10M08SAE144I7G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel
Référence : 10M08SAE144I7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.5 | $115,00 |
| 100 | $9.2 | $920,00 |
| 500 | $7.95 | $3 975,00 |
| 1 000 | $6.8 | $6 800,00 |
10M08SAE144I7G Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Unlike a microcontroller, FPGAs execute logic in parallel hardware, offering deterministic timing and high I/O throughput. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic semiconductor -> integrated circuit, and are widely used to accelerate parallel workloads, glue logic, and interface bridging.
Key features of the 10M08SAE144I7G include 8,000 logic elements, 378 Kbits of user flash memory, a 1.25 Gbps LVDS-capable I/O bank architecture, an integrated 12-bit successive-approximation ADC, and a single 3.3 V core supply. The device also supports Nios II embedded processor cores, JTAG-based configuration, and 18x18 multiplier blocks for digital signal processing. This combination delivers a flexible, processor-capable platform in a single device.
Architecturally, the 10M08SAE144I7G uses a TSMC 55 nm CMOS process with a look-up-table (LUT) based fabric and embedded SRAM blocks (M9K). The integrated flash eliminates external boot components, reducing BOM and board area. The exposed-pad LQFP-144 package supports conventional SMT reflow, simplifying manufacturing versus BGA alternatives. The 144-pin EQFP form factor exposes 101 user I/Os while remaining hand-solderable for prototype work.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing bridges, portable instrumentation, and consumer electronics requiring custom logic or peripheral interfacing. The internal ADC and flash make it well-suited for sensor aggregation and instant-on embedded platforms. Designers frequently pair it with Nios II soft-core firmware for low-cost SoC replacement.
When designing with the 10M08SAE144I7G, ensure the exposed pad (EP) is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Plan I/O bank voltage (VCCIO) assignments carefully - the 10M08 device supports multiple I/O standards per bank but each bank must use a single VCCIO. Decouple each VCCIO bank with 0.1µF + 10µF ceramic capacitors placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, providing a faster engineering decision workflow.
Alternatives de remplacement direct pour 10M08SAE144I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M08SAE144I7G (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Mounting Type, Logic Elements (LE), Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M08SCE144I7G
✅ Remplacement direct✓ En stock
$70.2 / unité
Voir la fiche technique →10M08SAE144C8G
✅ Remplacement direct✓ En stock
$16.25 / unité
Voir la fiche technique →10M08SCE144C8G
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →10M08SAU144I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M08SCU144I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M08SAE144I7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Total RAM Bits | 387072 (378 Kb) |
| User Flash Memory | 1540 Kb (dual-configuration) |
| User I/O Pins | 101 |
| Tension d'alimentation | 2.85 V to 3.465 V |
| Core Voltage | 3.3 V (single supply) |
| Température de fonctionnement | -40°C to +100°C (TJ) |
| Type de montage | Surface Mount |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Supplier Device Package | 144-EQFP EP |
| Process Technology | TSMC 55 nm CMOS |
| Embedded Memory Type | M9K SRAM blocks |
| Integrated ADC | Yes, 12-bit SAR |
| Configuration Method | JTAG / internal flash (instant-on) |
| Soft Core Support | Nios II |
| Statut RoHS | Compliant |
Configuration des broches de 10M08SAE144I7G
| Broche 1 | I/O — User I/O - bank 1B |
| Broche 2 | I/O — User I/O - bank 1B |
| Broche 3 | I/O — User I/O - bank 1B |
| Broche 4 | VCCIO1B — I/O bank 1B supply voltage |
| Broche 5 | I/O — User I/O - bank 1B |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O - bank 1B |
| Broche 8 | I/O — User I/O - bank 1B |
| Broche 9 | VCC — Core supply voltage (3.3V) |
| Broche 10 | I/O — User I/O - bank 1B |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O - bank 1B |
| Broche 13 | I/O — User I/O - bank 2A |
| Broche 14 | VCCIO2A — I/O bank 2A supply voltage |
| Broche 15 | I/O — User I/O - bank 2A |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O - bank 2A |
| Broche 18 | I/O — User I/O - bank 2A |
| Broche 19 | VCC — Core supply voltage (3.3V) |
| Broche 20 | I/O — User I/O - bank 2A |
| Broche 21 | I/O — User I/O - bank 2A |
| Broche 22 | VCCIO2A — I/O bank 2A supply voltage |
| Broche 23 | I/O — User I/O - bank 2A |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O - bank 2A |
| Broche 26 | I/O — User I/O - bank 2A |
| Broche 27 | VCC — Core supply voltage (3.3V) |
| Broche 28 | I/O — User I/O - bank 2A |
| Broche 29 | I/O — User I/O - bank 2A |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O - bank 2A |
| Broche 32 | VCCIO2A — I/O bank 2A supply voltage |
| Broche 33 | I/O — User I/O - bank 2A |
| Broche 34 | I/O — User I/O - bank 2A |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O - bank 2A |
| Broche 37 | VCC — Core supply voltage (3.3V) |
| Broche 38 | I/O — User I/O - bank 3A |
| Broche 39 | I/O — User I/O - bank 3A |
| Broche 40 | VCCIO3A — I/O bank 3A supply voltage |
| Broche 41 | I/O — User I/O - bank 3A |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O - bank 3A |
| Broche 44 | I/O — User I/O - bank 3A |
| Broche 45 | VCC — Core supply voltage (3.3V) |
| Broche 46 | I/O — User I/O - bank 3A |
| Broche 47 | I/O — User I/O - bank 3A |
| Broche 48 | VCCIO3A — I/O bank 3A supply voltage |
| Broche 49 | I/O — User I/O - bank 3A |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O - bank 3A |
| Broche 52 | I/O — User I/O - bank 3A |
| Broche 53 | VCC — Core supply voltage (3.3V) |
| Broche 54 | I/O — User I/O - bank 3A |
| Broche 55 | I/O — User I/O - bank 3A |
| Broche 56 | VCCIO3A — I/O bank 3A supply voltage |
| Broche 57 | I/O — User I/O - bank 3A |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O - bank 3A |
| Broche 60 | I/O — User I/O - bank 4A |
| Broche 61 | VCCIO4A — I/O bank 4A supply voltage |
| Broche 62 | I/O — User I/O - bank 4A |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O - bank 4A |
| Broche 65 | I/O — User I/O - bank 4A |
| Broche 66 | VCC — Core supply voltage (3.3V) |
| Broche 67 | I/O — User I/O - bank 4A |
| Broche 68 | I/O — User I/O - bank 4A |
| Broche 69 | VCCIO4A — I/O bank 4A supply voltage |
| Broche 70 | I/O — User I/O - bank 4A |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O - bank 4A |
| Broche 73 | I/O — User I/O - bank 4A |
| Broche 74 | VCC — Core supply voltage (3.3V) |
| Broche 75 | I/O — User I/O - bank 4A |
| Broche 76 | I/O — User I/O - bank 4A |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O - bank 5A |
| Broche 79 | VCCIO5A — I/O bank 5A supply voltage |
| Broche 80 | I/O — User I/O - bank 5A |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O - bank 5A |
| Broche 83 | I/O — User I/O - bank 5A |
| Broche 84 | VCC — Core supply voltage (3.3V) |
| Broche 85 | I/O — User I/O - bank 5A |
| Broche 86 | I/O — User I/O - bank 5A |
| Broche 87 | VCCIO5A — I/O bank 5A supply voltage |
| Broche 88 | I/O — User I/O - bank 5A |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O - bank 5A |
| Broche 91 | I/O — User I/O - bank 5A |
| Broche 92 | VCC — Core supply voltage (3.3V) |
| Broche 93 | I/O — User I/O - bank 5A |
| Broche 94 | I/O — User I/O - bank 5A |
| Broche 95 | VCCIO5A — I/O bank 5A supply voltage |
| Broche 96 | I/O — User I/O - bank 5A |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O - bank 5A |
| Broche 99 | I/O — User I/O - bank 6A |
| Broche 100 | VCCIO6A — I/O bank 6A supply voltage |
| Broche 101 | I/O — User I/O - bank 6A |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O - bank 6A |
| Broche 104 | I/O — User I/O - bank 6A |
| Broche 105 | VCC — Core supply voltage (3.3V) |
| Broche 106 | I/O — User I/O - bank 6A |
| Broche 107 | I/O — User I/O - bank 6A |
| Broche 108 | VCCIO6A — I/O bank 6A supply voltage |
| Broche 109 | I/O — User I/O - bank 6A |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O - bank 6A |
| Broche 112 | I/O — User I/O - bank 6A |
| Broche 113 | VCC — Core supply voltage (3.3V) |
| Broche 114 | I/O — User I/O - bank 6A |
| Broche 115 | I/O — User I/O - bank 7A |
| Broche 116 | VCCIO7A — I/O bank 7A supply voltage |
| Broche 117 | I/O — User I/O - bank 7A |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O - bank 7A |
| Broche 120 | I/O — User I/O - bank 7A |
| Broche 121 | VCC — Core supply voltage (3.3V) |
| Broche 122 | I/O — User I/O - bank 7A |
| Broche 123 | I/O — User I/O - bank 7A |
| Broche 124 | VCCIO7A — I/O bank 7A supply voltage |
| Broche 125 | I/O — User I/O - bank 7A |
| Broche 126 | GND — Ground |
| Broche 127 | I/O — User I/O - bank 7A |
| Broche 128 | I/O — User I/O - bank 8A |
| Broche 129 | VCCIO8A — I/O bank 8A supply voltage |
| Broche 130 | I/O — User I/O - bank 8A |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O - bank 8A |
| Broche 133 | I/O — User I/O - bank 8A |
| Broche 134 | VCC — Core supply voltage (3.3V) |
| Broche 135 | I/O — User I/O - bank 8A |
| Broche 136 | I/O — User I/O - bank 8A |
| Broche 137 | VCCIO8A — I/O bank 8A supply voltage |
| Broche 138 | I/O — User I/O - bank 8A |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O - bank 8A |
| Broche 141 | I/O — User I/O - bank 8A |
| Broche 142 | VCC — Core supply voltage (3.3V) |
| Broche 143 | I/O — User I/O - bank 8A |
| Broche 144 | I/O — User I/O - bank 8A |
| Broche EP | GND (Exposed Pad) — Thermal pad - must be soldered to ground pour for thermal dissipation |
Applications typiques
10M08SAE144I7G convient pour 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Portable Instrumentation, Sensor Aggregation Hub, Low-Cost Video Processing Bridge, Consumer Electronics Custom Logic.
Industrial Motor Control
The 10M08SAE144I7G is well suited for industrial motor control and drive signal generation in 3-phase BLDC, stepper, and servo applications. Its 8,000 logic elements and 18x18 multiplier blocks can implement Field-Oriented Control (FOC), space-vector modulation, and PID loops in hardware for deterministic sub-microsecond loop times. The integrated 12-bit SAR ADC samples motor phase currents and back-EMF voltages at up to 1 MSPS, eliminating an external ADC chip. With 101 user I/Os in the 144-EQFP package, the device can directly drive gate drivers, read encoder/Hall sensors, and interface to industrial CAN or RS-485 buses. The industrial -40°C to +100°C temperature grade ensures reliable operation in factory cabinets.
Recommandé
Factory Automation I/O Expansion
In factory automation systems, the 10M08SAE144I7G serves as a high-density I/O expander bridging PLCs to sensors, actuators, and field-bus networks. The 101 user I/Os can be configured as LVCMOS 3.3V/2.5V/1.8V or LVDS pairs, allowing direct connection to encoders, opto-isolated inputs, and 24V industrial drivers via external level shifters. With 387 Kb of embedded SRAM, the device buffers incoming sensor streams before forwarding aggregated data over EtherCAT, PROFINET, or Modbus TCP interfaces. The non-volatile dual-configuration flash supports remote firmware updates and instant-on operation, critical for production lines that cannot tolerate FPGA boot delays.
Recommandé
Portable Instrumentation
Handheld test and measurement instruments leverage the 10M08SAE144I7G for signal conditioning, real-time DSP, and display driving in a single low-cost chip. The 8K LE fabric implements FIR/IIR filters, FFT pre-processing, and custom waveform synthesis with deterministic latency. With 1540 Kbits of internal flash, calibration coefficients and instrument firmware remain resident across power cycles - ideal for instant-on multimeters, oscilloscopes, and portable logic analyzers. The 144-EQFP package is hand-solderable for prototype runs, while the integrated 12-bit ADC digitizes analog inputs without a separate converter IC, saving BOM and board space.
Recommandé
Sensor Aggregation Hub
IoT edge nodes and sensor aggregation hubs use the 10M08SAE144I7G to consolidate multiple sensor interfaces (SPI, I2C, UART, analog) into a single processed data stream. The integrated 12-bit SAR ADC with up to 17 analog channels eliminates external ADC chips for temperature, pressure, and gas sensor arrays. With 8,000 logic elements, the device can run a Nios II soft-core processor for local decision making, freeing upstream MCUs from interrupt storms. The 1540 Kb of on-chip user flash stores sensor calibration tables and configuration, and the 144-EQFP industrial-grade package operates reliably in outdoor enclosures.
Recommandé
Low-Cost Video Processing Bridge
Video format conversion, scaling, and bridging tasks in low-cost industrial cameras, kiosks, and digital signage use the 10M08SAE144I7G's LVDS-capable I/O banks and 18x18 multipliers. Up to 1.25 Gbps LVDS pairs support direct connection to image sensors, HDMI level shifters, and LCD panels without external serializer/deserializer chips. The 8K LE fabric handles color space conversion, deinterlacing, and timing generation in real time at common resolutions up to 720p60. The 144-EQFP exposed-pad package provides adequate thermal dissipation for continuous video processing workloads in compact, fanless enclosures.
Recommandé
Consumer Electronics Custom Logic
Consumer appliances, gaming peripherals, and educational electronics use the 10M08SAE144I7G as a cost-effective platform for custom logic, peripheral interfacing, and LED control. The Nios II soft-core support allows the FPGA to replace a small microcontroller plus external glue logic, reducing BOM by 30-50%. With 101 user I/Os, the device can drive LED matrices, scan keypads, and interface USB/UART peripherals. The non-volatile instant-on architecture boots in microseconds - critical for toys, appliances, and remote controls where user-perceived latency matters. RoHS compliance ensures compatibility with global consumer product regulations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M08SAE144I7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M08SCE144I7G | 10M08SAE144C8G | 10M08SCE144C8G | 10M08SAU144I7G | 10M08SCU144I7G |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Total RAM (Kb) | 378 | 378 | 378 | 378 | 378 | 378 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Operating Temperature (TJ) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Supply Voltage | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V | 2.85V to 3.465V |
| Integrated Flash (Kb) | 1540 | 1540 | 1540 | 1540 | 1540 | 1540 |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
Principaux différenciateurs
- Industrial temperature grade (-40°C to +100°C TJ) for factory-floor reliability (vs 10M08SCE144I7G)
- I7 speed grade for higher internal clock frequencies vs C8 (vs 10M08SAE144C8G)
- On-chip dual-configuration flash eliminates external boot PROM (vs Lattice iCE40-HX8K-CB132)
Notes de conception
Estimated: At 3.3V VCC and 50% toggle rate with 75% I/O utilization, the 10M08SAE144I7G core power is roughly 200-300 mW. The 144-EQFP exposed pad provides theta_JA of approximately 25-30 C/W with a properly soldered thermal pad connected to a 1+ square inch ground copper pour. Without the exposed pad soldered, junction temperature can exceed 100°C in industrial enclosures. Solder the EP to ground - never leave it floating - and provide at least 8 thermal vias in the EP pad to inner ground planes for heat extraction.
Decouple each VCC pin with a 0.1µF X7R ceramic capacitor placed within 5mm of the pin. Add one bulk 10µF X5R capacitor per VCCIO bank. Group VCCIO pins by bank voltage on the PCB; do not mix 3.3V and 1.8V I/O standards on the same bank. Use Quartus Prime's Early Power Estimator (EPE) before layout to size the regulator and confirm thermal headroom under worst-case toggle conditions.
Three common pitfalls with the 10M08SAE144I7G: (1) Forgetting to solder the exposed pad causes thermal runaway and unreliable JTAG - always solder the EP to a continuous ground pour with 8+ vias. (2) Driving a VCCIO bank above its rated voltage (e.g., 3.3V on a 1.8V bank) permanently damages the I/O - check the Quartus pin planner assignments before bitstream generation. (3) Routing LVDS pairs without 100Ω differential impedance and length matching fails signal-integrity compliance - use the MAX 10 LVDS SERDES guidelines for any LVDS link above 500 Mbps.
Route JTAG (TCK, TMS, TDI, TDO) traces with 50Ω single-ended impedance and keep them under 100mm total length. Place a 10kΩ pull-up on TCK, TMS, TDI to VCCIO and a 10kΩ pull-up on nCONFIG. Add a 4.7kΩ pull-up on nCE if not actively driven. Keep JTAG traces away from switching power inductors and clock lines. Reserve a 4-pin header (or Tag-Connect footprint) for in-system programming access during development.
Informations de conformité
RoHS compliant per Intel product page. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. For automotive, consult Intel MAX 10 automotive-grade variants.