10M04SCU169I7G - 4K LE MAX 10 FPGA, 130 I/O, 169-UBGA | Intel
Teilenummer: 10M04SCU169I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $15.91 | $15,91 |
| 10 | $14.5 | $145,00 |
| 100 | $12.8 | $1.280,00 |
| 500 | $11.25 | $5.625,00 |
| 1.000 | $9.95 | $9.950,00 |
10M04SCU169I7G Übersicht
A MAX 10 FPGA is a low-cost, low-power, non-volatile programmable logic device that combines a look-up table (LUT)-based fabric, on-die flash configuration memory, embedded 9-bit ADC blocks, and on-die flash-based user storage on a single 55 nm process die. This single-chip integration removes the need for external boot PROMs and allows instant-on behavior, positioning MAX 10 between discrete microcontrollers and higher-density Cyclone or Arria families for cost-sensitive industrial, automotive, and consumer glue-logic designs.
Key features include 4 K logic elements (approximately 16 K logic elements in marketing equivalent terms), 270 Kbits of embedded SRAM organized in M9K blocks, 130 user I/O pins supporting LVDS, LVCMOS, SSTL, and RSDS interface standards, up to two integrated 12-bit ADC blocks with on-die temperature sensing capability, and an internal oscillator. The 169-UBGA package exposes dual-configuration flash images so designers can perform field firmware updates without external memory, reducing BOM cost and PCB footprint.
Architecturally the device uses 55 nm embedded-flash CMOS, an LAB-based logic fabric with 10 logic elements per LAB, and dedicated hardware multipliers implemented as DSP blocks. Hard memory controller and PHY interfaces for DDR3 and LPDDR2 are supported via soft IP, while the on-die flash simplifies board layout by eliminating the boot PROM and reducing overall system cost.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, sensor aggregation gateways, automotive body and infotainment controllers, and portable or edge IoT nodes. The combination of ADC, on-die flash, and instant-on behavior also fits battery-backed sensor hubs and remote monitoring equipment operating in harsh industrial environments.
When designing with this part, validate the device migration path within the MAX 10 family because the U169 footprint is shared with 10M08 and 10M16 density siblings, enabling upward logic capacity migration on the same PCB layout. Confirm Quartus Prime version support and pinout assignments using the manufacturer pin-out file before layout finalization.
This page consolidates real distributor stock, verified cross-reference drop-in alternatives, and design guidance that is not present in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M04SCU169I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M04SCU169I7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Method, Mounting Type, Logic Elements (LE), ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M04SCU169C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.05 / Stück
Datenblatt ansehen →10M04SCU169C7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M08SCU169I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.85 / Stück
Datenblatt ansehen →10M16SCU169I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04SCU169I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded User Flash Memory | 193,536 bits (approx. 24 KB) |
| Embedded SRAM (M9K blocks) | 270 Kbits |
| Maximum User I/O | 130 |
| Gehäuse | 169-ball UBGA (U169) |
| Speed Grade | SC |
| Core Voltage | 1.2 V |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Lead-Free Finish | 7G (lead-free) |
| Process Node | 55 nm embedded-flash CMOS |
| On-die ADC | Up to 2 x 12-bit blocks |
| Configuration Method | On-die flash (non-volatile, instant-on) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
10M04SCU169I7G 169-ball ubga (u169) Pinbelegungsleitfaden
Pinbelegung für 10M04SCU169I7G (169-ball ubga (u169)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M04SCU169I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M04SCU169I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost Video Bridging, Sensor Aggregation Gateway, Automotive Body and Infotainment Controller, Portable/Edge IoT Node.
Industrial Motor Control
The 10M04SCU169I7G's integrated 12-bit ADC blocks support current and voltage sensing for BLDC and stepper motor control, while its 130 user I/O can drive multiple PWM channels, encoder interfaces, and Hall-sensor inputs simultaneously. The -40C to +100C industrial temperature range and on-die flash eliminate the need for external boot PROMs in factory-floor motor drive applications. Designers can implement field-oriented control (FOC) algorithms in soft IP, leveraging the 4,000 logic elements for state machines and the M9K memory blocks for lookup tables. Compared to discrete MCU + external ADC approaches, this single-chip integration reduces BOM cost and PCB footprint.
Empfohlen
Factory Automation I/O Expansion
The 10M04SCU169I7G provides flexible industrial protocol bridging for factory automation, with 130 user I/O supporting LVDS, RS-485, and 24V-tolerant I/O standards commonly used in PLC backplanes. The on-die flash enables instant-on behavior for deterministic boot times required by safety-critical automation systems. The 270 Kbits of embedded SRAM allows packet buffering for protocols like PROFINET, EtherCAT, and Modbus TCP implemented in soft IP cores. With its industrial temperature grade and lead-free UBGA package, this FPGA integrates reliably into DIN-rail-mounted controllers and remote I/O modules.
Empfohlen
Low-Cost Video Bridging
The 10M04SCU169I7G supports low-resolution video bridging applications including LVDS-to-RGB conversion, image scaling, and simple overlay generation for industrial displays and digital signage. Its LVDS-capable I/O can drive flat-panel display interfaces up to XGA resolution, while the M9K memory blocks serve as line buffers. The 4,000 logic elements accommodate pixel-processing pipelines with simple color space conversion. The non-volatile configuration removes boot delay, enabling instant display activation in kiosk and HMI applications.
Empfohlen
Sensor Aggregation Gateway
The 10M04SCU169I7G serves as a sensor aggregation hub for IoT edge nodes, combining I2C, SPI, and UART interfaces from multiple sensors into a unified data stream. The on-die 12-bit ADC supports analog sensor channels like temperature, pressure, and humidity, while the 270 Kbits of SRAM provides buffer space for data aggregation before wireless transmission. The instant-on behavior and low-power 55 nm process make this FPGA ideal for battery-backed sensor hubs. Industrial temperature rating ensures reliable operation in outdoor and factory environments.
Empfohlen
Automotive Body and Infotainment Controller
The 10M04SCU169I7G is suitable for automotive body electronics including HVAC control modules, lighting controllers, and simple infotainment interfaces. The MAX 10 family supports AEC-Q100 automotive qualification in designated variants, and the industrial temperature range of -40C to +100C accommodates under-hood and cabin environments. The on-die flash enables instant-on behavior for lighting turn-on responsiveness, while the 130 user I/O supports LIN, CAN, and SENT automotive networks implemented as soft IP cores. Designers can implement debouncing, PWM dimming, and diagnostic logic within the 4,000 logic elements.
Empfohlen
Portable/Edge IoT Node
The 10M04SCU169I7G's non-volatile configuration and low-power 55 nm process make it well-suited for battery-powered edge IoT devices requiring deterministic instant-on behavior. The 130 user I/O supports multiple sensor buses and wireless module interfaces, while the on-die ADC enables analog sensor measurement without external ADC chips. The compact 169-UBGA package fits space-constrained wearable and portable device enclosures. Designers can implement wake-up logic, data preprocessing, and secure boot sequences within the 4,000 logic elements, reducing overall system BOM cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M04SCU169I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M04SCU169C8G | 10M04SCU169C7G | 10M08SCU169I7G | 10M16SCU169I7G |
|---|---|---|---|---|---|
| Package | 169-ball UBGA (U169) | 169-ball UBGA (U169) - same | 169-ball UBGA (U169) - same | 169-ball UBGA (U169) - same | 169-ball UBGA (U169) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 | 4,000 | 8,000 | 16,000 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | SC | C8 | C7 | SC | SC |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded Flash | 193,536 bits | 193,536 bits | 193,536 bits | 387,072 bits | 549,888 bits |
| Price (qty 1, USD) | 15.91 | Lower (commercial grade) | Lower (commercial grade) | Higher (~2x) | Highest (~3x) |
Wichtigste Unterscheidungsmerkmale
- On-die non-volatile flash configuration (vs. SRAM-based FPGAs requiring external boot PROM)
- Integrated 12-bit ADC blocks (vs. Discrete MCU + external ADC architectures)
- 55 nm embedded-flash process with dual-image support (vs. Single-image flash FPGAs)
Designhinweise
The 169-UBGA package has limited heat dissipation compared to larger BGA variants. For applications driving many I/O at high toggle rates or using internal DSP blocks intensively, ensure the PCB thermal design includes adequate copper pours and thermal vias under the BGA to keep junction temperature within the -40C to +100C industrial range. Estimated: at full internal utilization with 130 I/O switching at 50 MHz, expect approximately 1-1.5 W internal power dissipation.
Use a 4-layer PCB with dedicated power and ground planes for the 169-UBGA footprint. Place decoupling capacitors (0.1 uF and 10 uF) as close as possible to each power pin group. The MAX 10 device requires clean 1.2 V core and 2.5 V/3.3 V I/O supply rails - use ferrite beads or pi filters to isolate noisy digital supplies from sensitive analog ADC reference pins.
Do not assume the 10M04 bitstream will run on 10M08 or 10M16 devices even though they share the U169 footprint. The MAX 10 device ID is checked by Quartus Prime programmer; recompilation for the target density is mandatory. Also, verify the JTAG chain configuration in multi-device boards to avoid programming errors during production.
Compliance-Informationen
RoHS compliant per Intel product page. The 'I' suffix indicates industrial temperature grade (-40C to +100C). AEC-Q100 qualification status is not stated in the verified data for this specific OPN; designated MAX 10 automotive variants exist with Q1 suffix.
