10M08SAE144I7G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel
Teilenummer: 10M08SAE144I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.5 | $115,00 |
| 100 | $9.2 | $920,00 |
| 500 | $7.95 | $3.975,00 |
| 1.000 | $6.8 | $6.800,00 |
10M08SAE144I7G Übersicht
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Unlike a microcontroller, FPGAs execute logic in parallel hardware, offering deterministic timing and high I/O throughput. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic semiconductor -> integrated circuit, and are widely used to accelerate parallel workloads, glue logic, and interface bridging.
Key features of the 10M08SAE144I7G include 8,000 logic elements, 378 Kbits of user flash memory, a 1.25 Gbps LVDS-capable I/O bank architecture, an integrated 12-bit successive-approximation ADC, and a single 3.3 V core supply. The device also supports Nios II embedded processor cores, JTAG-based configuration, and 18x18 multiplier blocks for digital signal processing. This combination delivers a flexible, processor-capable platform in a single device.
Architecturally, the 10M08SAE144I7G uses a TSMC 55 nm CMOS process with a look-up-table (LUT) based fabric and embedded SRAM blocks (M9K). The integrated flash eliminates external boot components, reducing BOM and board area. The exposed-pad LQFP-144 package supports conventional SMT reflow, simplifying manufacturing versus BGA alternatives. The 144-pin EQFP form factor exposes 101 user I/Os while remaining hand-solderable for prototype work.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing bridges, portable instrumentation, and consumer electronics requiring custom logic or peripheral interfacing. The internal ADC and flash make it well-suited for sensor aggregation and instant-on embedded platforms. Designers frequently pair it with Nios II soft-core firmware for low-cost SoC replacement.
When designing with the 10M08SAE144I7G, ensure the exposed pad (EP) is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Plan I/O bank voltage (VCCIO) assignments carefully - the 10M08 device supports multiple I/O standards per bank but each bank must use a single VCCIO. Decouple each VCCIO bank with 0.1µF + 10µF ceramic capacitors placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, providing a faster engineering decision workflow.
Drop-in-Alternativen für 10M08SAE144I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08SAE144I7G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Mounting Type, Logic Elements (LE), Core Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08SCE144I7G
✅ Drop-In✓ Auf Lager
$70.2 / Stück
Datenblatt ansehen →10M08SAE144C8G
✅ Drop-In✓ Auf Lager
$16.25 / Stück
Datenblatt ansehen →10M08SCE144C8G
✅ Drop-In✓ Auf Lager
$15.95 / Stück
Datenblatt ansehen →10M08SAU144I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08SCU144I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08SAE144I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Total RAM Bits | 387072 (378 Kb) |
| User Flash Memory | 1540 Kb (dual-configuration) |
| User I/O Pins | 101 |
| Versorgungsspannung | 2.85 V to 3.465 V |
| Core Voltage | 3.3 V (single supply) |
| Betriebstemperatur | -40°C to +100°C (TJ) |
| Montageart | Surface Mount |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) |
| Supplier Device Package | 144-EQFP EP |
| Process Technology | TSMC 55 nm CMOS |
| Embedded Memory Type | M9K SRAM blocks |
| Integrated ADC | Yes, 12-bit SAR |
| Configuration Method | JTAG / internal flash (instant-on) |
| Soft Core Support | Nios II |
| RoHS-Status | Compliant |
10M08SAE144I7G Pin-Konfiguration
| Pin 1 | I/O — User I/O - bank 1B |
| Pin 2 | I/O — User I/O - bank 1B |
| Pin 3 | I/O — User I/O - bank 1B |
| Pin 4 | VCCIO1B — I/O bank 1B supply voltage |
| Pin 5 | I/O — User I/O - bank 1B |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O - bank 1B |
| Pin 8 | I/O — User I/O - bank 1B |
| Pin 9 | VCC — Core supply voltage (3.3V) |
| Pin 10 | I/O — User I/O - bank 1B |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O - bank 1B |
| Pin 13 | I/O — User I/O - bank 2A |
| Pin 14 | VCCIO2A — I/O bank 2A supply voltage |
| Pin 15 | I/O — User I/O - bank 2A |
| Pin 16 | GND — Ground |
| Pin 17 | I/O — User I/O - bank 2A |
| Pin 18 | I/O — User I/O - bank 2A |
| Pin 19 | VCC — Core supply voltage (3.3V) |
| Pin 20 | I/O — User I/O - bank 2A |
| Pin 21 | I/O — User I/O - bank 2A |
| Pin 22 | VCCIO2A — I/O bank 2A supply voltage |
| Pin 23 | I/O — User I/O - bank 2A |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O - bank 2A |
| Pin 26 | I/O — User I/O - bank 2A |
| Pin 27 | VCC — Core supply voltage (3.3V) |
| Pin 28 | I/O — User I/O - bank 2A |
| Pin 29 | I/O — User I/O - bank 2A |
| Pin 30 | GND — Ground |
| Pin 31 | I/O — User I/O - bank 2A |
| Pin 32 | VCCIO2A — I/O bank 2A supply voltage |
| Pin 33 | I/O — User I/O - bank 2A |
| Pin 34 | I/O — User I/O - bank 2A |
| Pin 35 | GND — Ground |
| Pin 36 | I/O — User I/O - bank 2A |
| Pin 37 | VCC — Core supply voltage (3.3V) |
| Pin 38 | I/O — User I/O - bank 3A |
| Pin 39 | I/O — User I/O - bank 3A |
| Pin 40 | VCCIO3A — I/O bank 3A supply voltage |
| Pin 41 | I/O — User I/O - bank 3A |
| Pin 42 | GND — Ground |
| Pin 43 | I/O — User I/O - bank 3A |
| Pin 44 | I/O — User I/O - bank 3A |
| Pin 45 | VCC — Core supply voltage (3.3V) |
| Pin 46 | I/O — User I/O - bank 3A |
| Pin 47 | I/O — User I/O - bank 3A |
| Pin 48 | VCCIO3A — I/O bank 3A supply voltage |
| Pin 49 | I/O — User I/O - bank 3A |
| Pin 50 | GND — Ground |
| Pin 51 | I/O — User I/O - bank 3A |
| Pin 52 | I/O — User I/O - bank 3A |
| Pin 53 | VCC — Core supply voltage (3.3V) |
| Pin 54 | I/O — User I/O - bank 3A |
| Pin 55 | I/O — User I/O - bank 3A |
| Pin 56 | VCCIO3A — I/O bank 3A supply voltage |
| Pin 57 | I/O — User I/O - bank 3A |
| Pin 58 | GND — Ground |
| Pin 59 | I/O — User I/O - bank 3A |
| Pin 60 | I/O — User I/O - bank 4A |
| Pin 61 | VCCIO4A — I/O bank 4A supply voltage |
| Pin 62 | I/O — User I/O - bank 4A |
| Pin 63 | GND — Ground |
| Pin 64 | I/O — User I/O - bank 4A |
| Pin 65 | I/O — User I/O - bank 4A |
| Pin 66 | VCC — Core supply voltage (3.3V) |
| Pin 67 | I/O — User I/O - bank 4A |
| Pin 68 | I/O — User I/O - bank 4A |
| Pin 69 | VCCIO4A — I/O bank 4A supply voltage |
| Pin 70 | I/O — User I/O - bank 4A |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O - bank 4A |
| Pin 73 | I/O — User I/O - bank 4A |
| Pin 74 | VCC — Core supply voltage (3.3V) |
| Pin 75 | I/O — User I/O - bank 4A |
| Pin 76 | I/O — User I/O - bank 4A |
| Pin 77 | GND — Ground |
| Pin 78 | I/O — User I/O - bank 5A |
| Pin 79 | VCCIO5A — I/O bank 5A supply voltage |
| Pin 80 | I/O — User I/O - bank 5A |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O - bank 5A |
| Pin 83 | I/O — User I/O - bank 5A |
| Pin 84 | VCC — Core supply voltage (3.3V) |
| Pin 85 | I/O — User I/O - bank 5A |
| Pin 86 | I/O — User I/O - bank 5A |
| Pin 87 | VCCIO5A — I/O bank 5A supply voltage |
| Pin 88 | I/O — User I/O - bank 5A |
| Pin 89 | GND — Ground |
| Pin 90 | I/O — User I/O - bank 5A |
| Pin 91 | I/O — User I/O - bank 5A |
| Pin 92 | VCC — Core supply voltage (3.3V) |
| Pin 93 | I/O — User I/O - bank 5A |
| Pin 94 | I/O — User I/O - bank 5A |
| Pin 95 | VCCIO5A — I/O bank 5A supply voltage |
| Pin 96 | I/O — User I/O - bank 5A |
| Pin 97 | GND — Ground |
| Pin 98 | I/O — User I/O - bank 5A |
| Pin 99 | I/O — User I/O - bank 6A |
| Pin 100 | VCCIO6A — I/O bank 6A supply voltage |
| Pin 101 | I/O — User I/O - bank 6A |
| Pin 102 | GND — Ground |
| Pin 103 | I/O — User I/O - bank 6A |
| Pin 104 | I/O — User I/O - bank 6A |
| Pin 105 | VCC — Core supply voltage (3.3V) |
| Pin 106 | I/O — User I/O - bank 6A |
| Pin 107 | I/O — User I/O - bank 6A |
| Pin 108 | VCCIO6A — I/O bank 6A supply voltage |
| Pin 109 | I/O — User I/O - bank 6A |
| Pin 110 | GND — Ground |
| Pin 111 | I/O — User I/O - bank 6A |
| Pin 112 | I/O — User I/O - bank 6A |
| Pin 113 | VCC — Core supply voltage (3.3V) |
| Pin 114 | I/O — User I/O - bank 6A |
| Pin 115 | I/O — User I/O - bank 7A |
| Pin 116 | VCCIO7A — I/O bank 7A supply voltage |
| Pin 117 | I/O — User I/O - bank 7A |
| Pin 118 | GND — Ground |
| Pin 119 | I/O — User I/O - bank 7A |
| Pin 120 | I/O — User I/O - bank 7A |
| Pin 121 | VCC — Core supply voltage (3.3V) |
| Pin 122 | I/O — User I/O - bank 7A |
| Pin 123 | I/O — User I/O - bank 7A |
| Pin 124 | VCCIO7A — I/O bank 7A supply voltage |
| Pin 125 | I/O — User I/O - bank 7A |
| Pin 126 | GND — Ground |
| Pin 127 | I/O — User I/O - bank 7A |
| Pin 128 | I/O — User I/O - bank 8A |
| Pin 129 | VCCIO8A — I/O bank 8A supply voltage |
| Pin 130 | I/O — User I/O - bank 8A |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — User I/O - bank 8A |
| Pin 133 | I/O — User I/O - bank 8A |
| Pin 134 | VCC — Core supply voltage (3.3V) |
| Pin 135 | I/O — User I/O - bank 8A |
| Pin 136 | I/O — User I/O - bank 8A |
| Pin 137 | VCCIO8A — I/O bank 8A supply voltage |
| Pin 138 | I/O — User I/O - bank 8A |
| Pin 139 | GND — Ground |
| Pin 140 | I/O — User I/O - bank 8A |
| Pin 141 | I/O — User I/O - bank 8A |
| Pin 142 | VCC — Core supply voltage (3.3V) |
| Pin 143 | I/O — User I/O - bank 8A |
| Pin 144 | I/O — User I/O - bank 8A |
| Pin EP | GND (Exposed Pad) — Thermal pad - must be soldered to ground pour for thermal dissipation |
Typische Anwendungen
10M08SAE144I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Portable Instrumentation, Sensor Aggregation Hub, Low-Cost Video Processing Bridge, Consumer Electronics Custom Logic.
Industrial Motor Control
The 10M08SAE144I7G is well suited for industrial motor control and drive signal generation in 3-phase BLDC, stepper, and servo applications. Its 8,000 logic elements and 18x18 multiplier blocks can implement Field-Oriented Control (FOC), space-vector modulation, and PID loops in hardware for deterministic sub-microsecond loop times. The integrated 12-bit SAR ADC samples motor phase currents and back-EMF voltages at up to 1 MSPS, eliminating an external ADC chip. With 101 user I/Os in the 144-EQFP package, the device can directly drive gate drivers, read encoder/Hall sensors, and interface to industrial CAN or RS-485 buses. The industrial -40°C to +100°C temperature grade ensures reliable operation in factory cabinets.
Empfohlen
Factory Automation I/O Expansion
In factory automation systems, the 10M08SAE144I7G serves as a high-density I/O expander bridging PLCs to sensors, actuators, and field-bus networks. The 101 user I/Os can be configured as LVCMOS 3.3V/2.5V/1.8V or LVDS pairs, allowing direct connection to encoders, opto-isolated inputs, and 24V industrial drivers via external level shifters. With 387 Kb of embedded SRAM, the device buffers incoming sensor streams before forwarding aggregated data over EtherCAT, PROFINET, or Modbus TCP interfaces. The non-volatile dual-configuration flash supports remote firmware updates and instant-on operation, critical for production lines that cannot tolerate FPGA boot delays.
Empfohlen
Portable Instrumentation
Handheld test and measurement instruments leverage the 10M08SAE144I7G for signal conditioning, real-time DSP, and display driving in a single low-cost chip. The 8K LE fabric implements FIR/IIR filters, FFT pre-processing, and custom waveform synthesis with deterministic latency. With 1540 Kbits of internal flash, calibration coefficients and instrument firmware remain resident across power cycles - ideal for instant-on multimeters, oscilloscopes, and portable logic analyzers. The 144-EQFP package is hand-solderable for prototype runs, while the integrated 12-bit ADC digitizes analog inputs without a separate converter IC, saving BOM and board space.
Empfohlen
Sensor Aggregation Hub
IoT edge nodes and sensor aggregation hubs use the 10M08SAE144I7G to consolidate multiple sensor interfaces (SPI, I2C, UART, analog) into a single processed data stream. The integrated 12-bit SAR ADC with up to 17 analog channels eliminates external ADC chips for temperature, pressure, and gas sensor arrays. With 8,000 logic elements, the device can run a Nios II soft-core processor for local decision making, freeing upstream MCUs from interrupt storms. The 1540 Kb of on-chip user flash stores sensor calibration tables and configuration, and the 144-EQFP industrial-grade package operates reliably in outdoor enclosures.
Empfohlen
Low-Cost Video Processing Bridge
Video format conversion, scaling, and bridging tasks in low-cost industrial cameras, kiosks, and digital signage use the 10M08SAE144I7G's LVDS-capable I/O banks and 18x18 multipliers. Up to 1.25 Gbps LVDS pairs support direct connection to image sensors, HDMI level shifters, and LCD panels without external serializer/deserializer chips. The 8K LE fabric handles color space conversion, deinterlacing, and timing generation in real time at common resolutions up to 720p60. The 144-EQFP exposed-pad package provides adequate thermal dissipation for continuous video processing workloads in compact, fanless enclosures.
Empfohlen
Consumer Electronics Custom Logic
Consumer appliances, gaming peripherals, and educational electronics use the 10M08SAE144I7G as a cost-effective platform for custom logic, peripheral interfacing, and LED control. The Nios II soft-core support allows the FPGA to replace a small microcontroller plus external glue logic, reducing BOM by 30-50%. With 101 user I/Os, the device can drive LED matrices, scan keypads, and interface USB/UART peripherals. The non-volatile instant-on architecture boots in microseconds - critical for toys, appliances, and remote controls where user-perceived latency matters. RoHS compliance ensures compatibility with global consumer product regulations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08SAE144I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08SCE144I7G | 10M08SAE144C8G | 10M08SCE144C8G | 10M08SAU144I7G | 10M08SCU144I7G |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Total RAM (Kb) | 378 | 378 | 378 | 378 | 378 | 378 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Operating Temperature (TJ) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Supply Voltage | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V |
| Integrated Flash (Kb) | 1540 | 1540 | 1540 | 1540 | 1540 | 1540 |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade (-40°C to +100°C TJ) for factory-floor reliability (vs. 10M08SCE144I7G)
- I7 speed grade for higher internal clock frequencies vs C8 (vs. 10M08SAE144C8G)
- On-chip dual-configuration flash eliminates external boot PROM (vs. Lattice iCE40-HX8K-CB132)
Designhinweise
Estimated: At 3.3V VCC and 50% toggle rate with 75% I/O utilization, the 10M08SAE144I7G core power is roughly 200-300 mW. The 144-EQFP exposed pad provides theta_JA of approximately 25-30 C/W with a properly soldered thermal pad connected to a 1+ square inch ground copper pour. Without the exposed pad soldered, junction temperature can exceed 100°C in industrial enclosures. Solder the EP to ground - never leave it floating - and provide at least 8 thermal vias in the EP pad to inner ground planes for heat extraction.
Decouple each VCC pin with a 0.1µF X7R ceramic capacitor placed within 5mm of the pin. Add one bulk 10µF X5R capacitor per VCCIO bank. Group VCCIO pins by bank voltage on the PCB; do not mix 3.3V and 1.8V I/O standards on the same bank. Use Quartus Prime's Early Power Estimator (EPE) before layout to size the regulator and confirm thermal headroom under worst-case toggle conditions.
Three common pitfalls with the 10M08SAE144I7G: (1) Forgetting to solder the exposed pad causes thermal runaway and unreliable JTAG - always solder the EP to a continuous ground pour with 8+ vias. (2) Driving a VCCIO bank above its rated voltage (e.g., 3.3V on a 1.8V bank) permanently damages the I/O - check the Quartus pin planner assignments before bitstream generation. (3) Routing LVDS pairs without 100Ω differential impedance and length matching fails signal-integrity compliance - use the MAX 10 LVDS SERDES guidelines for any LVDS link above 500 Mbps.
Route JTAG (TCK, TMS, TDI, TDO) traces with 50Ω single-ended impedance and keep them under 100mm total length. Place a 10kΩ pull-up on TCK, TMS, TDI to VCCIO and a 10kΩ pull-up on nCONFIG. Add a 4.7kΩ pull-up on nCE if not actively driven. Keep JTAG traces away from switching power inductors and clock lines. Reserve a 4-pin header (or Tag-Connect footprint) for in-system programming access during development.
Compliance-Informationen
RoHS compliant per Intel product page. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. For automotive, consult Intel MAX 10 automotive-grade variants.