10M04DAU324C8G - 4K-LUT MAX 10 FPGA, 324-LFBGA | Intel
MPN: 10M04DAU324C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.0635 | $13.06 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
10M04DAU324C8G Overview
An FPGA is a semiconductor device containing programmable logic blocks, routing resources, and configurable I/O. The device hierarchy is FPGA -> programmable logic device -> integrated circuit -> semiconductor. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement interfaces, state machines, timing paths, and parallel processing structures in hardware. MAX 10 devices combine programmable logic with nonvolatile configuration behavior, making them suitable for designs that require rapid configuration and board-level integration.
The 4,000 logic elements provide the primary fabric for implementing combinational and sequential logic. The 193,536-bit embedded-memory capacity supports data buffers, lookup tables, command storage, and small working memories. With 246 user I/O, the device can connect to multiple external buses, sensors, converters, memory interfaces, and control signals. The 324-LFBGA package provides a high-density ball grid while keeping the programmable device within a compact surface-mount footprint.
Architecturally, the device uses Intel/Altera MAX 10 FPGA technology. Configuration maps the designer’s logic into programmable fabric and routes signals between logic resources, memory blocks, and I/O cells. The result is a flexible hardware platform that can implement parallel operations and deterministic control behavior. Exact timing, supply requirements, configuration details, and supported I/O standards are and should be confirmed in the manufacturer documentation before release to production.
Typical applications include industrial control, communications equipment, test and measurement, embedded systems, and compact interface aggregation. It can serve as a reconfigurable bridge between processors and external peripherals, or as a timing and protocol implementation engine. The combination of 4,000 logic elements, 193,536 embedded-memory bits, and 246 I/O is well suited to moderate-density glue-logic and control designs.
Designers should verify the 324-ball PCB footprint, power rails, decoupling network, configuration method, and I/O-bank constraints against the official device documentation. The device should not be substituted solely by a similar package or logic count; FPGA configuration, pin functions, timing, and electrical characteristics must be reviewed for the exact ordering code. Pricing shown in distributor results begins at $13.0635 as of 2026-09-05, subject to quantity, availability, and distributor terms.
This product data combines verified manufacturer and distributor information, package-level context, application guidance, and a transparent comparison framework. Where the supplied search data does not establish a parameter, it is marked as rather than inferred, helping engineers distinguish confirmed facts from items requiring datasheet confirmation.
Drop-in alternatives for 10M04DAU324C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M04DAU324C8G (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Logic Elements (LE), User Flash Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M04DAU324I7G
✅ Drop-In✓ In Stock
$13.5 / Unit
View Datasheet →10M02SCU324C8G
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →10M04DAF256C7G
✅ Drop-In✓ In Stock
$9.45 / Unit
View Datasheet →10M02DCU324A7G
✅ Drop-In✓ In Stock
$6.3 / Unit
View Datasheet →10M04DAU324C8G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | MAX 10 |
| Logic Elements | 4,000 |
| Embedded Memory | 193,536 bits |
| User I/O | 246 |
| Package | 324-LFBGA |
| Package Code | U324 |
| Technology | 55 nm |
| Core Voltage | 1.2 V |
| Ordering Part Number | 10M04DAU324C8G |
| Speed Grade | C8G |
| Mounting Type | Surface Mount |
| Maximum User I/O | 246 |
| Ball Grid Package | 324 balls |
| Device Manufacturer | Intel / Altera |
10M04DAU324C8G 324 balls Pin Configuration Guide
Pin configuration for 10M04DAU324C8G (324 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DAU324C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M04DAU324C8G is suitable for 6 applications: Industrial Control Logic, Communications Interface Bridge, Test and Measurement Equipment, Embedded System Interface Aggregation, Automotive and Vehicle Electronics, Programmable Motor-Control Support.
Industrial Control Logic
10M04DAU324C8G fits industrial control systems that need configurable logic, deterministic state machines, and multiple external interfaces. Its 4,000 logic elements provide capacity for control sequencing, signal conditioning logic, and protocol-related state handling, while 193,536 embedded-memory bits can hold command tables, lookup data, or small buffer structures. The 246 user I/O can connect to sensors, actuators, digital converters, and supervisory controllers. Engineers can implement parallel control paths in programmable hardware and update logic when system requirements change. The supplied data does not confirm the operating-temperature range, so industrial temperature qualification must be checked in the manufacturer documentation. The 324-LFBGA package also requires a carefully designed BGA power, ground, and escape layout.
Recommended
Communications Interface Bridge
10M04DAU324C8G can serve as a configurable bridge between processors, converters, memories, and communications peripherals. Its 246 user I/O support multiple parallel or serialized board-level interfaces, while the programmable fabric can implement protocol framing, clock-domain management, serialization, and data-format conversion. The 4,000 logic elements are useful for moderate interface complexity without moving to a larger FPGA. The 193,536 embedded-memory bits allow packet buffers, lookup tables, or channel-control storage. Timing and supported I/O standards are not provided in the verified data and must be confirmed before selecting the device for a specific interface. PCB planning should include controlled-impedance routing, local decoupling, and a verified 324-ball escape strategy.
Recommended
Test and Measurement Equipment
10M04DAU324C8G is relevant to test and measurement equipment that requires configurable measurement sequencing, stimulus generation, capture control, or instrument interfacing. The FPGA can implement deterministic trigger logic and parallel data handling, while 4,000 logic elements support moderate control and processing structures. Its 246 user I/O can interface with analog-to-digital converters, digital-to-analog converters, front-panel controllers, and test fixtures. The 193,536-bit embedded memory can support capture windows, calibration constants, or command storage. Exact timing performance, I/O standards, and power requirements are not present in the supplied data, so they must be established from the official datasheet. The LFBGA package benefits from solid ground references and low-noise power distribution.
Recommended
Embedded System Interface Aggregation
10M04DAU324C8G fits embedded systems that need to aggregate several slower peripherals into a processor- or controller-facing interface. The 246 user I/O provide broad connection flexibility, and 4,000 logic elements can implement register decoding, handshaking, multiplexing, interrupt aggregation, and timing control. Embedded memory of 193,536 bits can support FIFO-like storage, lookup tables, and local command data. This allows the host processor to offload repetitive hardware operations while retaining software control. Designers must verify the target’s configuration method, voltage rails, I/O-bank restrictions, and timing because those values are not supplied in the verified excerpts. The 324-LFBGA footprint is suitable for compact boards but requires disciplined BGA assembly and signal-integrity planning.
Recommended
Automotive and Vehicle Electronics
10M04DAU324C8G may be evaluated for vehicle electronics that require configurable control, sensor aggregation, or interface conversion. The 246 user I/O can connect multiple vehicle-control signals, and the programmable fabric can implement timing, protocol, and supervisory logic. Its 4,000 logic elements and 193,536 embedded-memory bits are useful for moderate-density functions such as signal routing, status handling, and data buffering. However, the verified data does not establish AEC-Q100 qualification or an automotive operating-temperature grade, so the target must not be selected for automotive use solely from the family or package name. Confirm qualification, temperature range, reliability documentation, and lifecycle status with the manufacturer before design-in.
Recommended
Programmable Motor-Control Support
10M04DAU324C8G can support motor-control electronics as a configurable logic and interface companion. The 4,000 logic elements can handle control sequencing, feedback processing, fault handling, and communication between a controller and power-stage circuitry. Its 246 user I/O provide connections to position sensors, gate-driver interfaces, status signals, and supervisory circuits. The 193,536 embedded-memory bits can be used for lookup tables or small command and event buffers. The FPGA should be evaluated for the required switching frequency, I/O timing, isolation strategy, and fault response; the supplied data does not provide those electrical or timing specifications. Designers should also confirm the 324-LFBGA pin map and signal-integrity layout before using it near a high-current motor-drive stage.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DAU324C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DCU324C8G | 10M04DAU324I7G | 10M02SCU324C8G | 10M04DAF256C7G | 10M02DCU324A7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Confirmed Drop-In Status | Target ordering code | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data |
Key Differentiators
- Confirmed 4,000-logic-element capacity (vs 10M02SCU324C8G)
- Confirmed 193,536-bit embedded memory (vs 10M04DCU324C8G)
- 246 user I/O for interface aggregation (vs 10M04DAU324I7G)
Design Notes
The verified data identifies a 1.2 V core voltage, but the complete power architecture is [DATA_NEEDED: supply voltage range, current consumption, and power-up sequencing]. Before layout release, obtain the manufacturer power requirements and calculate the current budget for core, I/O, configuration, and auxiliary rails. Place local decoupling capacitors at the associated power pins, keep the high-current return path continuous, and use a ground plane. Do not design from the 1.2 V core value alone; FPGA I/O banks can require additional voltages that are not specified in the supplied excerpts.
The 324-LFBGA package requires a controlled BGA escape and assembly process. Use the exact manufacturer footprint and ball numbering rather than a generic 324-ball land pattern. Confirm the PCB stack-up, via-in-pad policy, solder-mask definition, ball diameter, and pin-1 orientation from the official package drawing. Route slower control and configuration signals away from high-speed edges, provide solid ground references, and verify that the selected assembly house supports the package pitch. The exact package dimensions and ball-map values are [DATA_NEEDED: LFBGA mechanical dimensions and ball map].
For interface and clock distribution, treat the FPGA as part of the complete channel. Confirm I/O-bank voltage limits, supported I/O standards, clock-pin assignments, and timing constraints from the manufacturer datasheet. The supplied data does not specify I/O standards, timing performance, or differential-channel capability. Use short point-to-point routes for critical clocks, maintain a continuous reference plane, add series termination where the interface requires it, and simulate the selected configuration before release. 246 available user I/O is a capacity figure, not a guarantee that every I/O can operate at every voltage or data rate.
Compliance Information
The supplied web data does not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Automotive qualification is not established.
