A3PE1500-2FGG676I - ProASIC3E FPGA 1.5M Gates 444 I/O | Microchip
MPN: A3PE1500-2FGG676I β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3PE1500-2FGG676I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE1500-1FG676I
β Drop-Inβ In Stock
$65.89 / Unit
View Datasheet βA3PE1500-FGG676I
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-FG676I
β Drop-Inβ In Stock
$60.2 / Unit
View Datasheet βM1A3PE1500-1FG676I
β Drop-Inπ Reference alternative (not in catalog)
M1AFS1500-2FGG676I
β Drop-Inβ In Stock
$59.6 / Unit
View Datasheet βA3PE1500-2FG676I
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-2FGG676I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 1500000 |
| Logic Elements / CLBs | 38400 |
| User I/O | 444 |
| Configuration Bits | 276480 |
| Maximum Frequency | 310 MHz (per Kynix/FPGAkey listing) |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm CMOS flash |
| Speed Grade | -2 |
| Package | 676-BGA (FBGA, square, 1.0 mm ball pitch) |
| Terminal Form | Ball |
| Number of Terminals | 676 |
| Temperature Grade | Industrial (I) |
| Mounting Type | Surface Mount |
| Programming Technology | Flash (nonvolatile, single-chip) |
| Soft ARM Support | Optional (per ProASIC3E datasheet) |
A3PE1500-2FGG676I 676-bga (fbga, square, 1.0 mm ball pitch) Pin Configuration Guide
Complete pinout information for A3PE1500-2FGG676I (676-bga (fbga, square, 1.0 mm ball pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-2FGG676I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-2FGG676I is suitable for 6 applications: Industrial Automation and Motor Control, Avionics and Secure Embedded Systems, Networking and Communications Line Cards, ASIC Prototyping and Low-Volume ASIC Replacement, Test and Measurement Instrumentation, Medical Device Control Logic.
Industrial Automation and Motor Control
The A3PE1500-2FGG676I fits industrial automation controllers where deterministic logic, wide parallel I/O, and instant-on startup are required. Its 1.5 million system gates and 444 user I/Os let a single device absorb encoder interfaces, PWM generators, and fieldbus glue logic that would otherwise need multiple ASSPs. The flash-based fabric powers up functional within microseconds, eliminating configuration-time delays in machines that must resume after a fault cycle. In a typical topology, the FPGA sits between an MCU or host CPU and the I/O field, with the 310 MHz speed grade providing headroom for concurrent state machines. Unlike SRAM FPGAs, no external configuration flash is exposed on the board, reducing BOM count and configuration corruption risk in electrically noisy factory environments.
Recommended
Avionics and Secure Embedded Systems
The A3PE1500-2FGG676I is well suited to avionics and secure embedded systems because flash-based configuration cells are inherently immune to the single-event upset mechanisms that affect SRAM configuration cells, and the on-chip flash storage prevents bitstream extraction at power-up. Microchip's ProASIC3E datasheet explicitly targets the avionics market, and the industrial temperature grade supports harsh-environment platforms. With 1.5M gates, 444 I/Os, and the -2 speed grade, the device implements interface bridges, bus controllers, and health-monitoring logic in a single 676-ball FBGA. Instant-on behavior matters in avionics power-up sequences where configuration time from an external PROM would delay system readiness. Design teams should validate program-specific screening and qualification flows independently of the standard datasheet.
Recommended
Networking and Communications Line Cards
Networking and communications equipment benefits from the A3PE1500-2FGG676I's combination of 444 user I/Os, 38400 logic cells, and abundant embedded memory structures, which suit line-card glue logic, backplane interface bridging, and control-plane interconnect. The -2 speed grade's 310 MHz capability supports timing-critical parallel interfaces, while the flash fabric eliminates the boot sequence that SRAM FPGAs require on carrier cards that must enumerate quickly. In a typical deployment the FPGA sits between a network processor or MAC and the backplane connector, mapping wide buses and handling handshaking. Because configuration is nonvolatile and secure, design IP on deployed telecom hardware is protected against cloning. The single-chip solution reduces total cost of ownership per Microchip's positioning for the networking/communications market.
Recommended
ASIC Prototyping and Low-Volume ASIC Replacement
The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement solution, and the A3PE1500-2FGG676I is the 1.5M-gate point of that family. Design teams transitioning from a 130nm ASIC can map gate-netlist-style designs onto the VersaTile fabric, using the 444 I/Os to reproduce wide ASIC pin counts that smaller packages cannot accommodate. The flash programming technology allows unlimited reprogramming during prototyping without external programmers or JTAG-configured PROMs, shortening iteration cycles. For volumes too low to justify ASIC mask costs, the same PCB can ship with the FPGA in production. A design consideration is that timing closure in flash FPGAs differs from ASIC static timing; budgets must be re-validated in Microchip Libero SoC rather than carried over from the ASIC flow.
Recommended
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE1500-2FGG676I as a flexible timing, trigger, and interface engine. The 1.5 million gates and -2 speed grade implement pattern generators, capture FIFOs, and protocol-aware comparators, while 444 I/Os connect to per-channel circuitry that fixed-function ASSPs cannot serve economically. Instant-on configuration means an instrument is ready the moment power is applied - important for rack systems that cycle power between test runs. The industrial temperature grade suits uncooled rack environments, and the single-chip flash configuration removes the reliability concern of configuration PROM reads at each boot. Engineers should allocate the embedded SRAM blocks for capture buffers and use the fabric PLLs for clock conditioning, following Microchip ProASIC3E datasheet guidance on I/O banking across mixed-voltage interfaces.
Recommended
Medical Device Control Logic
Medical diagnostic and monitoring equipment benefits from the A3PE1500-2FGG676I's combination of secure flash configuration, instant-on startup, and dense flexible I/O. Patient-interface boards often need dozens of sensor, actuator, and isolation-barrier signals; 444 user I/Os allow one 676-ball FBGA to terminate those connections while implementing sequencing interlocks and data framing in the 1.5M-gate fabric. The nonvolatile configuration prevents accidental alteration of safety-relevant logic between power cycles, and the absence of an external bitstream limits attack surface on connected devices. Typical topology places the FPGA between analog front ends and a host processor, handling timing-critical control locally. Development teams should plan for the verification documentation medical regulators expect, using Microchip Libero SoC timing and simulation reports as evidence artifacts.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-2FGG676I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-1FG676I | A3PE1500-FGG676I | M1A3PE1500-1FG676I | M1AFS1500-2FGG676I | A3PE1500-2FG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA (FBGA) | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M (Fusion) | 1.5 M |
| User I/O | 444 | 444 | 444 | 444 | [DATA_NEEDED] | 444 |
| Speed Grade | -2 | -1 (slower) | Standard | -1 (slower) | -2 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V core (plus analog rails) | 1.5 V |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Configuration Technology | Flash (nonvolatile, single-chip) | Flash | Flash | Flash | Flash (Fusion, with analog) | Flash |
Key Differentiators
- Fastest stock speed grade in the A3PE1500 676-pin lineup (vs A3PE1500-1FG676I)
- Secure single-chip flash configuration (vs SRAM-based competitor FPGAs)
- Same-footprint growth path within Microchip portfolio (vs M1AFS1500-2FGG676I)
Design Notes
The ProASIC3E core operates from a 1.5 V rail; I/O banks use separate supply pins supporting multiple voltage standards. Provide a low-impedance 1.5 V plane with bulk capacitance near the package and 0.1 uF ceramic decoupling distributed across the 676-ball field. Estimated: even at modest core currents of a few hundred milliamps, IR drop across a poor plane can approach the 5% supply-tolerance budget, so verify with a power-integrity simulation before tape-out. Follow Microchip's ProASIC3E power-up sequencing and power calculation guidance in the datasheet.
A 676-ball FBGA at 1.0 mm ball pitch requires disciplined escape routing. Plan via-in-pad or dog-bone escapes, typically 4-6 signal layers minimum for a full fan-out of the interior ball rows. Assign power/ground ball pairs first, then group I/O by bank voltage before escape routing. Set the CAD ball map from the official Microchip ProASIC3E datasheet package chapter - third-party ball maps have been known to contain errors. Keep high-speed signals matched in length when they form parallel buses.
Do not assume bitstream portability across speed grades: while A3PE1500 -1 and -2 parts share the fabric, timing constraints must be re-verified with the -1 grade if you substitute A3PE1500-1FG676I. Also, the M1AFS1500-2FGG676I (Fusion) shares the 676 footprint but adds analog power pins and different supply requirements - swapping it into a ProASIC3E PCB without checking the power tree will cause misoperation. Confirm MSL handling and reflow profile for large FBGAs per JEDEC guidance before assembly.
Compliance Information
Compliance status not stated in the verified web data retrieved as of 2026-09-02. Confirm on the official Microchip product page for A3PE1500 or via Microchip's environmental compliance documentation before export-controlled or automotive program use.
