10CX085YU484I6G - 85K LE Cyclone 10 GX FPGA, 484-FBGA | Intel / Altera
MPN: 10CX085YU484I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $255.9 | $255.90 |
| 10 | $235.2 | $2,352.00 |
| 100 | $198.75 | $19,875.00 |
| 500 | $172.4 | $86,200.00 |
| 1,000 | $155.6 | $155,600.00 |
10CX085YU484I6G Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed in-system to implement arbitrary digital logic, signal-processing pipelines, or interface protocols. Within the broader taxonomy, an FPGA is a type of programmable logic device (PLD) -> programmable logic -> semiconductor IC. The Cyclone 10 GX family specifically targets cost-sensitive high-volume applications that need transceivers, making it a member of Intel's low-end FPGA portfolio.
Key features of the 10CX085YU484I6G include 12.5 Gbps GX transceivers for high-speed serial links, hardware floating-point DSP blocks for digital signal processing acceleration, and embedded hard memory controllers. The device supports up to 6.473 Mbits of embedded memory distributed across M20K block memory and MLAB resources, enabling high-throughput data buffering without external SRAM. Configuration is supported through JTAG, AS, PS, and FPP modes with optional encryption using AES-256 bitstream security.
The 10CX085YU484I6G uses a TSMC 20 nm process and an adaptive logic module (ALM) architecture that delivers 1.5x the logic capacity of the previous Cyclone generation per ALM. This makes it well suited for parallel processing, high-speed bridging, and protocol conversion where multiple interface standards coexist on a single board.
Typical applications include industrial machine vision, video surveillance with on-device analytics, motor control and industrial automation, military and aerospace avionics subsystems, broadband access equipment, and PCI Express Gen2 endpoint designs. The integrated transceivers also enable 10 GbE and CPRI links for wireless fronthaul.
When designing with this device, allocate adequate power decoupling (100 nF + 10 µF per supply rail) and follow Intel's power-rail sequencing guidelines. Use the Quartus Prime design suite (Lite / Standard / Pro editions depending on device utilization) for synthesis, place-and-route, and timing closure.
This page synthesizes verified distributor pricing, drop-in same-family alternatives, application guidance, and design considerations not found on the manufacturer datasheet alone.
Drop-in alternatives for 10CX085YU484I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CX085YU484I6G (same form factor and footprint) — differing in Package, Embedded Memory, Operating Temperature, Process Technology, DSP Blocks.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX085YU484I5G
✅ Drop-In✓ In Stock
$85 / Unit
View Datasheet →10CX085YU484E6G
✅ Drop-In✓ In Stock
$282 / Unit
View Datasheet →10CX085YU484E5G
✅ Drop-In✓ In Stock
$82.4 / Unit
View Datasheet →10CX085YU484I6G Maximum Ratings & Electrical Characteristics
| Series | Cyclone® 10 GX |
| Logic Elements (LE) | 85,000 |
| Adaptive Logic Modules (ALM) | 31,000 ALM |
| Embedded Memory | 5,959,680 bits (6.473 Mbit) |
| User I/Os | 188 |
| Package | 484-FBGA (UBGA-484) |
| Operating Supply Voltage (Core) | 0.9 V |
| I/O Supply Voltage | 1.0 V / 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Mounting Style | SMD/SMT |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Process Technology | TSMC 20 nm |
| Transceivers | GX transceivers up to 12.5 Gbps |
| DSP Blocks | Hardware floating-point DSP |
| Configuration | JTAG / AS / PS / FPP, optional AES-256 |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
10CX085YU484I6G 484-fbga (ubga-484) Pin Configuration Guide
Pin configuration for 10CX085YU484I6G (484-fbga (ubga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX085YU484I6G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CX085YU484I6G is suitable for 7 applications: Industrial Machine Vision, Video Surveillance with On-Device Analytics, Motor Control and Industrial Automation, Wireless Fronthaul / CPRI Backhaul, PCI Express Gen2 Endpoint Designs, Test & Measurement Instrumentation, Aerospace Avionics Subsystems.
Industrial Machine Vision
The 10CX085YU484I6G is well suited to industrial machine vision pipelines where multi-camera image acquisition, on-FPGA pre-processing (de-Bayering, color conversion, region-of-interest extraction), and real-time inference must coexist on a single board. Its 85,000 logic elements plus 5,959,680 bits of embedded memory (M20K + MLAB) provide enough parallelism for 1080p60 multi-channel sensor aggregation, while hardware floating-point DSP blocks accelerate convolutional filters. The integrated GX transceivers (up to 12.5 Gbps) allow direct MIPI-CSI-2 / SLVS-EC bridging through FPGAs like the Toshiba TC358743 on the input side and 10 GbE uplink on the output side. The -40 °C to +100 °C industrial temperature range supports factory-floor deployment. A typical implementation pairs this FPGA with a DDR3 memory controller IP block buffering raw Bayer frames before passing processed results to a host CPU via PCIe Gen2 x4.
Recommended
Video Surveillance with On-Device Analytics
Video surveillance NVRs and edge analytics boxes benefit from the 10CX085YU484I6G's combination of high-throughput transceivers and DSP resources. Up to 12.5 Gbps GX links aggregate multiple PoE camera streams or aggregate H.265/H.264 codec blocks before analytics (motion detection, person/vehicle classification) is applied. The 188 user I/Os accommodate parallel LVDS links from sensor front-ends plus control I/O for PTZ cameras, while 31,000 ALMs implement multi-channel video pipelines concurrently. Hardware floating-point DSP blocks accelerate CNN inference, and the 6.473 Mbit embedded memory holds activation buffers without external SRAM. Industrial-grade temperature and RoHS compliance allow deployment in outdoor NEMA enclosures. Compared with a CPU-based analytics box, the FPGA implementation delivers deterministic latency and lower per-channel power.
Recommended
Motor Control and Industrial Automation
The 10CX085YU484I6G is a strong fit for multi-axis motor controllers, programmable logic controllers (PLCs), and industrial servo drives. The ALM-rich fabric implements field-oriented control (FOC) algorithms, SVPWM modulators, and EtherCAT / PROFINET slave stacks in parallel without processor intervention. Hardware floating-point DSP blocks accelerate Park/Clarke transforms and torque-ripple compensation. The 188 I/Os drive multi-axis gate-driver signals, encoder feedback (EnDat, BiSS, SSI), and isolated digital I/O, while the 12.5 Gbps transceivers handle real-time industrial Ethernet. The -40 °C to +100 °C industrial temperature rating suits cabinet-mounted controllers. A typical design uses the FPGA alongside isolated gate drivers (e.g., Si8271) and a 24 V DC-DC intermediate bus.
Recommended
Wireless Fronthaul / CPRI Backhaul
Wireless base-station fronthaul requires deterministic, low-latency transport of IQ data between radio units and baseband units. The 10CX085YU484I6G's GX transceivers (up to 12.5 Gbps) implement CPRI or OBSAI links with the required jitter performance, while the 85,000 logic elements are sufficient for CPRI-to-10 GbE bridging, IQ compression, and basic PHY-layer framing. The 6.473 Mbit embedded memory buffers IQ samples during rate adaptation, reducing the need for external SRAM. Industrial-grade temperature allows outdoor radio-unit deployment in pole-mount enclosures. The PCIe Gen2 hard IP provides a control-plane interface to a baseband SoC. Compared with an ASIC, the FPGA implementation allows late-binding protocol changes (e.g., eCPRI migration).
Recommended
PCI Express Gen2 Endpoint Designs
The Cyclone 10 GX family integrates hard PCI Express Gen2 IP blocks that the 10CX085YU484I6G exposes via its transceiver banks. A typical endpoint design (e.g., low-latency data-acquisition card, software-defined radio) uses PCIe Gen2 x4 (~16 Gbps aggregate) for DMA transfer of ADC samples or DSP results to the host CPU. The 85,000 logic elements implement endpoint protocol logic, DMA engines, and user application, while the 6.473 Mbit embedded memory is sized for typical descriptor rings and small packet buffers. The 484-FBGA package has sufficient transceiver balls for x4 plus a 10 GbE side interface, enabling hybrid PCIe + Ethernet cards. Quartus Prime includes the PCIe Gen2 hard IP and example designs that close timing on the 10CX085 device.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol analyzers, arbitrary waveform generators) use FPGAs to coordinate high-speed ADC/DAC capture, run protocol decoding, and stream data to the host. The 10CX085YU484I6G's 12.5 Gbps transceivers interface directly with multi-GSPS ADCs and DACs (e.g., the AD9234 or AD9144 family), while the 188 I/Os drive front-panel displays and trigger logic. The 85,000 logic elements implement protocol decoders (PCIe, USB 3.0, SATA, DisplayPort) in soft logic alongside the transceiver PHY. Hardware floating-point DSP blocks accelerate FFT, FIR filtering, and modulation analysis. Industrial temperature and long-term Intel lifecycle support (typical 15+ years) suit laboratory and production-line ATE.
Recommended
Aerospace Avionics Subsystems
Avionics subsystems (radar processing, flight-control I/O, data concentrators) value the 10CX085YU484I6G for its combination of MIL-STD-1553 / ARINC 429 soft IP support, deterministic latency, and industrial-grade temperature range. The 85,000 logic elements handle multiple ARINC 429 channels in parallel plus backplane Ethernet (A664 / AFDX) bridges; 12.5 Gbps transceivers support AFDX / Fibre Channel links to mission computers. The 6.473 Mbit embedded memory reduces board area by avoiding external SRAM for ARINC buffering. Compared with older Cyclone IV designs, the 20 nm Cyclone 10 GX offers 2x logic density per watt, enabling higher functional integration in size/weight-constrained enclosures. The 'I6G' suffix confirms lead-free RoHS packaging compatible with modern avionics build standards.
Recommended
Recommended Products Summary
Engineering reference data for 10CX085YU484I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX085YU484I5G | 10CX085YU484E6G | 10CX085YU484E5G |
|---|---|---|---|---|
| Package | 484-FBGA (UBGA-484) | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Logic Elements | 85,000 LE | 85,000 LE | 85,000 LE | 85,000 LE |
| Embedded Memory | 5,959,680 bits | 5,959,680 bits | 5,959,680 bits | 5,959,680 bits |
| User I/Os | 188 | 188 | 188 | 188 |
| Transceivers | Up to 12.5 Gbps GX | Up to 12.5 Gbps GX | Up to 12.5 Gbps GX | Up to 12.5 Gbps GX |
| Speed Grade | -6 (mid) | -5 (fastest) | -6 (mid) | -5 (fastest) |
| Temperature Grade | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Extended (commercial) 0 to +85 °C | Extended (commercial) 0 to +85 °C |
Key Differentiators
- Integrated 12.5 Gbps GX transceivers with hard PCIe Gen2 IP (vs 10CL080YU484I7G (Cyclone 10 LP))
- Higher logic density than Cyclone 10 LP at similar package cost (vs 10CL080YU484I7G (Cyclone 10 LP, 80K LE))
- Same-package variants for temperature and speed flexibility (vs 10CX085YU484I5G / E6G / E5G family)
Design Notes
The Cyclone 10 GX device requires multiple supply rails: a 0.9 V core (VCC), 0.9 V or 1.0 V transceiver supplies (VCCR_GXB, VCCT_GXB), and per-bank VCCIO for I/O (1.0 V to 3.3 V). Decoupling must follow Intel's power distribution network (PDN) guidelines - typically 100 nF + 10 µF per supply pin group plus bulk polymer capacitors at the voltage regulator outputs. Power sequencing must satisfy the VCC-before-VCCIO-before-VCCAUX order; failure to sequence correctly may trigger in-rush current events that damage the device. Estimate: at 85% resource utilization and full transceiver operation, total power consumption can reach 8-12 W; thermal management with a heatsink or thermal via array under the BGA is required.
The 484-FBGA package has a 0.8 mm or 1.0 mm ball pitch (verify with the device pin-out file). PCB layout must use microvia (laser-drilled) stack-up with 4-6 layers minimum, with the top layer dedicated to FPGA break-out and inner layers for high-speed transceiver routing. Controlled-impedance routing (100 Ω differential for transceivers, 50 Ω single-ended for general-purpose I/O) must follow Intel's loss-budget guidelines. Decoupling capacitors must be placed within 100 mils of the respective supply balls and connected to an inner ground plane via short vias.
Do not confuse the Cyclone 10 GX (10CX) with the Cyclone 10 LP (10CL) family - they have incompatible bitstreams, different transceiver availability, and different supply-rail requirements. Also note that the I6G suffix indicates industrial temperature with speed grade 6; if your timing closure margin is tight, consider the faster I5G speed grade in the same package. Finally, the 10CX085YU484I6G's configuration via JTAG requires a USB-Blaster II or compatible cable - older USB-Blaster cables do not support 1.8 V/2.5 V VCCIO levels common in modern boards.
Compliance Information
RoHS compliant per the 'G' suffix in the ordering code. Not AEC-Q100 qualified (use 10CX085 automotive variants if needed). MSL-3 moisture-sensitive device requires standard 168-hour floor-life handling before reflow.
