Altera

10M08SAU169I7P - MAX 10 FPGA 8K LE UFBGA-169 | Altera

Name: 10M08SAU169I7P - MAX 10 FPGA 8K LE UFBGA-169 | Altera
Brand: Altera
SKU: 10M08SAU169I7P
Price: 20.5 USD
Availability: InStock

Teilenummer: 10M08SAU169I7P ✓ Aktiv

Auf Lager Versand in 1–3 Werktagen

1.2 V Vdss 169-UFBGA (UBGA-169, 11x11 mm) Package S (slowest) Speed 387,072 bits (M9K blocks) Memory

Ab $20.5 USD / Stück

MOQ: 1 |

Preis aktualisiert: 2026-09-05

Mengenpreise

Menge	Stückpreis	Gesamt
1	$38.5	$38,50
10	$34.2	$342,00
100	$28.9	$2.890,00
500	$24.1	$12.050,00
1.000	$20.5	$20.500,00

ℹ️ Alle Preise sind in USD

Datenblatt anzeigen (PDF) Alternativen ansehen

Menge

10M08SAU169I7P Übersicht

The Altera (Intel) 10M08SAU169I7P is a member of the MAX 10 family of non-volatile FPGAs integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and a 1.2 V core in a 169-ball Ultra FineLine BGA (UFBGA-169) package. The MAX 10 device combines a traditional FPGA fabric with on-die flash configuration memory and a hard ADC block, eliminating the need for external boot PROMs in many designs. The 'S' speed grade and 'A' automotive-grade screen make this variant suitable for cost-sensitive industrial control, motor drive, and I/O expansion applications.

A MAX 10 FPGA belongs to the non-volatile FPGA category, sitting hierarchically below SRAM-only FPGAs (e.g. Cyclone V) and above CPLDs in terms of logic density and embedded feature set. The MAX 10 family integrates user flash, ADC, and DSP blocks directly on-die, allowing single-chip implementation of mixed-signal control designs. Compared to pure CPLDs, MAX 10 devices offer substantially higher logic capacity, embedded multipliers, and DSP support, while preserving instant-on capability from on-chip flash.

Key features of the 10M08SAU169I7P include 8,000 logic elements (LEs), 387 Kbits of embedded user SRAM (M9K blocks), 56 embedded 18x18 multipliers, two integrated PLLs, and up to 130 general-purpose I/O pins. The device supports LVCMOS, LVDS, SSTL, and differential I/O standards at data rates suitable for parallel sensor buses, low-speed video, and industrial communication interfaces such as SPI, I2C, UART, and CAN.

Typical applications include industrial motor control and PLC interfaces, sensor aggregation hubs, low-cost video processing bridges, machine vision pre-processors, and I/O expansion for SoC-based designs. The integrated 12-bit ADC (up to 17 channels) and DSP blocks make the part especially attractive for mixed-signal data acquisition and signal conditioning tasks.

When designing with the 10M08SAU169I7P, plan power sequencing on the 3.3V/2.5V/1.2V rails, observe the BGA escape routing density in the UFBGA-169 footprint, and use the Quartus Prime toolchain for synthesis and place-and-route.

Drop-in-Alternativen für 10M08SAU169I7P – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08SAU169I7P (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, PLLs, Process Technology, Speed Grade.

10M04SAU169I7G

Intel

Operating Temperature: -40 °C to +100 °C (industrial I7 grade)

Package: 169-ball UFBGA (U169), 11×11 mm, 0.65 mm pitch

PLLs: Hard PLL blocks (number device-specific)

Vergleichen mit 10M08SAU169I7P →

10M08SAE144I7G

Intel

Operating Temperature: -40°C to +100°C (TJ)

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: TSMC 55 nm CMOS

Vergleichen mit 10M08SAU169I7P →

10M08SAM153I7G

Intel

Operating Temperature: -40 °C to +100 °C (Industrial)

Package: 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch

PLLs: 4 (periphery)

Vergleichen mit 10M08SAU169I7P →

10M08SAU169A7G

Intel

Operating Temperature: -40C to +125C (automotive grade)

Package: 169-LFBGA (Ultra FineLine BGA, 11x11 mm)

PLLs: 4

Vergleichen mit 10M08SAU169I7P →

10M08SAU169C8G

Intel

Operating Temperature: Commercial / Industrial (per device suffix)

Package: 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch)

PLLs: 4 analog PLLs + 2 fractional PLLs

✅ Drop-In

Intel

📦 153-MBGA

MAX 10 · 8,000 · 378 Kbit · 112 · 24 · 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch · -40 °C to +100 °C (Industrial) · I7 (industrial, 7)

✓ Auf Lager

$7.4 / Stück

Datenblatt ansehen →

10M08SAU169I7P Grenzwerte & elektrische Eigenschaften

Manufacturer	Altera (Intel)
Family	MAX 10
Logic Elements	8,000
Embedded Memory	387,072 bits (M9K blocks)
Embedded Multipliers	56 (18x18)
Maximum User I/O	130
Gehäuse	169-UFBGA (UBGA-169, 11x11 mm)
Core Voltage	1.2 V
Process Technology	55 nm
Betriebstemperatur	-40C to +100C (Industrial)
Speed Grade	S (slowest)
On-chip Flash	Yes (non-volatile configuration)
PLLs	2
Montageart	Surface Mount (BGA)
RoHS-Status	Compliant

10M08SAU169I7P 169-ufbga (ubga-169, 11x11 mm) Pinbelegungsleitfaden

Pinbelegung für 10M08SAU169I7P (169-ufbga (ubga-169, 11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 10M08SAU169I7P im 169-ufbga (ubga-169, 11x11 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 10M08SAU169I7P.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

10M08SAU169I7P ist geeignet für 6 Anwendungs: Industrial Motor Control, PLC and I/O Expansion, Sensor Aggregation Hub, Low-Cost Video Bridging, Automotive Infotainment Auxiliary, Test & Measurement Front-End.

🏭

Industrial Motor Control

The 10M08SAU169I7P suits single-axis and multi-axis industrial motor control designs where its 8,000 LEs and 56 18x18 multipliers can host Field-Oriented Control (FOC) IP cores. The 12-bit on-chip ADC samples phase currents at high rate while DSP blocks execute Clarke/Park transforms. The UFBGA-169 footprint allows compact PCB integration near power stages. Industrial -40C to +100C rating supports factory-floor deployment.

Empfohlen

🔧

PLC and I/O Expansion

Used as an I/O expander or protocol-bridging coprocessor alongside a main MCU/SoC in PLC backplanes, the 10M08SAU169I7P offers 130 user I/Os supporting LVCMOS 3.3V, 2.5V, 1.8V, and LVDS standards. This enables glue-logic functions, signal level translation, and protocol conversion (e.g. parallel-to-SPI, UART-to-CAN). The non-volatile on-chip flash eliminates external boot devices, simplifying PLC module design.

Empfohlen

10CL016YU484C8G · Intel 10M02DCU324A7G · Intel

🧩

Sensor Aggregation Hub

The 10M08SAU169I7P aggregates multiple sensor streams (SPI, I2C, UART, analog via on-chip ADC) in industrial IoT edge nodes. Its 8K LEs handle protocol framing and pre-processing while 387 Kbits SRAM buffers bursts before forwarding to a higher-level processor. The industrial temperature range and small UFBGA-169 footprint suit DIN-rail mounted edge gateways with limited thermal budget.

Empfohlen

10M08DCF256C8G · Intel 10M08DAF256C7G · Intel

🎥

Low-Cost Video Bridging

The 10M08SAU169I7P bridges low-resolution CMOS sensor parallel interfaces to MIPI CSI-2 or RGB-to-MIPI converters in cost-sensitive embedded vision applications. The 56 18x18 multipliers support real-time color-space conversion and scaling. The integrated flash configuration supports instant-on camera initialization. This is suitable for machine vision pre-processors, smart appliances, and entry-level surveillance cameras.

Empfohlen

10M08DCF484C8G · Intel 10M08DCU324I7G · Intel

🚗

Automotive Infotainment Auxiliary

For non-safety-critical automotive infotainment auxiliary functions (e.g. display backlight control, button matrix scanning, audio routing glue logic), the 10M08SAU169A7G variant (AEC-Q100 screened) is a more stringent drop-in upgrade. The 10M08SAU169I7P itself suits industrial-grade automotive adjacent applications where AEC-Q100 is not strictly required. The UFBGA-169 footprint allows compact module placement.

Empfohlen

10M08SAU169A7G · Intel 10CL055YU484C8G · Intel

🔬

Test & Measurement Front-End

In bench-top test instruments and data loggers, the 10M08SAU169I7P serves as a flexible front-end with its on-chip 12-bit ADC (multi-channel) plus 130 GPIO for instrument switching matrices. The DSP blocks implement real-time FIR/IIR filtering on acquired signals. Industrial temperature range and non-volatile boot make it suitable for portable and lab-deployed equipment with field-upgrade requirements.

Empfohlen

10M08DCF484I7G · Intel 10M04DAU324C8G · Intel

Zusammenfassung der empfohlenen Produkte

What is the 10M08SAU169I7P?

The 10M08SAU169I7P is an Altera MAX 10 non-volatile FPGA with 8,000 logic elements, 387 Kbits of embedded SRAM, and 56 18x18 multipliers, packaged in a 169-ball UFBGA. Per the MAX 10 family datasheet, it integrates user flash, DSP blocks, and PLLs on a single 55 nm die. It is designed for industrial-grade applications requiring instant-on FPGA logic.

How many logic elements and I/O pins does 10M08SAU169I7P have?

The 10M08SAU169I7P provides 8,000 logic elements (LEs), 387,072 bits of embedded SRAM, and up to 130 user I/O pins. According to Altera product specifications, these resources suit small-to-medium glue-logic, I/O expansion, and motor control designs. The 'S' speed grade is the slowest but most cost-effective of the MAX 10 speed grades.

Does 10M08SAU169I7P support industrial temperature range?

Yes, the 10M08SAU169I7P is rated for industrial temperature range from -40C to +100C. The 'I7' suffix in the ordering code designates the industrial-grade junction temperature screen per Altera's MAX 10 ordering information. This makes it suitable for factory automation and outdoor equipment.

What software is used to program 10M08SAU169I7P?

The 10M08SAU169I7P is programmed using Intel Quartus Prime design software (free Lite edition available). Per the Altera MAX 10 device handbook, Quartus Prime supports Verilog, VHDL, and block-based design entry plus synthesis, place-and-route, and on-chip flash programming. A JTAG or AS programming cable is required for flash image loading.

Where can I buy 10M08SAU169I7P and what is the price?

The 10M08SAU169I7P is available from authorized distributors including DigiKey, Mouser, and Octopart as of 2026-09-05. Unit pricing at qty 1 is approximately 38.50 USD, with volume breaks at 28.90 USD at qty 100 and 20.50 USD at qty 1000. Lead time for non-stocked quantities is typically 8-12 weeks per distributor data.

Is 10M08SAU169I7P in stock at DigiKey?

Stock status of 10M08SAU169I7P at DigiKey varies with demand. As of 2026-09-05, the part shows limited stock per Octopart; check DigiKey's live inventory for current availability. Lead times from authorized distributors are typically 8-12 weeks for factory orders, and 4-6 weeks for Mouser when in inventory.

What is the lead time for 10M08SAU169I7P?

Lead time for the 10M08SAU169I7P is approximately 8-12 weeks when ordered through authorized distributors as of 2026-09-05. Some distributors offer expedited 4-week delivery at premium pricing. For high-volume orders, contact Altera/Intel directly for production scheduling and allocation.

What is the difference between 10M08SAU169I7P and 10M08SAU169C8G?

Both parts share the same UFBGA-169 footprint, MAX 10 family, 8,000 LEs, and pin-compatible UFBGA-169 package. The 'I7' suffix denotes industrial temperature (-40C to +100C), while 'C8G' denotes commercial temperature (0C to +85C) with speed grade 8 (faster). They are drop-in compatible at the PCB level but differ in temperature grade and speed.

10M08SAU169I7P vs 10M04SAU169I7G - which is better for motor control?

The 10M08SAU169I7P offers 8,000 LEs, 56 multipliers, and 387 Kbits RAM, while the 10M04SAU169I7G offers 4,000 LEs, 30 multipliers, and 189 Kbits RAM. For complex FOC motor control with multiple axes, choose 10M08 for its larger resource pool. For single-axis BLDC/PMSM control, 10M04 is more cost-effective. Both share the UFBGA-169 footprint.

When should I choose 10M08SAU169I7P over Lattice iCE40?

Choose the 10M08SAU169I7P over Lattice iCE40 when you need non-volatile single-chip boot (no external flash), larger logic capacity (8K vs ~8K LEs but with more DSP/BRAM), and integrated 12-bit ADC for mixed-signal sensing. The iCE40 excels in ultra-low power and lower cost, but requires external boot flash for many configurations.

What is the best drop-in replacement for 10M08SAU169I7P?

The best drop-in replacement for 10M08SAU169I7P in the same UFBGA-169 footprint is the 10M08SAU169C8G (commercial temp, speed grade 8) or 10M08SAU169A7G (automotive temp grade). Both share identical pinout and logic resources. For 4K-LE cost reduction, the 10M04SAU169I7G is pin-compatible but offers half the resources.

Can 10M08SAU169C8G replace 10M08SAU169I7P?

Yes, the 10M08SAU169C8G can drop-in replace the 10M08SAU169I7P at the PCB level - both use the same UFBGA-169 footprint and pinout. The difference is commercial temperature range (0C to +85C) vs industrial (-40C to +100C). Use 10M08SAU169C8G only in commercial-temperature end products.

Where to download 10M08SAU169I7P datasheet PDF?

The 10M08SAU169I7P datasheet PDF can be downloaded from the official Altera product page at https://www.altera.com/products/fpga/max/10/10m08-u169/10M08SAU169I7P. Additional resources include the MAX 10 device handbook and pin connection guidelines on Intel's FPGA documentation portal. Per the manufacturer, registration may be required for some advanced datasheets.

Where to find 10M08SAU169I7P pinout and BGA ball map?

The 10M08SAU169I7P pinout and UFBGA-169 ball map are documented in the MAX 10 device handbook pin connection guidelines. The 169 balls are arranged in an 11x11 grid (with depopulated corners) on an 11x11 mm substrate with 0.65 mm pitch per Altera packaging specifications. Use the Quartus Prime Pin Planner tool for assignment.

What is the key specification of 10M08SAU169I7P for engineers?

The key specifications for engineers evaluating 10M08SAU169I7P are: 8,000 logic elements, 387 Kbits embedded SRAM, 56 18x18 multipliers, 130 user I/O, integrated dual-config flash, 12-bit ADC, and industrial temperature range. Per Altera's MAX 10 family datasheet, the part is intended for low-power, instant-on, mixed-signal FPGA applications with single-chip solution positioning.

Technische Referenzdaten für 10M08SAU169I7P – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 10M08SAU169I7P when you need a non-volatile 8K-LE FPGA in the UFBGA-169 footprint for industrial temperature applications such as motor control, PLC I/O expansion, or sensor aggregation hubs. The integrated on-chip flash eliminates external boot PROMs, reducing BOM cost and board area. If your design requires commercial temperature only and higher Fmax, switch to the pin-compatible 10M08SAU169C8G. For AEC-Q100 automotive projects, upgrade to the 10M08SAU169A7G. If 4K LEs suffice and you want to save cost, the pin-compatible 10M04SAU169I7G is a drop-in alternative. For lower-density designs, consider the EQFP-144 (10M08SAE144I7G) or MBGA-153 (10M08SAM153I7G) packages, but note these require PCB redesign.

Vergleich mit Alternativen

Parameter	Dieses Produkt	10M08SAU169C8G	10M08SAU169A7G	10M04SAU169I7G
Package	169-UFBGA (11x11 mm)	169-UFBGA (11x11 mm) - same	169-UFBGA (11x11 mm) - same	169-UFBGA - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Family	MAX 10	MAX 10	MAX 10	MAX 10
Logic Elements	8,000	8,000	8,000	4,000 (-50%)
Embedded Memory	387,072 bits	387,072 bits	387,072 bits	189,440 bits (-51%)
Temperature Grade	Industrial (-40C to +100C)	Commercial (0C to +85C)	Automotive (AEC-Q100)	Industrial (-40C to +100C)
Speed Grade	S (slowest)	8 (faster)	7	7
Embedded Multipliers (18x18)	56	56	56	30 (-46%)
Maximum User I/O	130	130	130	130

Wichtigste Unterscheidungsmerkmale

Industrial temperature range with full MAX 10 feature set (vs. 10M08SAU169C8G)
Largest logic capacity in the 169-UFBGA MAX 10 footprint (vs. 10M04SAU169I7G)
Slower speed grade gives better power/thermal margin (vs. 10M08SAU169C8G (speed grade 8))

Designhinweise

The 169-UFBGA package has 0.65 mm ball pitch on an 11x11 mm substrate. Use a 4-layer PCB with microvia-in-pad or dogbone fan-out escape routing for high-density signals. Per Altera MAX 10 hardware design guidelines, place at least 4 ground vias in the central BGA thermal/ground pad to ensure proper thermal dissipation and ground return path integrity.

Estimated: MAX 10 FPGA core draws approximately 100-300 mA at 1.2V depending on logic utilization. The UFBGA-169 package requires a 3.3V auxiliary supply (VCCA) and 2.5V/1.8V selectable supply for I/O banks per the MAX 10 device handbook. Use low-dropout regulators with 1% accuracy and add bulk + decoupling capacitors (10 uF + 100 nF) close to each power pin pair.

Do not assume UFBGA-169 is interchangeable with EQFP-144 or MBGA-153 pinouts - the ball map differs even at the same family. When migrating designs between MAX 10 packages, regenerate the Quartus Prime pin assignments from scratch. Also note that the 'S' speed grade is the slowest; for designs requiring higher Fmax, use speed grade 7 or 8 variants.