10CX220YU484I5G - Cyclone 10 GX FPGA 220K LE | Intel
MPN: 10CX220YU484I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $70.64 | $70.64 |
| 10 | $63.58 | $635.80 |
| 100 | $56.51 | $5,651.00 |
| 500 | $49.45 | $24,725.00 |
| 1,000 | $42.38 | $42,380.00 |
10CX220YU484I5G Overview
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable routing, embedded memory, DSP slices, and hardened IP such as transceivers and memory controllers. Cyclone 10 GX sits within Intel's broader FPGA hierarchy: Cyclone 10 (low-power, cost-optimized) → Cyclone 10 GX (adds 12.5 Gbps transceivers and 1.4 Gbps LVDS) → Cyclone family → FPGA → programmable logic device (PLD) → semiconductor. The 'I5G' suffix denotes the industrial temperature grade (-40 °C to +100 °C junction) and 0.85 mm ball-pitch BGA.
Key features include up to 12.5 Gbps multi-protocol transceivers supporting PCIe Gen2 x4 and external memory interfaces up to 72-bit wide DDR3 SDRAM at 1866 Mbps. The device supports 1.4 Gbps LVDS I/O, hard PCIe Gen2 IP blocks, and an integrated Hard Memory Controller, removing soft-logic overhead and freeing fabric for application differentiation. On-chip PLLs and per-channel transceiver settings are configured through Intel Quartus Prime software.
Architecturally, the 10CX220 uses a transceiver-rich tile layout, with hardened PCIe and memory controllers co-located with transceivers to minimize latency. The 20 nm process combined with Intel's low-power fabric delivers measurable static and dynamic power reductions versus prior-generation Cyclone V devices at equivalent logic densities.
Typical applications include industrial machine vision and image processing pipelines, broadcast video I/O, low-density 4K video processing, IoT and edge gateways requiring hardware-accelerated interfaces, motor control and robotics with deterministic low-latency comms, and PCIe-based add-in cards and test equipment that need 10 Gbps class serial links at moderate cost.
When designing with this device, plan power-rail sequencing for the core (VCC, VCCP), transceiver (VCCRT), and auxiliary (VCCAUX/VCCAUX_PLL) supplies and provide adequate thermal relief via PCB copper pour. Verify the transceiver channel count and reference-clock routing against your block diagram before PCB layout commit.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical board-level design notes not assembled in a single place in the manufacturer datasheet.
Drop-in alternatives for 10CX220YU484I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CX220YU484I5G (same form factor and footprint) — differing in Package, RoHS Status, Process Technology, Embedded Memory, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YU484I6G
✅ Drop-In✓ In Stock
$277 / Unit
View Datasheet →10CX220YU484C5G
✅ Drop-In📋 Reference alternative (not in catalog)
10CX220YU484E5G
✅ Drop-In✓ In Stock
$189.95 / Unit
View Datasheet →10CX220YU484E6G
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →10CX150YU484I5G
✅ Drop-In✓ In Stock
$176.2 / Unit
View Datasheet →10CX105YU484I5G
✅ Drop-In✓ In Stock
$954.5455 / Unit
View Datasheet →10CX220YU484I5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| User I/O Pins | 188 |
| Package | 484-ball UBGA (U484), 0.85 mm pitch |
| Process Node | 20 nm |
| Transceiver Data Rate | Up to 12.5 Gbps |
| LVDS Data Rate | Up to 1.4 Gbps |
| External Memory Interface | Up to 72-bit wide DDR3 SDRAM at 1866 Mbps |
| Hardened PCIe | PCIe Gen2 (hard IP) |
| Hard Memory Controller | Yes (DDR3) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per Intel product page) |
10CX220YU484I5G 484-ball ubga (u484), 0.85 mm pitch Pin Configuration Guide
Pin configuration for 10CX220YU484I5G (484-ball ubga (u484), 0.85 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YU484I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CX220YU484I5G is suitable for 7 applications: Industrial Machine Vision Pipelines, Broadcast Video I/O and Processing, PCIe Add-In Cards and Industrial I/O, Wireless Baseband and Small-Cell DSP, Test and Measurement Instrumentation, Edge IoT Gateways and Sensor Fusion Hubs, Motor Control and Robotics.
Industrial Machine Vision Pipelines
The 10CX220YU484I5G is well matched to multi-camera machine-vision systems where frame buffers, Bayer demosaicing, and feature extraction must run at line rate. Its hard DDR3 memory controller sustains a 72-bit wide interface at 1866 Mbps, which keeps up with the bandwidth of 4-6 megapixel sensors at 60 fps without forcing large external FIFOs. The 220K logic elements easily absorb a typical ISP plus a GigE Vision or CoaXPress link layer, while 12.5 Gbps transceivers support CoaXPress up to CXP-12 over a single coax. The industrial temperature grade permits deployment in factory cabinets with ambient temperatures above 60 °C. PCB thermal relief is important because the FPGA and a stack of memory and PHYs dissipate 6-10 W in a typical vision controller.
Recommended
Broadcast Video I/O and Processing
The 10CX220YU484I5G supports 12.5 Gbps transceivers that aggregate SDI (SMPTE ST 425/2082) and emerging 25G uncompressed video with appropriate soft PHY. With 188 user I/O pins in the 484-ball UBGA package, the device can drive multiple HDMI 2.0 or 12G-SDI outputs alongside external DDR3 frame buffers at 1866 Mbps. The 13.7 Mbit of on-chip M20K memory is suitable for line buffers and small frame-format conversions, while larger stores live in external DDR3 behind the hard memory controller. Industrial temperature grade supports broadcast equipment installed in equipment-room environments with constrained cooling. Power consumption of the transceiver-rich variant can exceed 8 W; adequate PCB copper is required.
Recommended
PCIe Add-In Cards and Industrial I/O
The 10CX220YU484I5G integrates a hard PCIe Gen2 controller, which exposes x1, x2, or x4 lanes without consuming soft logic. Combined with the 12.5 Gbps transceivers, the part can drive PCIe Gen2 x4 plus an auxiliary serial link to a host or to remote I/O. Designers can implement multi-port industrial Ethernet, fieldbus, or serial I/O behind the FPGA and present a single high-throughput PCIe endpoint to the host CPU. The 220K LE tier has plenty of headroom for protocol stacks such as EtherCAT, PROFINET, or custom deterministic Ethernet. Industrial temperature grade suits factory-floor deployment. Decoupling and reference-clock routing need careful PCB planning to keep the transceiver eye margin within spec.
Recommended
Wireless Baseband and Small-Cell DSP
The 10CX220YU484I5G's DSP-rich fabric plus 12.5 Gbps transceivers fits small-cell LTE/5G baseband designs, where uplink and downlink channels must be demodulated and combined at line rate. The hard memory controller keeps the cell-state and turbo-decoder lookup tables in DDR3 at 1866 Mbps, offloading the soft fabric from refresh and read-burst chores. The 220K logic-element tier covers the channel cards for a typical 2x2 small cell plus the CPRI or JESD204B fronthaul link at up to 12.5 Gbps. Industrial temperature grade handles outdoor radio unit installations. PCB stackup must use low-loss dielectric to preserve the transceiver eye at the rated data rate.
Recommended
Test and Measurement Instrumentation
The 10CX220YU484I5G suits mid-range protocol analyzers, logic-analyzer pattern generators, and ATE pin electronics. 12.5 Gbps transceivers handle the high-speed serial side, while the 188 user I/O pins in the 484-ball UBGA support multi-channel LVDS or parallel TDM capture. The hard DDR3 controller sustains large capture buffers at 1866 Mbps, which is essential for long acquisition windows without sacrificing trigger precision. Industrial temperature grade is sufficient for benchtop and rack-mount instrumentation. Power-budget planning is critical: a fully populated 220K LE design with active transceivers typically draws 6-10 W, so the PCB must use a multi-layer copper pour around the package.
Recommended
Edge IoT Gateways and Sensor Fusion Hubs
Edge gateways aggregate industrial or vehicular sensors and forward pre-processed data to the cloud. The 10CX220YU484I5G can host multiple soft-core CPUs (such as Nios V) alongside sensor interface logic, with 188 user I/O pins supporting CAN, LIN, RS-485, I2C, SPI, and parallel camera buses concurrently. The hard DDR3 controller keeps packet buffers and TLS working memory in DDR3 at 1866 Mbps, while 12.5 Gbps transceivers connect to gigabit Ethernet uplinks or to backplane PCIe. Industrial temperature grade supports deployment in outdoor enclosures. PCB power budgeting must consider the full I/O mix: a fully populated design can draw 5-8 W, and adequate copper pour is essential for long-term reliability.
Recommended
Motor Control and Robotics
The 10CX220YU484I5G is a strong fit for multi-axis motor control and robotic joint controllers. Its 188 user I/O pins in the 484-ball UBGA package can host encoder interfaces, PWM outputs, and fieldbus ports for 6-8 axes, while the 220K logic elements absorb field-oriented control (FOC) loops and safety logic in parallel. The hard DDR3 controller supports trajectory and look-up-table storage at 1866 Mbps, and the 12.5 Gbps transceivers drive EtherCAT or deterministic Ethernet uplinks with deterministic latency. The industrial temperature grade covers robotic controller cabinets where ambient temperatures can reach 70 °C. Thermal design should assume 5-7 W dissipation in a fully active multi-axis configuration.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YU484I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YU484I6G | 10CX220YU484C5G | 10CX220YU484E5G | 10CX220YU484E6G | 10CX150YU484I5G | 10CX105YU484I5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA (U484), 0.85 mm pitch | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 (-32%) | 105,000 (-52%) |
| Speed Grade | I5 (industrial, speed grade 5) | I6 (faster) | C5 (commercial temp, speed grade 5) | E5 (enhanced temp, speed grade 5) | E6 (enhanced temp, speed grade 6) | I5 | I5 |
| Temperature Grade | Industrial (-40 to +100 C junction) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Enhanced (-40 to +105 C) | Enhanced (-40 to +105 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) |
| Transceiver Data Rate | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps |
| DDR3 Memory Controller | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps | Hard, 72-bit up to 1866 Mbps |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS Compliance | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
Key Differentiators
- Highest density in the U484 Cyclone 10 GX family (vs 10CX150YU484I5G and 10CX105YU484I5G)
- Industrial temperature grade with full 12.5 Gbps transceiver support (vs 10CX220YU484C5G)
- Hard PCIe Gen2 controller saves soft-logic and power (vs Soft PCIe cores on smaller Cyclone 10 LP parts)
Design Notes
Cyclone 10 GX devices require separate power rails for core (VCC, VCCP), transceiver (VCCRT, VCCRPT), auxiliary (VCCAUX, VCCAUX_PLL), and I/O banks. Sequence the core rail before the auxiliary and transceiver rails, and assert the FPGA's POR signal only after all rails are stable. Inadequate sequencing is the most common source of configuration and link-training failures in 20 nm Cyclone 10 GX designs; consult the Intel Cyclone 10 GX device datasheet 'Power Management' chapter for the exact sequence and tolerances.
A fully populated 10CX220 design with active 12.5 Gbps transceivers typically dissipates 6-10 W. The 484-ball UBGA package relies heavily on PCB copper for thermal relief - place a continuous ground and power pour directly under the package, stitch thermal vias from the BGA thermal balls to inner-plane copper, and use a stack-up with at least 1 oz copper on outer layers. Estimated: with 1 oz copper and 6 thermal vias per BGA ball, theta_JA is approximately 15 C/W, giving a 90 C junction rise over ambient at 6 W - plan accordingly.
Route the 12.5 Gbps transceiver lanes with 85-100 ohm differential impedance, length-matched to within 5 mils of pair, and keep them on the top layer or stripline on layer 3 with continuous reference planes on both sides. Reference clocks require 50 ohm single-ended routing with length matched to within 50 mils across all clock pairs. AC-coupling capacitors on the high-speed serial side must be placed close to the FPGA ball with a stub length under 100 mils. The Cyclone 10 GX device datasheet pin-out files and the Intel PCB Design Guide contain the canonical routing rules.
Do not confuse OPNs that share the U484 ball map but differ in density: 10CX220YU484I5G (220K LE), 10CX150YU484I5G (150K LE), and 10CX105YU484I5G (105K LE) all use the same package. The pinout is shared but the logic and memory resource budgets are different. Re-running Quartus Prime fitting is mandatory after any density change. Also avoid substituting the F780 BGA part (10CX220YF780I5G) for the U484 part - the packages are NOT pin-compatible and the substitution requires a PCB redesign.
Compliance Information
RoHS compliance indicated by 'G' suffix in the OPN, per Intel product page. REACH and conflict-mineral status extracted from Intel corporate compliance statements. AEC-Q100 is not applicable - Cyclone 10 GX is an industrial FPGA, not an automotive-grade IC. Halogen-free status not stated on the product page.
