for embedded compute. The combination of transceivers and DSP resources makes this device a strong fit for any application requiring real-time signal processing with moderate logic density.
When designing with this device, use Intel Quartus Prime (Standard or Pro edition, depending on variant support) for synthesis, place-and-route, and bitstream generation, and observe the transceiver reference-clock jitter budget and decoupling-capacitor placement guidance in the Cyclone 10 GX device datasheet for signal-integrity-compliant board layouts.
This page synthesizes distributor pricing, package-pinout detail, drop-in same-package alternatives from the Cyclone 10 GX family, and practical board-design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 10CX150YU484E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CX150YU484E6G (same form factor and footprint) — differing in Package, DSP Blocks, Logic Elements, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX150YU484E5G
✅ Drop-In✓ In Stock
$128.65 / Unit
View Datasheet →10CX105YU484E6G
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →10CX085YU484E6G
✅ Drop-In✓ In Stock
$282 / Unit
View Datasheet →10CX150YU484I6G
✅ Drop-In✓ In Stock
$151.9 / Unit
View Datasheet →10CX105YU484E5G
✅ Drop-In✓ In Stock
$275 / Unit
View Datasheet →10CX150YU484E6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Process Technology | 20 nm |
| Logic Elements (LE) | 150,000 |
| Embedded Memory Bits | 10,907,648 (10.4 Mbit) |
| Package | 484-ball UBGA (BFBGA) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Operating Temperature Grade | Industrial |
| Configuration Memory | SRAM-based, externally loadable |
| Hardened Transceivers | Yes (per Cyclone 10 GX family) |
| Hard PCIe IP | PCIe Gen2 hard IP (per family) |
| DSP Blocks | Variable-precision DSP (per family) |
| Lead-Free | Yes (per RoHS) |
10CX150YU484E6G 484-ball ubga (bfbga) Pin Configuration Guide
Pin configuration for 10CX150YU484E6G (484-ball ubga (bfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YU484E6G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CX150YU484E6G is suitable for 7 applications: Industrial Machine Vision, Video Surveillance and Broadcast Processing, Industrial Ethernet Switching and Protocol Bridging, Motor Control and Industrial Drive Interfaces, Low-Cost 10G/6G Optical Transport and CPRI, PCI Express Endpoint Card for Embedded Compute, Software Defined Radio Baseband Processing.
Industrial Machine Vision
The 10CX150YU484E6G is well-suited to industrial machine-vision processing where a Camera Link or GigE Vision stream must be deserialized, Bayer-converted, and fed into a real-time image-pipeline. Its 150,000 logic elements plus variable-precision DSP blocks handle Sobel filtering, color-space conversion, and object detection at 60-120 fps on a 1080p sensor, while the hardened multi-gigabit transceivers accept the serialized video link directly without an external PHY. Designers place the device between the image sensor and an external ARM SoC host, using embedded M20K SRAM blocks as line buffers to absorb burst traffic. The 20 nm process keeps dynamic power manageable for fan-less industrial enclosures.
Recommended
Video Surveillance and Broadcast Processing
The 10CX150YU484E6G supports broadcast and surveillance video pipelines that require SDI receive/transmit, scaling, de-interlacing, and on-screen-display composition. Its transceiver channels accept SDI rates up to 3G-SDI natively, and the 10,907,648 embedded memory bits frame-buffer enough video lines for full 1080p60 de-interlacing. Placed between the SDI deserializer and an HDMI encoder SoC, the FPGA performs scaling and format conversion at line rate. Compared with a DSP-only solution, the FPGA's parallel fabric handles multi-stream pipelines without throughput loss, and the industrial temperature grade allows outdoor cabinet deployment.
Recommended
Industrial Ethernet Switching and Protocol Bridging
The 10CX150YU484E6G is a strong fit for industrial Ethernet switches, Profinet-to-EtherNet/IP gateways, and TSN (time-sensitive networking) bridges. Its hardened transceivers deliver 1G/2.5G/10G Ethernet ports directly, while the PCIe Gen2 hard IP connects the FPGA to a host SoC for management-plane traffic. The 150K logic elements implement cut-through switching, frame filtering, and time-stamping at wire speed, with the 10 Mbit embedded SRAM acting as a packet buffer. Industrial temperature grading enables DIN-rail or substation deployment without derating.
Recommended
Motor Control and Industrial Drive Interfaces
The 10CX150YU484E6G supports multi-axis motor control by combining fast PWM generation, encoder feedback decoding (EnDat, BiSS, Tamagawa), and field-oriented control loops in a single fabric. The variable-precision DSP blocks run Park/Clarke transforms and PI controllers at sub-microsecond latency, while the hardened transceivers accept industrial feedback protocols such as Hiperface DSL. Designers close the current loop at 32-100 kHz per axis on 3-4 axes simultaneously. The 484-ball BGA offers sufficient I/O to bring out 12-16 PWM channels and incremental-encoder interfaces.
Recommended
Low-Cost 10G/6G Optical Transport and CPRI
The 10CX150YU484E6G's hardened multi-gigabit transceivers and 150K logic elements enable low-cost fronthaul and small-cell backhaul designs running CPRI or OBSAI over fiber. The transceivers serialize 6G/10G CPRI streams with deterministic latency, and the FPGA fabric implements CPRI framing, RE mapping, and IQ compression for radio units. Compared with a custom ASIC, this FPGA allows field-upgradeable CPRI revisions and operator-specific feature sets. The industrial temperature grade supports outdoor small-cell enclosures.
Recommended
PCI Express Endpoint Card for Embedded Compute
The 10CX150YU484E6G's PCIe Gen2 hard IP enables a low-cost endpoint card that interfaces a host CPU to FPGA-side high-speed peripherals, FPGA co-processing, or custom accelerators. A typical x4 Gen2 link provides 2 GB/s of DMA bandwidth, more than enough for high-speed ADC capture, software-defined-radio baseband processing, or GPU offload. The 150K logic elements implement the PCIe application layer, DMA engines, and the user accelerator, while 10 Mbit of embedded SRAM acts as descriptor and data buffers. Industrial temperature grading supports telecom and industrial-server environments.
Recommended
Software Defined Radio Baseband Processing
The 10CX150YU484E6G is well-matched to small-form-factor SDR baseband processing where a wideband ADC/DAC streams into the FPGA fabric and DSP chains perform channelization, modulation, and demodulation. The variable-precision DSP blocks run polyphase filterbanks and FFT engines at radio sample rates, while the hardened transceivers accept the ADC/JESD204B serialized samples directly. The 10 Mbit embedded SRAM holds FFT windows and channelizer taps, and the PCIe Gen2 hard IP pushes demodulated data to a host processor. The 20 nm process keeps the device within SDR chassis thermal envelopes.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YU484E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YU484E5G | 10CX150YU484I6G | 10CX105YU484E6G | 10CX085YU484E6G | 10CX105YU484E5G |
|---|---|---|---|---|---|---|
| Package | 484-ball UBGA (BFBGA) | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 150,000 | 150,000 | 150,000 | 105,000 (-30%) | 85,000 (-43%) | 105,000 (-30%) |
| Speed Grade | E6G | E5G (one bin slower) | I6G (industrial, one bin faster) | E6G | E6G | E5G |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Hardened Transceivers | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest-density option in the 484-ball UBGA Cyclone 10 GX family (vs 10CX105YU484E6G)
- E6G speed grade offers the fastest timing closure in the 484-ball family (vs 10CX150YU484E5G)
- Industrial temperature grade with full transceiver bandwidth (vs 10CX085YU484E6G)
Design Notes
Estimated: at 100% logic utilization of the 150K LE fabric plus all hardened transceivers active, the Cyclone 10 GX U484 package should be mounted on a 4-6 layer PCB with a continuous ground plane and at least 25 thermal vias under the BGA thermal balls to keep junction temperature within the industrial operating range. Designers should consult the Cyclone 10 GX Thermal Management application note and use Quartus Prime Power Analyzer to confirm thermal margins.
Place decoupling capacitors as close as possible to each BGA power/ground ball pair: a 100 nF X7R per digital supply pin, plus 10 uF and 100 uF bulk capacitors on each supply rail (VCC, VCCP, VCCPGM, VCCA_PLL, VCCR_GXB, VCCT_GXB). The Cyclone 10 GX device datasheet pin connection guidelines specify the exact decoupling network; do not reduce bulk capacitance below the datasheet recommendation to avoid supply droop during configuration.
Transceiver channels on the 10CX150YU484E6G require controlled-impedance (typically 100-ohm differential) routing with length matching across P/N pairs to within the tolerance defined in the Cyclone 10 GX Transceiver Layout Guidelines. Keep transceiver traces on the top layer or stripline-buried layers with a continuous reference ground plane; avoid crossing transceiver routes with noisy digital signals. Place the reference clock as close to the PLL/clock input pin as possible, with the crystal or oscillator on the same layer to minimize stubs.
All configuration and JTAG signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) should be routed with 4-6 mil traces, series-terminated if traces exceed 2 inches, and pulled up to VCCPGM through 10 kohm resistors as specified in the Cyclone 10 GX configuration handbook. Configuration errors are among the most common Cyclone 10 GX bring-up failures and are almost always traceable to weak pull-ups or noisy JTAG clock.
Common pitfalls with the 10CX150YU484E6G include: (1) selecting the wrong Quartus Prime device pinout file for the U484 package - always confirm the .pin file matches the exact ball-map of the device received; (2) ignoring MSL3 moisture sensitivity on the BGA, which requires pre-bake before reflow; (3) under-estimating configuration flash capacity - a 150K-LE design with hardened IP typically needs a 128 Mbit EPCQ flash; (4) leaving unused transceiver channels powered - disable them in Quartus to save power.
Compliance Information
RoHS compliant per distributor listings. REACH compliance assumed per Intel's standard product compliance program. AEC-Q100 not applicable (FPGA, not automotive-grade qualified). Halogen-free status not explicitly stated in the provided data; verify with Intel's latest material declaration. Conflict-minerals compliance per Intel's Corporate Responsibility Report.
