A3PE3000L-FGG484I - 3M-Gate ProASIC3L Flash FPGA | Microchip
Teilenummer: A3PE3000L-FGG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE3000L-FGG484I Übersicht
A flash FPGA is a programmable logic device whose routing and logic configuration data is stored in on-chip flash memory rather than volatile SRAM. This places ProASIC3L in the broader power-management-of-systems hierarchy as an instant-on, low-static-power fabric used where ASIC replacement, design security, and board-space savings matter.
Key features include a 1.2 V to 1.5 V core voltage with a 1.14 V to 1.575 V supply tolerance, dramatic dynamic power reduction via Flash*Freeze technology, up to 616 user I/Os across the family (341 on the 484-ball package), and 130-nm, 7-layer-metal (6 copper) flash-based CMOS process technology. The industrial temperature rating (-40 C to +100 C TJ) suits harsh-environment deployments.
Architecturally, the device uses the ProASIC3 VersaTile logic structure plus embedded true dual-port SRAM blocks, supporting DDR controllers, FIFOs, and soft CPU implementations. Flash switching elements draw negligible static current versus SRAM cells, and the Flash*Freeze mode freezes I/O state while cutting dynamic power for battery-sensitive designs.
Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military/aerospace subsystems, and communications line-card glue logic - all cases where instant-on operation, low static power, and single-chip configuration are decisive.
Design consideration: budget the 1.2 V/1.5 V core rail carefully and use Libero SoC to verify Flash*Freeze entry/exit timing; BGA routing on 1 mm pitch requires via-in-pad or dogbone fanout on at least 8-layer PCBs.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000L-FGG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000L-FGG484I (gleiche Bauform und Footprint) – abweichend in Package, Family, RoHS Status, Process Technology, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000L-FGG484
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-1FGG484I
✅ Drop-In✓ Auf Lager
$104.5 / Stück
Datenblatt ansehen →A3PE3000L-FG484I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG484M
✅ Drop-In✓ Auf Lager
$298 / Stück
Datenblatt ansehen →A3PE3000-FGG484
✅ Drop-In✓ Auf Lager
$152.6 / Stück
Datenblatt ansehen →A3PE3000L-FGG484I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells (CLBs) | 75264 |
| User I/Os (this package) | 341 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Voltage | 1.2 V to 1.5 V |
| Supply Voltage Range | 1.14 V to 1.575 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | Nonvolatile flash, Live-At-Power-Up (Level 0), single chip |
| Low Power Feature | Flash*Freeze technology |
| Betriebstemperatur | -40 C to +100 C (TJ), industrial (I) |
| Gehäuse | 484-FPBGA (23 x 23 mm, 1 mm pitch, FBGA-484) |
| Montageart | Surface Mount |
| Logic Family | CMOS |
| Packaging | Tray |
| RoHS-Status | RoHS3 Compliant |
A3PE3000L-FGG484I 484-fpbga (23 x 23 mm, 1 mm pitch, fbga-484) Pinbelegungsleitfaden
Pinbelegung für A3PE3000L-FGG484I (484-fpbga (23 x 23 mm, 1 mm pitch, fbga-484)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000L-FGG484I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000L-FGG484I ist geeignet für 6 Anwendungs: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Secure Military and Avionics Subsystems, Communications Line-Card Glue Logic, ASIC Prototyping and Replacement, Medical Diagnostic Equipment.
Industrial Automation and Control
In factory automation, PLC I/O modules, motor-control interfaces, and machine-vision timing controllers, the A3PE3000L-FGG484I fits because its 3 million gates and 75,264 logic cells absorb glue logic, encoders/decoders, and soft-CPU wrappers while 341 user I/Os interface sensors and actuators directly. Its industrial -40 C to +100 C (TJ) rating survives harsh cabinet environments, and the nonvolatile flash fabric configures instantly at power-up - critical for safety interlocks that must be live before an operator reset cycle. Placed as the system's I/O hub between a host CPU and field wiring, it adds no configuration-boot delay unlike SRAM FPGAs, and Flash*Freeze can cut dynamic power during idle production shifts, reducing cabinet thermal load.
Empfohlen
Battery-Powered Portable Instrumentation
Portable test instruments, handheld data loggers, and field measurement devices benefit directly from ProASIC3L's low static power and Flash*Freeze technology. The A3PE3000L-FGG484I's 1.2 V to 1.5 V core with 1.14 V to 1.575 V tolerance lets designers run the rail from a single-cell boost converter with wide droop, while flash switching elements draw negligible standby current versus SRAM-cell fabrics - extending sleep-battery life measurably. The 504 kbits of true dual-port SRAM buffers measurement data between the analog front end and the host MCU without external FIFO chips, cutting BOM count in space-constrained enclosures. When the instrument idles, Flash*Freeze freezes I/O and clock state, and the fabric resumes deterministically on wake, so no reconfiguration time is added to the measurement cycle.
Empfohlen
Secure Military and Avionics Subsystems
Defense and avionics subsystems - secure communications boards, sensor hub processors, and bus interface controllers - select the A3PE3000L-FGG484I (and its M-suffix sibling A3PE3000L-FGG484M) for single-chip security: the configuration bitstream lives in nonvolatile on-chip flash with no external PROM to read back or spoof, per the Microchip ProASIC3L datasheet. The instant-on Live-At-Power-Up behavior matters for power-cycling payloads on aircraft where boot sequencing is constrained. With 3M gates, designers implement ARINC/MIL-STD-style protocol engines and redundancy voting logic, while the 484-ball 23 x 23 mm FBGA provides abundant 341-I/O for parallel legacy buses. Designers should verify program-flow and anti-fuse/flash security whitepapers from Microchip against their certification requirements.
Empfohlen
Communications Line-Card Glue Logic
Networking line cards, backplane adapters, and telecom transport shelves use the A3PE3000L-FGG484I as high-pin-count glue logic between PHYs, framers, and the main processor. Its 341 user I/Os on the 484-ball FBGA handle wide parallel buses and multiple SPI/I2C/UART banks simultaneously, while 504 kbits of true dual-port SRAM implement rate-adaptation FIFOs crossing asynchronous clock domains. The flash fabric eliminates the configuration PROM that would otherwise occupy scarce line-card area and adds boot latency to hot-swap events - the FPGA is usable within the single-chip power-up sequence. Operating from a 1.5 V or 1.2 V core rail common on modern boards simplifies power-tree integration alongside DSPs and ASICs.
Empfohlen
ASIC Prototyping and Replacement
The ProASIC3 family is positioned by Microchip/Microsemi as a cost-effective ASIC replacement, and the A3PE3000L-FGG484I at 3 million system gates is the family's high-density point for this role. Engineers migrate retired ASICs, gate arrays, or obsolete ASSPs onto the fabric: 75,264 VersaTiles absorb legacy RTL, and 504 kbits of dual-port SRAM replace embedded RAM macros. Because the flash fabric is single-chip and instant-on, the replacement reproduces the original ASIC's power-up behavior without firmware changes to the host board - a common requirement when repairing legacy medical or industrial equipment. Non-recurring cost is limited to Libero SoC design work and the PCB footprint already matching 484-ball FGG packages used across the ProASIC3 family.
Empfohlen
Medical Diagnostic Equipment
Benchtop diagnostic analyzers, ultrasound front-end controllers, and patient-monitoring interface boards use the A3PE3000L-FGG484I where deterministic power-up and quiet, low-EMI operation matter. The flash FPGA produces no configuration readback traffic and no boot PROM switching activity, easing EMC design in sensitive analog front ends; its 1.2 V to 1.5 V core keeps internal supply noise low. With 341 I/Os it aggregates multiple sensor channels into timing-precise acquisition windows, and the embedded 504-kbit dual-port SRAM provides jitter-tolerant sample buffering. The industrial -40 C to +100 C rating covers cold-chain transport of equipment, while the single-chip configuration supports service-safe firmware updates managed by the host processor over JTAG.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000L-FGG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484I | A3PE3000-FGG484 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FPBGA (23 x 23 mm) | 484-FPBGA - same | 484-FPBGA - same | 484-FPBGA (FG, lead balls) | 484-FPBGA - same |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 |
| User I/Os | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | Standard |
| Flash*Freeze Low Power | Yes (ProASIC3L) | Yes | Yes | Yes | No (ProASIC3E) |
| RoHS / Green Balls | RoHS3 compliant (FGG) | Yes (FGG green) | Yes (FGG green) | No (FG lead balls) | Yes (FGG green) |
| Embedded SRAM | 504 kbits dual-port | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
Wichtigste Unterscheidungsmerkmale
- Flash*Freeze low-power mode (vs. A3PE3000-FGG484)
- Industrial temperature with RoHS green balls (vs. A3PE3000L-FG484I)
- Timing-closure headroom available at same footprint (vs. A3PE3000L-1FGG484I)
- Single-chip instant-on configuration (vs. SRAM FPGAs (Xilinx Artix-7 class))
Designhinweise
The 484-ball 1 mm-pitch FBGA requires controlled fanout: plan an 8-layer or greater stackup with via-in-pad or dogbone escapes, and dedicate internal layers to a solid ground plane under the die area for I/O return currents. Assign I/O banks in Libero SoC before routing so that each bank's VCCI voltage matches the connected interface standard - mixing 3.3 V and 1.8 V I/O on one bank is the most common re-spin cause on ProASIC3 boards. Follow the Microchip ProASIC3L datasheet ball-map for bank boundaries.
Supply the core at 1.2 V to 1.5 V (1.14 V to 1.575 V tolerance) and sequence VCCI banks per the datasheet power-up requirements. Estimated: static power scales with utilization, so run Microchip's SmartPower estimator on your final netlist rather than trusting worst-case family numbers. Flash*Freeze entry/exit requires the dedicated flashfreeze pin handshake - pull it through a controlled GPIO, never a raw pull-up, and verify wake latency in simulation if your system expects sub-millisecond resume.
Do not confuse ordering suffixes: FGG484I is green/lead-free, FG484I contains lead balls, and -1 changes only speed grade. Second, the FGG484 package exposes 341 user I/Os, not the family-maximum 616 - reserve larger ballout (FGG896) only if your I/O budget exceeds 341. Third, mature ProASIC3L stock carries an 8-week factory lead time (per Microchip USA); qualify at least one drop-in sibling (e.g., A3PE3000L-1FGG484I) in your AVL to avoid single-source allocation stalls.
Compliance-Informationen
RoHS3 Compliant per Microchip USA product page. REACH, halogen-free, and conflict-minerals status not stated in retrieved data - confirm via Microchip compliance portal.
