10CX220YU484E5G - 220K LE Cyclone 10 GX FPGA 484-BGA | Intel
Teilenummer: 10CX220YU484E5G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $272.59 | $272,59 |
| 10 | $258.95 | $2.589,50 |
| 100 | $235.8 | $23.580,00 |
| 500 | $210.4 | $105.200,00 |
| 1.000 | $189.95 | $189.950,00 |
10CX220YU484E5G Übersicht
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. Within the broader taxonomy, an FPGA sits under programmable logic -> logic IC -> integrated circuit -> semiconductor. Cyclone 10 GX specifically targets industrial, automotive, video broadcast, and IoT edge applications where designers need a balance of logic capacity, low power consumption, and integrated multi-gigabit transceivers without paying for the higher-end Stratix family price tier.
Key specifications include up to 12.5 Gbps multi-gigabit transceivers with hard PCIe Gen2 x4 IP blocks, hardware floating-point DSP blocks for high-throughput signal processing, and a hardened memory controller subsystem supporting DDR3/DDR4/LPDDR3 external memory interfaces. The 188 user I/O pins support LVDS, LVCMOS, SSTL, and HSTL I/O standards with individually-controllable slew rate and drive strength. The device supports up to 6.144 Mb of distributed RAM (MLAB) and 13.75 Mb of embedded M20K block RAM.
Cyclone 10 GX uses a low-power architecture optimized for thermal envelope-constrained designs. Static power reduction features include optional clock gating per LAB, power gating of unused transceivers, and Intel's Quartus Prime software-driven power optimization. The 20nm process delivers a typical core VCC of 0.9V, which reduces dynamic power by approximately 30% compared to the prior 28nm Cyclone V generation while preserving pin-to-pin package compatibility for many design footprints.
Typical applications include industrial machine vision over CoaXPress or GigE Vision, video broadcast and pro-AV signal processing with DisplayPort or HDMI aggregation, automotive driver assistance (ADAS) sensor fusion, PCIe Gen2 x4 endpoint cards, and IoT edge inference accelerators. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and board area for protocols like 10GbE, CPRI, and JESD204B.
Design consideration: when targeting 10CX220YU484E5G, designers should use Intel Quartus Prime software (Lite or Standard edition depending on license) and verify pinout assignments against the device-specific pin table in the Cyclone 10 GX Device Handbook, as 484-pin UBGA variants differ from F780 and F672 package pinouts even at the same logic density. Power estimation should be run early using the PowerPlay Early Power Estimator to validate thermal budgets.
This page synthesizes Intel distributor pricing, drop-in same-family alternatives, and practical design notes that are not aggregated in the manufacturer datasheet PDF alone. Engineers searching for a 220K LE Cyclone 10 GX in a 484-pin UBGA can use the comparison_table and alternatives list below to evaluate drop-in same-package siblings and cross-brand candidates.
Drop-in-Alternativen für 10CX220YU484E5G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CX220YU484E5G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Family, Mounting Type, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CX220YU484E6G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$160 / Stück
Datenblatt ansehen →10CX220YU484I5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$42.38 / Stück
Datenblatt ansehen →10CX220YU484I6G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$277 / Stück
Datenblatt ansehen →10CX150YU484E5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$128.65 / Stück
Datenblatt ansehen →10CX105YU484E5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$275 / Stück
Datenblatt ansehen →10CX085YU484E5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$82.4 / Stück
Datenblatt ansehen →10CX220YU484E5G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone® 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| Embedded Memory (M20K blocks) | 594 |
| MLAB (distributed RAM) | 6,144 Kbits |
| DSP Blocks | 156 (variable-precision) |
| User I/O Count | 188 |
| Multi-Gigabit Transceivers | Up to 12.5 Gbps |
| Hard PCIe IP Blocks | PCIe Gen2 x4 (2 hard IP blocks) |
| Process Technology | TSMC 20nm |
| Core Voltage (nominal) | 0.9 V |
| Gehäuse | 484-pin UBGA (BFBGA) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40°C to +100°C (industrial) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Device Family Tier | Mid-range (Cyclone series) |
10CX220YU484E5G 484-pin ubga (bfbga) Pinbelegungsleitfaden
Pinbelegung für 10CX220YU484E5G (484-pin ubga (bfbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CX220YU484E5G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CX220YU484E5G ist geeignet für 6 Anwendungs: Industrial Machine Vision Systems, Video Broadcast and Pro-AV Aggregation, Automotive Driver Assistance (ADAS) Sensor Fusion, PCIe Gen2 Endpoint Accelerator Cards, IoT Edge Inference and Protocol Bridging, Test and Measurement Instrumentation.
Industrial Machine Vision Systems
The 10CX220YU484E5G is well suited for industrial machine vision processing over CoaXPress 2.0 or GigE Vision interfaces because it integrates multi-gigabit transceivers up to 12.5 Gbps alongside 156 variable-precision DSP blocks and 594 M20K embedded memory blocks (13.75 Mbits). Designers can implement real-time Bayer demosaicing, defect detection, and frame buffering entirely in FPGA fabric without external DSP chips, reducing BOM cost. The 188 user I/O pins drive multiple Camera Link channels or MIPI CSI-2 inputs via soft IP, while the 0.9V core and 20nm process keep thermal envelope manageable in sealed IP67 enclosures.
Empfohlen
Video Broadcast and Pro-AV Aggregation
In video broadcast routers and pro-AV wall controllers, the 10CX220YU484E5G aggregates multiple HDMI 2.0, DisplayPort 1.4, or 12G-SDI streams by leveraging its transceiver-based serial input and parallel LVDS video outputs. The 220,000 logic elements handle 4K60 4:4:4 chroma resampling, HDR metadata insertion, and multi-view compositing within a single chip. The hard PCIe Gen2 x4 IP block enables direct host attachment for control planes, eliminating a separate PCIe bridge chip. Board designers benefit from the 484-pin UBGA package that supports the high pin-count required for parallel video data and DDR4 external memory interfaces for frame buffering.
Empfohlen
Automotive Driver Assistance (ADAS) Sensor Fusion
The 10CX220YU484E5G serves as a sensor-fusion hub in ADAS platforms, combining radar, LiDAR, and camera data streams via its multi-gigabit transceivers running at 3-12.5 Gbps. The DSP blocks perform fixed-point FFT and CFAR detection on radar returns in real time, while 13.75 Mbits of M20K block RAM holds multi-frame point-cloud buffers. Designers should pair the E5G speed grade with industrial-grade (I5G) variant for production automotive deployments to meet the -40C to +100C junction temperature requirement. The PCIe Gen2 hard IP links the FPGA to a host SoC for object-level fusion and decision processing.
Empfohlen
PCIe Gen2 Endpoint Accelerator Cards
The 10CX220YU484E5G implements a PCIe Gen2 x4 endpoint accelerator card for low-latency inference and DSP offload workloads from a host CPU. The two hard PCIe Gen2 IP blocks provide a 4-lane Gen2 root port without consuming fabric logic, leaving 220K LEs fully available for the user accelerator function. The 12.5 Gbps transceivers can also drive 10GbE or CPRI links for hybrid accelerator + fronthaul designs. The 484-pin UBGA package exposes sufficient user I/O for parallel DDR4 x72 memory channels for high-bandwidth weight or data caches.
Empfohlen
IoT Edge Inference and Protocol Bridging
For IoT edge gateways, the 10CX220YU484E5G bridges industrial protocols like PROFINET, EtherCAT, and Modbus TCP to cloud uplinks via 10GbE or Wi-Fi 6E backhaul interfaces. The 220K LEs run protocol stacks in soft logic while the integrated transceivers handle the high-speed uplink. Hardened memory controllers connect to DDR3/DDR4 for protocol buffer storage. Designers choose the E5G speed grade for indoor controlled-temperature edge appliances; the I5G variant suits outdoor enclosures with wider thermal swings. Power consumption scales efficiently because unused transceivers can be power-gated via Quartus Prime.
Empfohlen
Test and Measurement Instrumentation
In benchtop and modular T&M equipment such as protocol analyzers, oscilloscopes, and BERT testers, the 10CX220YU484E5G provides the logic density and 12.5 Gbps transceivers needed for high-speed serial data capture and pattern generation. The 188 user I/O pins drive parallel logic-analyzer pods or A/D converter interfaces, while the 156 DSP blocks accelerate FFT-based spectrum analysis in real time. Designers value the Quartus Prime platform because the same silicon targets both prototype and production instruments, simplifying firmware reuse. The 484-pin UBGA keeps the design compact enough for 3U PXIe form-factor modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CX220YU484E5G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CX220YU484E6G | 10CX220YU484I5G | 10CX220YU484I6G | 10CX150YU484E5G | 10CX105YU484E5G | 10CX085YU484E5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (BFBGA) | 484-pin UBGA (BFBGA) - same | 484-pin UBGA (BFBGA) - same | 484-pin UBGA (BFBGA) - same | 484-pin UBGA (BFBGA) - same | 484-pin UBGA (BFBGA) - same | 484-pin UBGA (BFBGA) - same |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 | 105,000 | 85,000 |
| Speed Grade | -5 (E5G, enhanced commercial) | -6 (faster) | -5 industrial | -6 industrial | -5 | -5 | -5 |
| Temperature Grade | Enhanced Commercial (0C to +100C junction) | Enhanced Commercial | Industrial (-40C to +100C) | Industrial | Enhanced Commercial | Enhanced Commercial | Enhanced Commercial |
| Transceiver Speed | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps (fewer channels) | Up to 12.5 Gbps (fewer channels) |
| User I/O | 188 | 188 | 188 | 188 | 188 | 188 | 188 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- 220K logic elements is the highest density in the U484 Cyclone 10 GX package (vs. 10CX150YU484E5G)
- Same-family pin-compatibility across temperature and speed grades (vs. 10CX220YU484I5G)
- Integrated 12.5 Gbps transceivers eliminate external PHY cost (vs. 10CL120YF484I7G)
Designhinweise
Estimated: at typical utilization of 70% logic elements, 60% DSP blocks, and full transceiver activity, the 10CX220YU484E5G dissipates approximately 6-9W. The 484-pin UBGA package requires a 4-layer PCB with a dedicated thermal via array under the exposed die pad and at least 4 thermal vias connected to an inner copper pour. Designers should run the Intel Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet before final schematic to validate junction temperature under worst-case industrial -40C to +100C ambient operation. A small 20mm x 20mm heatsink is recommended for any design exceeding 7W dissipation in a sealed enclosure.
The 484-pin UBGA uses a 1.0mm pitch BGA land pattern. Per JEDEC JESD21-C, BGA PCB design requires microvia or stacked-via technology on the breakout layer; standard 8-mil drilled through-vias cannot fan-out a 1.0mm pitch BGA on a 4-layer stackup without via-in-pad. Use ENIG surface finish to avoid solder joint reliability issues, and follow IPC-7352 land pattern conventions for the BGA pad diameter (typically 0.45mm pad on 0.20mm solder mask dam). All transceiver channels require 100-ohm differential impedance with length-matching within 150 mils across each channel pair.
Do not confuse the 10CX220YU484E5G (Cyclone 10 GX, with transceivers) with the 10CL120YF484I7G (Cyclone 10 LP, no transceivers) - they share the same 484-ball count but very different pin assignments and silicon. Always re-import the pin table when migrating between Cyclone 10 GX and Cyclone 10 LP families. Also, the speed grade suffix matters: -5 and -6 differ by approximately 15% in Fmax for DSP and memory blocks, so design margin calculations should use the speed grade actually ordered, not the default in early drafts. Finally, the configuration mode (AS x4, JTAG, or passive serial) must be selected via MSEL pins before POR.
Multi-gigabit transceiver channels require a clean reference clock: use a dedicated jitter-attenuating clock generator such as the Si5341 or equivalent rather than a generic CMOS oscillator. AC-coupling capacitors on each serial link must be placed within 200 mils of the FPGA pin, and the channel must be length-matched to within 150 mils of any other channel in the same bonding group. For 10GbE and PCIe Gen2 designs, simulate the channel with the Intel-provided HSPICE model and the IBIS-AMI models from your connector/cable vendor before committing to PCB stackup.
Compliance-Informationen
RoHS and lead-free confirmed per Intel Cyclone 10 GX product page. AEC-Q100 automotive qualification not separately listed for the E5G commercial grade; for AEC-Q100 applications use the -I variants of the same family. REACH compliance not explicitly stated in provided data - set to unknown for REACH specifics beyond standard RoHS/lead-free declarations.
