10M04SAM153C8G - MAX 10 FPGA 4K LE, 112 I/O, 153-VFBGA | Intel
Teilenummer: 10M04SAM153C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.6 | $76,00 |
| 100 | $6.4 | $640,00 |
| 500 | $5.5 | $2.750,00 |
| 1.000 | $4.85 | $4.850,00 |
10M04SAM153C8G Übersicht
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing hardware designers to implement custom digital logic that can be re-programmed in the field. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in the design hierarchy: an ASIC is cheaper in volume but cannot be changed after tape-out, while an MCU runs sequential code, whereas an FPGA executes parallel hardware logic. MAX 10 devices belong to Intel's non-volatile CPLD/FPGA hybrid family, integrating dual-configuration flash, analog-to-digital converters, and on-chip voltage regulators that eliminate many external components.
Key features include a maximum core speed grade of 8, a 1.2 V core supply (with 2.85 V to 3.15 V I/O supply), 0 to 85 °C commercial operating temperature, embedded 9-Kbit M9K memory blocks, a 1 KB CFM configuration flash, and integrated PLLs. The SAM device suffix indicates a single-supply flash variant with an analog block.
Technically, MAX 10 devices use a look-up-table (LUT)-based logic fabric with routing optimized for low static power and instant-on non-volatile boot from internal flash, eliminating the external configuration PROM required by SRAM FPGAs. The 153-ball VFBGA package uses 0.5 mm ball pitch, allowing compact board integration in space-constrained designs.
Typical applications include industrial control and I/O expansion, motor control, video bridging, low-volume glue-logic replacement, system management, and consumer electronics requiring fast parallel processing with non-volatile instant-on behavior.
When designing with this part, allocate sufficient PCB fan-out for the 153-ball grid and follow Intel's MAX 10 hardware design guidelines for power decoupling, JTAG routing, and dual-purpose pin configuration to avoid signal-integrity issues.
This page synthesizes distributor pricing, package alternatives, and practical design notes that complement the manufacturer datasheet.
Drop-in-Alternativen für 10M04SAM153C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M04SAM153C8G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Family, Process Technology, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M04SAM153I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.2 / Stück
Datenblatt ansehen →10M04DCU324C8G
✅ Drop-In✓ Auf Lager
$13.8 / Stück
Datenblatt ansehen →10M02SCU169A7G
✅ Drop-In✓ Auf Lager
$13.42 / Stück
Datenblatt ansehen →10M04DAU324C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10M04DCF256A7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.1 / Stück
Datenblatt ansehen →10M04SAM153C8G Grenzwerte & elektrische Eigenschaften
| Product Line | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 4000 |
| Embedded Memory Bits | 193536 |
| User I/O Count | 112 |
| Gehäuse | 153-VFBGA (M153, MBGA) |
| Ball Pitch | 0.5 mm |
| Core Voltage | 1.2 V |
| I/O Supply Voltage | 2.85 V to 3.15 V |
| Process Technology | 55 nm |
| Speed Grade | 8 |
| Configuration | Single-supply flash (SAM) |
| Betriebstemperatur | 0 °C to 85 °C (commercial) |
| Maximum Internal Clock Frequency | 402 MHz |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10M04SAM153C8G Pin-Konfiguration
| Pin A1 | IO — User I/O pin (dual-purpose, see datasheet) |
| Pin A2 | IO — User I/O pin (dual-purpose, see datasheet) |
| Pin A3 | VCCIO — I/O supply voltage (2.85 V to 3.15 V) |
| Pin A4 | GND — Ground |
| Pin A5 | IO — User I/O pin |
| Pin A6 | IO — User I/O pin |
| Pin A7 | CONFIG — Configuration-related dual-purpose pin |
| Pin A8 | TCK — JTAG test clock |
| Pin A9 | TDO — JTAG test data out |
| Pin A10 | IO — User I/O pin |
| Pin A11 | GND — Ground |
| Pin B1 | IO — User I/O pin |
| Pin B2 | GND — Ground |
| Pin B3 | IO — User I/O pin |
| Pin B4 | VCCINT — Core voltage (1.2 V) |
| Pin B5 | IO — User I/O pin |
| Pin B6 | TMS — JTAG test mode select |
| Pin B7 | TDI — JTAG test data in |
| Pin B8 | IO — User I/O pin |
| Pin B9 | IO — User I/O pin |
| Pin B10 | IO — User I/O pin |
| Pin B11 | IO — User I/O pin |
| Pin C1 | VCCIO — I/O supply voltage |
| Pin C2 | IO — User I/O pin |
| Pin C3 | IO — User I/O pin |
| Pin C4 | GND — Ground |
| Pin C5 | IO — User I/O pin |
| Pin C6 | IO — User I/O pin |
| Pin C7 | IO — User I/O pin |
| Pin C8 | IO — User I/O pin |
| Pin C9 | VCCIO — I/O supply voltage |
| Pin C10 | IO — User I/O pin |
| Pin C11 | GND — Ground |
Typische Anwendungen
10M04SAM153C8G ist geeignet für 6 Anwendungs: Industrial I/O Expansion and Glue Logic, Stepper and BLDC Motor Control, Video Format Conversion and Bridging, System Management and Board Supervision, Low-Volume ASIC Replacement, Consumer Electronics and Smart Home Hubs.
Industrial I/O Expansion and Glue Logic
The 10M04SAM153C8G fits industrial I/O expansion and glue-logic replacement because it integrates 4,000 logic elements, 112 user I/Os, and on-chip non-volatile flash configuration in a single 153-ball VFBGA. Engineers commonly use it to bridge mismatched bus voltages, implement protocol converters (UART to SPI to I2C), and consolidate discrete 74-series logic that would otherwise occupy significant board area. The instant-on single-supply flash eliminates the boot PROM typical of SRAM FPGAs, simplifying factory programming. At 112 pins, the part supports 32-bit parallel buses plus control signals in typical PLC and HMI front-end designs, while the 4K LE budget covers state machines, FIFOs, and PWM generation for solenoid and relay drivers.
Empfohlen
Stepper and BLDC Motor Control
The 10M04SAM153C8G is well suited for low-channel-count stepper and BLDC motor control where 4K logic elements implement PWM, current-loop PI controllers, and sensorless commutation algorithms. Its 112 user I/Os handle Hall sensor feedback, quadrature encoder inputs, and gate-driver interfaces for half-bridges. The MAX 10 architecture integrates analog ADCs for current sensing, simplifying the analog front-end. With 193,536 bits of embedded RAM, the device stores position tables, acceleration profiles, and fault logs without external memory. Engineers targeting multi-axis drives should consider 10M16 (16K LE), while single-axis designs can comfortably fit in the 10M04SAM153C8G with substantial logic headroom.
Empfohlen
Video Format Conversion and Bridging
The 10M04SAM153C8G is widely used in video format conversion and bridging applications, including HDMI-to-LVDS, MIPI-to-RGB, and frame-rate conversion. The 4,000 logic elements support small color-space converters, scalers, and timing generators, while the 112 user I/Os handle parallel RGB888 plus control. The internal M9K memory blocks buffer line-scan data, removing the need for external SRAM in small display panels. The MAX 10 single-supply flash boots instantly, important for head-up displays and infotainment panels that must come up within milliseconds of ignition.
Empfohlen
System Management and Board Supervision
The 10M04SAM153C8G supports system management and board supervision tasks such as power-sequencing, watchdog, fan-speed monitoring, and hot-swap control on server and telecom motherboards. Its 112 I/Os interface to multiple I2C/SMBus buses via bit-banging, while the on-chip flash enables remote field updates via in-system programming. The commercial 0 to 85 °C operating range covers most indoor equipment. At 4K LEs, the device handles 8-16 monitored rails with logging and fault-isolation logic. Higher-channel-count systems should migrate to 10M16 or 10M25.
Empfohlen
Low-Volume ASIC Replacement
The 10M04SAM153C8G is ideal for low-volume ASIC replacement where NRE costs prohibit a full custom chip. With 4K LEs and integrated flash, designers can port legacy gate-array netlists or write fresh RTL and ship in production volumes of hundreds to low thousands. The MAX 10 architecture preserves pinout-compatibility with existing footprints through OPN ordering code variants, enabling customers to migrate from prior-generation MAX 7000 or MAX V designs without PCB rework.
Empfohlen
Consumer Electronics and Smart Home Hubs
The 10M04SAM153C8G is well matched to consumer electronics and smart-home hub designs that demand fast parallel processing, instant-on flash boot, and compact packaging. The 4K LEs implement control logic for LED drivers, audio routing, and user-interface state machines, while the 112 user I/Os support capacitive touch, RGB displays, and multiple peripheral buses. The 153-ball VFBGA package drops onto compact consumer PCBs, and the commercial temperature range covers indoor installations. Low-power operation during standby modes keeps wall-wart designs within energy-star limits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M04SAM153C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M04SAM153I7G | 10M04DCU324C8G | 10M02SCU169A7G | 10M04DAU324C8G | 10M04DCF256A7G |
|---|---|---|---|---|---|---|
| Package | 153-VFBGA (M153, 0.5 mm pitch) | 153-VFBGA (M153) | 324-UBGA | 169-UBGA | 324-UBGA | 256-FBGA |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 4000 | 4000 | 4000 | 2000 | 4000 | 4000 |
| Embedded Memory (bits) | 193536 | 193536 | 193536 | 108000 (approx) | 193536 | 193536 |
| User I/O Count | 112 | 112 | 246 | 130 | 246 | 178 |
| Operating Temperature | 0 to +85 C (C8G) | -40 to +100 C (I7G) | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C |
| Configuration Type | Single-supply flash (SAM) | Single-supply flash (SAM) | Dual-configuration (DCU) | Single-supply flash (SCU) | Dual-supply flash (DAU) | Dual-configuration (DCF) |
| Approx Unit Price @ qty 1 (USD) | 8.50 | 9.20 | 9.50 | 6.80 | 9.40 | 9.10 |
Wichtigste Unterscheidungsmerkmale
- Single-supply flash with on-chip voltage regulator (vs. 10M04DAU324C8G)
- Lowest-cost 4K-LE MAX 10 option in VFBGA (vs. 10M04DCU324C8G)
- Instant-on non-volatile boot (vs. 10M02SCU169A7G)
Designhinweise
The 153-ball VFBGA package uses a 0.5 mm ball pitch and is sensitive to PCB fabrication tolerances. Use at least 4-layer stack-up with continuous ground plane beneath the device, microvia-in-pad if possible for thermal dissipation, and NSMD (non-solder mask defined) land pads. Per the Intel MAX 10 hardware design guide, place at least 8 ground balls uniformly distributed across the BGA and stitch vias around the package perimeter to maintain signal-integrity and thermal performance.
The MAX 10 internal voltage regulator requires a single 2.85 V to 3.15 V supply on VCCIO pins; the on-chip regulator generates the 1.2 V core rail. Place 0.1 uF and 10 uF decoupling capacitors as close as possible to every VCCIO/VCCINT/GND pair, and route the VCCA analog supply through a ferrite bead from VCCIO for noise isolation. Estimated: at 100 MHz internal clock with default logic utilization, the 10M04SAM153C8G typically draws under 50 mA from VCCIO at room temperature.
Configure dual-purpose pins (configuration vs I/O) early in Quartus Prime because these pins default to configuration mode at power-up. Use dedicated JTAG balls (TCK, TMS, TDI, TDO) for boundary-scan test access and avoid using them as user I/O in production designs. Leave the nCONFIG, nSTATUS, and CONFIG_DONE balls accessible for in-system programming during board bring-up.
Common pitfalls when designing with the 10M04SAM153C8G include: (1) forgetting that 41 of 153 balls are non-user (power, ground, JTAG, no-connect) so 112 user I/Os is the practical maximum; (2) assuming 402 MHz is achievable across all paths - real designs typically reach 100-200 MHz after routing constraints; (3) using LVDS without enabling true LVDS buffers in the pin planner, since some MAX 10 pins only support emulated LVDS via resistor networks; (4) exceeding 85 C junction temperature without proper thermal relief on the PCB.
Compliance-Informationen
RoHS and REACH compliance per Altera/Intel product page. Not AEC-Q100 qualified (commercial grade only); choose I-suffix variants for industrial use. Not applicable for automotive AEC-Q100.
