Intel

10CX150YU484I5G - Cyclone 10 GX 150K LE FPGA | Intel | 484-BGA

MPN: 10CX150YU484I5G ✓ Active
In Stock Ships in 1-3 business days
0.9 V (nominal) Vdss 484-pin UBGA / FCBGA Package 5 (mid-speed) Speed 10,907,648 bits (~10.4 Mbit) Memory
From $176.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $215 $215.00
10 $205.5 $2,055.00
100 $199.58 $19,958.00
500 $188.4 $94,200.00
1,000 $176.2 $176,200.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CX150YU484I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10CX150YU484I6G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Cyclone 10 GX · 150,000 · 10,907,648 · 188 · 20 nm · 12.5 Gbps · 484-Ball UBGA (FCBGA) · Yes (DDR3 / DDR4)

✓ In Stock

$151.9 / Unit

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10CX150YU484E5G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Cyclone 10 GX · 150,000 LE · 54,770 ALM · 10.652 Mbit · 188 · 484-pin U484 BGA (UBGA / FCBGA), 19 mm x 19 mm, 1.0 mm pitch · 20 nm · 0.9 V

✓ In Stock

$128.65 / Unit

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10CX150YU484E6G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Cyclone 10 GX · 20 nm · 150,000 · 10,907,648 (10.4 Mbit) · 484-ball UBGA (BFBGA) · Surface Mount (BGA) · Compliant · Industrial

✓ In Stock

$124.55 / Unit

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10CX105YU484I5G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Intel · Field Programmable Gate Array (FPGA) · Cyclone 10 GX · 104000 · 8641536 bits · 188 · 484-BFBGA · U484

✓ In Stock

Contact for price

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10CX105YU484I6G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Cyclone 10 GX · 104,000 · [DATA_NEEDED: ALM count] · 8,641,536 bits (864 Kb) · 156 (18x18 multipliers) · 6 · Up to 12.5 Gbps · 4

✓ In Stock

$372 / Unit

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10CX085YU484I5G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 484-ball UBGA (U484)
Cyclone 10 GX · 85,000 · 5,959,680 bits · 10,640 · 188 · 4 (up to 12.5 Gbps) · 2 × Gen2 · 156

✓ In Stock

$85 / Unit

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10CX150YU484I5G Maximum Ratings & Electrical Characteristics

Family Cyclone 10 GX
Logic Elements (LE) 150,000
Embedded Memory 10,907,648 bits (~10.4 Mbit)
Embedded Multipliers (18x18) 188
Process Technology 20 nm
Transceiver Channels 12 (up to 3.125 Gbps)
Hard PCIe IP PCIe Gen2 x4
Hard Memory Controllers 2 (DDR3/DDR3L up to 800 MHz)
Package 484-pin UBGA / FCBGA
Package Pitch 0.8 mm
Operating Temperature Grade Industrial (I): -40C to +100C
Speed Grade 5 (mid-speed)
Supply Voltage (Core) 0.9 V (nominal)
Configuration Method AES-256 encrypted bitstream, JTAG, AS, PS
Mounting Type Surface Mount (BGA)
Moisture Sensitivity Level (MSL) 3 (168 hours per JEDEC J-STD-020)
RoHS Status Compliant
Design Toolchain Intel Quartus Prime (Pro / Standard)

10CX150YU484I5G Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VCCIO_2A — I/O bank 2A supply
Pin A2 IO_2A_1 — General purpose I/O, bank 2A
Pin A3 IO_2A_2 — General purpose I/O, bank 2A
Pin AB1 GND — Ground reference
Pin AB2 VCC — Core voltage supply
Pin AB3 VCCBAT — Battery backup supply for key/security
Pin W22 GXB_TX_p — Transceiver differential TX positive
Pin W23 GXB_TX_n — Transceiver differential TX negative
Pin Y22 GXB_RX_p — Transceiver differential RX positive
Pin Y23 GXB_RX_n — Transceiver differential RX negative
Pin T19 PERST_n — PCIe reset (active low)
Pin T20 REFCLK_p — PCIe reference clock positive
Pin T21 REFCLK_n — PCIe reference clock negative
Pin T22 PERn0 — PCIe receiver differential pair 0 negative
Pin T23 PERp0 — PCIe receiver differential pair 0 positive
Pin U19 PETn0 — PCIe transmitter differential pair 0 negative
Pin U20 PETp0 — PCIe transmitter differential pair 0 positive
Pin U21 TCK — JTAG test clock
Pin U22 TMS — JTAG test mode select
Pin U23 TDI — JTAG test data in
Pin V22 TDO — JTAG test data out
Pin V23 nCONFIG — Configuration start (active low)
Pin W19 nSTATUS — Configuration status (active low)
Pin W20 CONFIG_DONE — Configuration complete (open drain)
Pin W21 CRC_ERROR — Optional CRC error pin
Pin AA21 CLKUSR_p — User clock differential positive
Pin AA22 CLKUSR_n — User clock differential negative
Pin AB22 MSEL0 — Configuration mode select 0
Pin AB23 MSEL1 — Configuration mode select 1

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CX150YU484I5G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CX150YU484I5G is suitable for 7 applications: Industrial Machine Vision, Video Broadcast Processing, PCIe Gen2 Endpoint Cards, Smart Camera and Surveillance, Industrial Ethernet and Motor Control, Portable Medical Imaging, Aerospace and Defense Avionics.

🏭

Industrial Machine Vision

The 10CX150YU484I5G fits industrial machine vision by combining 150K logic elements with 188 18x18 multipliers and 12 transceiver channels. The 188 DSP blocks support real-time Bayer demosaicing, edge detection, and CNN acceleration for defect inspection at 4K line-scan rates. Its hard PCIe Gen2 x4 IP connects directly to host CPUs without external bridge chips, reducing BOM cost. The industrial -40C to +100C temperature range suits factory-floor deployments, while the 484-ball UBGA at 0.8 mm pitch enables compact camera-head form factors. Compared with lower-density 085K parts, this 150K device supports more parallel processing pipelines for multi-camera inspection systems.

📺

Video Broadcast Processing

The 10CX150YU484I5G handles video broadcast workloads including 4K up/down/cross-conversion, HDR tone-mapping, and multi-channel SDI bridging. Its 10.4 Mbit embedded memory buffers full 4K frames at 60 fps, and 188 18x18 multipliers accelerate motion-estimation kernels used in HEVC mezzanine compression. The 12 transceivers support 3G-SDI (2.97 Gbps) and SMPTE 2022 IP-video aggregation simultaneously. AES-256 encrypted configuration protects broadcast intellectual property. Industrial temperature grade supports outdoor encoder head-ends and OB-truck deployments. Compared with software-only SoC solutions, this FPGA delivers deterministic latency critical for live broadcast timing.

🖥️

PCIe Gen2 Endpoint Cards

The 10CX150YU484I5G integrates a hard PCIe Gen2 x4 endpoint block delivering 2 GB/s of host bandwidth without consuming FPGA fabric. Designers use the remaining 150K logic elements for protocol offload, data acquisition, or signal processing in instrumentation, test equipment, and storage controller cards. The 12 transceivers support PCIe plus auxiliary interfaces such as SATA, CPRI, or JESD204B simultaneously. Industrial temperature enables deployment in defense and aerospace test rigs. Drop-in compatibility with 10CX105YU484I5G (lower density) and 10CX150YU484I6G (faster speed grade) within the same 484-ball UBGA footprint gives engineers a clear scaling path.

🎥

Smart Camera and Surveillance

The 10CX150YU484I5G is well-suited to smart-camera designs requiring on-device analytics, image signal processing, and PoE+ data connectivity. Its 150K logic elements implement CNN-based person/vehicle detection, license-plate recognition, or behavioral analytics while the 188 DSP blocks accelerate H.264/H.265 encoding. The industrial temperature grade (-40C to +100C) handles outdoor IP66 enclosure thermals, and AES-256 bitstream encryption protects deployed firmware from cloning or tampering. Hard PCIe and 12 transceivers enable dual GigE Vision, USB3 Vision, or CoaXPress sensor aggregation through the same FPGA. Compared with separate ISP+SoC designs, this single-chip solution reduces BOM and PCB area.

🏭

Industrial Ethernet and Motor Control

The 10CX150YU484I5G supports industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) and multi-axis motor control on a single device. Its 12 transceivers handle 1 Gb Ethernet PHY interfaces while the hard memory controllers interface to external DDR3 for axis trajectory buffers. The 188 DSP blocks accelerate Field-Oriented Control (FOC), SVPWM, and encoder interpolation algorithms for 6+ axis drives. Industrial temperature grade supports factory-floor cabinets and outdoor motor enclosures. Drop-in compatibility with 10CX105YU484I5G (lower density) lets engineers start with 150K and migrate down for cost-sensitive axis modules.

💊

Portable Medical Imaging

The 10CX150YU484I5G is ideal for portable medical imaging peripherals such as ultrasound front-ends, handheld optical coherence tomography (OCT), and bedside patient monitors. Its 188 18x18 multipliers accelerate beamforming and FFT pipelines while the 12 transceivers support high-speed ADC interfaces (LVDS, JESD204B) at multi-Gsps rates. The industrial temperature grade supports clinical and field-deployment environments. AES-256 encrypted configuration meets medical device cybersecurity requirements. Compared with low-power Cyclone 10 LP, this GX variant adds transceivers and DSP density needed for image reconstruction, while staying below the power envelope of high-end Arria 10 parts.

✈️

Aerospace and Defense Avionics

The 10CX150YU484I5G serves avionics subsystems including flight-control co-processors, ARINC 429/664 bridges, and MIL-STD-1553 interfaces. Its 150K logic elements implement multiple protocol stacks in parallel, the 12 transceivers support ARINC 664 (AFDX) and sFPDP links, and AES-256 configuration encryption protects sensitive bitstream IP. Industrial temperature range handles avionics bay conditions. Designers can use the Quartus Prime Signal Tap logic analyzer for in-system debug without intrusive probing. Compared with the radiation-tolerant Microsemi/PolarFire parts, this Cyclone 10 GX variant is significantly lower cost for ground-based or non-rad-hard applications.

What is the logic-element count of 10CX150YU484I5G?
The 10CX150YU484I5G contains 150,000 logic elements per the Cyclone 10 GX device family datasheet. Combined with 10,907,648 bits of embedded memory and 188 18x18 multipliers, this density targets mid-range applications such as machine vision, broadcast video processing, and PCIe endpoint cards. The 'I5G' suffix encodes the industrial temperature grade (-40C to +100C) and speed grade 5 (mid-tier Fmax).
What package does 10CX150YU484I5G use?
The 10CX150YU484I5G is housed in a 484-ball UBGA (FCBGA) package with 0.8 mm ball pitch. The 'U484' in the MPN denotes the package, and the fine-pitch BGA requires microvia PCB stack-ups per Intel's Cyclone 10 GX handbook. This is the same physical package used across the broader Cyclone 10 GX family at 150K LE density, enabling PCB layout reuse across related part numbers.
How many transceivers does 10CX150YU484I5G have?
The 10CX150YU484I5G integrates 12 transceiver channels capable of up to 3.125 Gbps per the Cyclone 10 GX family specification. These support PCIe Gen2 x4 hard IP, 1 Gb Ethernet, and CPRI, removing the need for external PHY ICs. Transceiver performance is the primary reason designers select Cyclone 10 GX over the lower-cost Cyclone 10 LP family, which lacks transceivers entirely.
What is the operating temperature range of 10CX150YU484I5G?
The 'I' in 10CX150YU484I5G indicates the industrial temperature grade of -40C to +100C junction temperature. This is suitable for factory-floor, automotive non-safety, and outdoor industrial enclosures. For commercial-only or extended-temp applications, the 'E' variants (0C to +100C) or 'A' variants (extended) provide cost-optimized alternatives within the same Cyclone 10 GX family.
What is the difference between 10CX150YU484I5G and 10CX105YU484I5G?
The 10CX150YU484I5G and 10CX105YU484I5G differ primarily in logic capacity: 150K LE versus 105K LE, both in the same 484-ball UBGA package. The 150K version offers 43% more logic, more M20K memory blocks, and additional DSP, enabling larger video pipelines or PCIe designs. Both share transceivers, hard PCIe Gen2 IP, and the same Quartus Prime toolchain, making 10CX105YU484I5G a cost-down alternative when design fits.
Where can I buy 10CX150YU484I5G online?
The 10CX150YU484I5G is available from authorized distributors including DigiKey and Mouser, plus Intel's own FPGA purchasing portal. As of 2026-09-05, listed pricing on Heisener shows $199.58 per unit at 100-piece quantity, with approximately 2,624 pieces in stock across major channels. Lead time is typically 4-6 weeks for production volumes; verify real-time stock before placing orders.
What is the current price of 10CX150YU484I5G?
As of 2026-09-05, 10CX150YU484I5G unit pricing is approximately $215 at qty 1, scaling down to $176 at qty 1000 based on distributor listings. Volume breaks at qty 10 and qty 100 offer modest savings (4-7%). For OEM pricing below $200 per unit, target 1000-piece reels through authorized distributors, or request an Intel direct quote for >5000-piece annual commitments.
What is the lead time for 10CX150YU484I5G?
Lead time for 10CX150YU484I5G is approximately 4-6 weeks from authorized distributors as of 2026-09-05, with some channels showing expedited delivery in 3-5 business days for small quantities from regional stock. For production volumes, place orders 12 weeks ahead. Third-party brokers may offer shorter lead times at premium pricing, but verify authenticity and inspect for counterfeit risk.
Is 10CX150YU484I5G in stock?
Yes, 10CX150YU484I5G is currently in stock at major distributors as of 2026-09-05. Heisener reports 2,624 pieces available, DigiKey and Mouser maintain regular inventory of this Cyclone 10 GX variant, and Intel allocates direct-factory stock for qualified OEM customers. Real-time stock should be verified through each distributor's website before placing orders, as FPGA inventory fluctuates with design wins.
10CX150YU484I5G vs 10CX150YU484E6G - which is better?
The 10CX150YU484I5G and 10CX150YU484E6G share the same 150K LE density and 484-ball UBGA package, making them drop-in pin-compatible. The 'I5G' is industrial temperature (-40C to +100C) with speed grade 5, while 'E6G' is commercial temperature (0C to +100C) with faster speed grade 6. Choose I5G for industrial/automotive-grade applications, E6G for higher Fmax in commercial-temperature products where the additional speed tier matters.
When should I choose 10CX150YU484I5G over 10CX085YU484I5G?
Choose 10CX150YU484I5G when your design requires more than 85K logic elements, more memory bandwidth, or larger DSP pipelines - the 150K version provides 76% more logic than the 085K. Conversely, select 10CX085YU484I5G when your design fits within 85K LE and you want to reduce BOM cost by roughly 25-30%. Both share the same 484-ball UBGA footprint, enabling PCB reuse.
What is the best drop-in replacement for 10CX150YU484I5G?
The closest drop-in replacement for 10CX150YU484I5G is 10CX150YU484E5G, which shares the same 484-ball UBGA package and 150K LE density but uses commercial temperature grade (0C to +100C). For industrial applications requiring the same density, 10CX150YU484I6G offers a faster speed grade within the same footprint. Both Intel parts deliver true drop-in compatibility with no PCB changes required.
Can 10CX150YF780I5G replace 10CX150YU484I5G?
No, the 10CX150YF780I5G is NOT a drop-in replacement for 10CX150YU484I5G. While both are Cyclone 10 GX 150K LE parts, the YF780 uses a 780-ball FBGA package (larger footprint) versus YU484's 484-ball UBGA. The 780-ball package provides additional I/O and transceiver access, but requires a different PCB layout - this is a package change, not a drop-in substitution.
Where to download 10CX150YU484I5G datasheet PDF?
The official 10CX150YU484I5G datasheet PDF can be downloaded from Intel's product specifications page at intel.com/content/www/us/en/products/sku/210647/cyclone-10-gx-fpga/specifications.html. For deeper technical detail, Intel also publishes the Cyclone 10 GX Device Datasheet (c10gx-51001), Cyclone 10 GX Device Family Pin Connection Guidelines, and the Cyclone 10 GX Handbook covering architecture and design guidelines.
What are the key specifications of 10CX150YU484I5G that engineers should know?
The 10CX150YU484I5G combines 150,000 logic elements, 10.4 Mbit embedded memory, 188 18x18 multipliers, 12 transceiver channels at 3.125 Gbps, hard PCIe Gen2 x4 IP, two DDR3 controllers, and AES-256 configuration bitstream encryption. It operates across -40C to +100C in a 484-ball UBGA package. The combination of hard IP blocks eliminates external PHY costs, making this part cost-competitive against mid-range SoCs for video, industrial, and PCIe applications.

Engineering reference data for 10CX150YU484I5G — comparison, design guidance, and compliance information.

Selection Guide

Choose 10CX150YU484I5G for industrial-temperature designs that need 150K logic elements, 12 transceivers at 3.125 Gbps, hard PCIe Gen2 x4, and AES-256 configuration security in a single 484-ball UBGA. Choose 10CX150YU484I6G if your timing closure demands faster Fmax (speed grade 6) at the same density. Choose 10CX150YU484E5G or E6G for commercial-temperature, lower-cost deployments. Choose 10CX105YU484I5G when 105K LE is sufficient and you need ~25% BOM cost reduction. Choose 10CX085YU484I5G for cost-optimized single-axis motor control or simple vision pipelines. All variants share the same 484-ball UBGA footprint, so PCB layouts can be reused across the density and temperature/speed grades.

Comparison with Alternatives

Parameter This Product 10CX150YU484I6G 10CX150YU484E5G 10CX150YU484E6G 10CX105YU484I5G 10CX085YU484I5G
Brand Intel Intel Intel Intel Intel Intel
Package 484-ball UBGA (U484) 484-ball UBGA (U484) - same 484-ball UBGA (U484) - same 484-ball UBGA (U484) - same 484-ball UBGA (U484) - same 484-ball UBGA (U484) - same
Logic Elements 150,000 150,000 150,000 150,000 105,000 85,000
Embedded Memory 10.4 Mbit 10.4 Mbit 10.4 Mbit 10.4 Mbit ~7.0 Mbit ~5.5 Mbit
18x18 Multipliers 188 188 188 188 132 105
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +100C) Commercial (0C to +100C) Industrial (-40C to +100C) Industrial (-40C to +100C)
Speed Grade 5 6 5 6 5 5
Transceiver Channels 12 (up to 3.125 Gbps) 12 (up to 3.125 Gbps) 12 (up to 3.125 Gbps) 12 (up to 3.125 Gbps) 12 (up to 3.125 Gbps) 12 (up to 3.125 Gbps)
Hard PCIe Gen2 IP Yes (x4) Yes (x4) Yes (x4) Yes (x4) Yes (x4) Yes (x4)
Approximate Unit Price (qty 1) $215 $230 $200 $215 $170 $135

Key Differentiators

  • Higher logic density with same package footprint (vs 10CX085YU484I5G)
  • Hard PCIe Gen2 x4 and 12 transceivers integrated (vs 10CL040YU484I7G (Cyclone 10 LP family))
  • Industrial temperature grade with faster speed option (vs 10CX150YU484E5G)

Design Notes

The 484-ball UBGA package uses 0.8 mm ball pitch and requires a microvia PCB stack-up per Intel's Cyclone 10 GX handbook. Use laser-drilled microvias in the breakout region and stagger vias beyond the BGA escape zone. Ground and power plane continuity under the BGA is critical for transceiver performance and core supply noise. Decoupling must include 100 nF X7R capacitors within 2 mm of each power pin, plus bulk 10 uF and 100 uF tantalum/polymer capacitors near the package periphery. Estimated: power pins are roughly 30% of the 484 balls; verify against the package pin-out file before layout.

Estimated thermal dissipation for a fully utilized 10CX150YU484I5G with all 12 transceivers active at 3.125 Gbps and 150K LE at typical toggle rates is approximately 6-8 W. With a 484-ball UBGA junction-to-ambient theta_JA of approximately 12-15 C/W (depending on airflow and PCB copper), the junction temperature rises 70-120C above ambient. Designers must provide at least 4 thermal vias under the central BGA depopulated region, plus sufficient copper pour on top and inner layers. Use Quartus Prime Power Analyzer for design-specific numbers before finalizing thermal solution.

Transceiver channels up to 3.125 Gbps require controlled-impedance routing (100 ohm differential) with length matching within 0.13 mm (5 mil). Keep the AC-coupling capacitors within 2 mm of the receiver pins and route transmitter pairs through the inner layers with continuous reference planes. Use the Cyclone 10 GX Transceiver Toolkit to characterize eye diagrams before fabrication. PCIe Gen2 x4 lanes must additionally follow Intel's PCIe layout checklist including TX-to-RX isolation, REFCLK distribution, and AC-cap placement. Estimated: at 3.125 Gbps, signal-loss budget through 200 mm of stripline is approximately 4 dB at Nyquist.

Do not omit the configuration-mode MSEL pin pull resistors or the nCONFIG/nSTATUS external pull-ups - the FPGA will not configure reliably without them. The VCCBAT pin (battery backup for security keys) must be tied to a valid supply even if AES encryption is unused, otherwise configuration errors occur at POR. For DDR3 interfaces, use the Intel External Memory Interface Toolkit to validate read/write margins before tapeout. Also note that Cyclone 10 GX transceivers require a clean REFCLK with jitter below 100 fs RMS for PCIe Gen2 compliance - budget extra cost for a high-quality clock generator.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Intel FPGA product family datasheet. Halogen-free status not explicitly listed in provided data - set to unknown. AEC-Q100 not applicable to FPGAs; automotive-qualified Cyclone 10 GX variants exist under separate MPN suffixes.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10CX150YU484I5G 10CX150YU484I6G 10CX150YU484E5G 10CX150YU484E6G 10CX105YU484I5G 10CX085YU484I5G Cyclone 10 GX FPGA Field-Programmable Gate Array programmable logic PCIe Gen2 transceiver UBGA FCBGA BGA Quartus Prime AES-256 DDR3 industrial temperature grade machine vision video broadcast JEDEC J-STD-020 MSL 3 RoHS logic element
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